---
title: 'Advanced Packaging & Power Delivery Senior Engineer at Axelera AI'
canonical: 'https://feeny.ai/job/advanced-packaging-power-delivery-senior-engineer-axelera-ai-europe-0jqbdy2ytvqn'
type: 'job'
last_seen: '2026-09-12'
---

# Advanced Packaging & Power Delivery Senior Engineer at Axelera AI

- **Company:** Axelera AI
- **Location:** Europe
- **Employment:** full-time
- **Work type:** remote
- **Posted:** 2026-06-17
- **Last confirmed live:** 2026-09-12
- **Apply:** https://jobs.ashbyhq.com/axelera/b8d96401-e843-4a36-8a4d-57ebcbcc87cd/application

**Skills:** On-die power grid design, Package/PCB PDN analysis, 2.5D and 3D IC packaging technologies, Multi-chiplet integration, Interposer/substrate co-design, Industry-standard EDA tools for power integrity, PDN simulation, Package design, SI/PI verification and sign-off methodologies, Thermal modeling and co-simulation, AI accelerator or custom ASIC design flows, Collaboration with OSAT partners, substrate vendors, or research institutes, Advanced node custom and analog design practices

> Lead power-delivery design and advanced packaging architecture for next-generation AI accelerators. Own the full stack from on-die power grids to package and PCB PDN, ensuring signal and power integrity while collaborating with silicon engineering teams.

## Job description

## About Us

[Axelera AI](https://www.axelera.ai) is not your regular deep-tech company. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us. In just five years, we have raised a total of $370 million and have built a world-class team of 250+ employees (including 60+ PhDs with more than 40,000 citations), both remotely from 20 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands. We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million. Our unwavering commitment to innovation has firmly established us as a global industry pioneer. Are you up for the challenge?

Position Overview As a Senior Advanced Packaging & Power Delivery Engineer at Axelera AI, you will play a pivotal role in shaping the silicon and packaging architecture of our next-generation AI accelerators. You will own power-delivery design across the full stack - from on-die power grids to package and PCB PDN - and bring deep expertise in advanced packaging technologies to help us scale from today's products to tomorrow's multi-chiplet, 3D-integrated systems. Working within our R&D Custom Design team and collaborating closely with Silicon Engineering and AI Integrated Systems, you will be at the intersection of analog design, packaging innovation, and product delivery - with real ownership and direct impact on the chips we ship.

Key responsibilities:

- Own power-delivery design end to end, from on-die power grids to package and PCB PDN design and analysis.
- Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-design.
- Perform SI/PI verification and sign-off across the full stack, ensuring power integrity and signal integrity targets are met.
- Collaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirements.
- Support thermal and integration reviews for current and future products
- Develop and maintain power-delivery methodology, flows, and design guidelines within the Custom Design toolchain.
- Identify and mitigate single-point-of-failure risks in SI/PI workstreams; mentor and grow the team's packaging expertise.
- Engage with external partners, substrate/interposer vendors, and OSAT houses to co-develop advanced packaging solutions.

Qualifications: Required

- Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus.
- 7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environment.
- Demonstrated expertise in on-die power grid design and package/PCB PDN analysis.
- Hands-on experience with 2.5D and/or 3D IC packaging technologies, multi-chiplet integration, and interposer/substrate co-design.
- Proficiency with industry-standard EDA tools for power integrity, PDN simulation, and package design.
- Ability to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groups.
- Strong written and spoken English communication skills.

## Nice to Have

- Experience with SI/PI verification and sign-off methodologies.
- Familiarity with thermal modeling and co-simulation for integrated packages.
- Exposure to AI accelerator or custom ASIC design flows.
- Experience collaborating with OSAT partners, substrate vendors, or research institutes (e.g., imec).
- Knowledge of advanced node custom and analog design practices.

Location We offer a flexible working arrangement, with options to:

- Work from one of our Axelera AI offices (Leuven in Belgium, Amsterdam and Eindhoven in the Netherlands, Zurich in Switzerland, Florence and Milan in Italy or Bristol in the United Kingdom) if you're already based in the vicinity.
- Work fully remotely from any European country (incl. the UK) you are already in.
- Relocate with us and work from Italy (Florence or Milan) or the Netherlands (Amsterdam or Eindhoven).

Kindly note that priority will be given to candidates who are [interested in being] based in Belgium or Italy.

## What we offer

This is your chance to shape and be part of a dynamic, fast-growing, international organization. We offer an attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares. An open culture that supports creativity and continual innovation is awaiting you. Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team.

At Axelera AI, we wholeheartedly embrace equal opportunity and hold diversity in the highest regard. Our steadfast commitment is to cultivate a warm and inclusive environment that empowers and celebrates every member of our team. We welcome applicants from all backgrounds to join us in shaping the future of AI.

## About Axelera AI

## Company Overview
- **One-liner**: Axelera AI develops cutting-edge AI hardware and software platforms for accelerating inference at the edge, using proprietary digital in-memory computing technology.
- **Entity Type**: Private (Series C)
- **Headquarters**: Eindhoven, Netherlands
- **Founded**: 2021
- **Founders**: Not publicly listed on primary sources

## Core Business
- **Primary industry/industries**: AI Hardware (Semiconductors), Edge AI Inference, Computer Vision
- **Target customers**: B2B, Enterprise, and SMBs across industrial manufacturing, security & surveillance, retail, robotics, and healthcare
- **Mission or purpose statement**: "To lead the democratization of Artificial Intelligence, offering faster, easy-to-use AI acceleration while minimizing power and cost, to simplify AI at the Edge." [axelera.ai](https://axelera.ai/our-story)

## Products & Services
- **Metis® AIPU (AI Processing Unit)**: A family of edge inference accelerators starting at 214 TOPs, available in M.2 and PCIe form factors (1-AIPU and 4-AIPU cards). Delivers 15 TOPs/W energy efficiency. [axelera.ai](https://axelera.ai/)
- **Europa® AIPU**: A higher-performance AI accelerator (629 TOPs) for demanding edge and near-edge workloads, setting a new industry benchmark for performance, power efficiency, and affordability. [axelera.ai](https://axelera.ai/)
- **Titania® Chiplet**: A future chiplet designed to scale the D-IMC architecture from edge to cloud. [axelera.ai](https://axelera.ai/our-story)
- **Voyager® SDK**: A software development kit with 100+ pre-optimized models, enabling deployment from model to production in hours, not weeks. [axelera.ai](https://axelera.ai/)
- **Metis AI Platform**: Complete edge AI systems (M.2 and PCIe accelerator cards) bundling the Metis AIPU with the Voyager SDK for computer vision applications. [axelera.ai](https://axelera.ai/)

## Market Standing
- **Valuation/Market Cap**: Not disclosed
- **Total Funding**: Over $450 million in equity, grants, and venture debt since founding (July 2021). This includes a $250M+ Series C (the largest investment ever in an EU AI semiconductor company), led by Innovation Industries, with new investors BlackRock and SiteGround Capital. [axelera.ai](https://axelera.ai/our-story)
- **Key Metric**: Total funding of $468.21M (per CB Insights). [cbinsights.com](https://www.cbinsights.com/company/axelera-ai)
- **Notable Investors/Partners**: Innovation Industries, European Innovation Council Fund, Invest-NL, Samsung Catalyst Fund, Verve Ventures, CDP Venture Capital SGR, Bitfury, Federal Holding and Investment Company of Belgium (SFPIM), imec, BlackRock, SiteGround Capital. [axelera.ai](https://axelera.ai/our-story)
- **Growth Signals**: Ranked #3 in the Emerging Enterprise (201-999 Employees) category on Fast Company’s 2026 Most Innovative Companies list. Has taped out four chips since founding. Announced the Europa AIPU and Titania chiplet. Secured up to €61.6m from the EuroHPC DARE project. [axelera.ai](https://axelera.ai/our-story)

## Competitive Advantages
- **Proprietary Digital In-Memory Computing (D-IMC)**: Performs matrix-vector multiplications in-place, eliminating data movement and delivering 50+ TOPs per core at FP32-equivalent accuracy. [axelera.ai](https://axelera.ai/)
- **Industry-Leading Energy Efficiency**: 15 TOPs/W, enabling high-performance AI inference at the edge without power or thermal constraints. [axelera.ai](https://axelera.ai/)
- **Full-Stack Solution**: Combines purpose-built hardware (AIPUs) with the Voyager SDK (100+ models, post-training quantization) for rapid deployment, significantly reducing time-to-value compared to GPU-based alternatives. [axelera.ai](https://axelera.ai/)
- **Scalable Architecture**: D-IMC and RISC-V dataflow architecture scales from edge to cloud via the Titania chiplet roadmap. [axelera.ai](https://axelera.ai/our-story)

## Strategic Focus
- **Democratizing AI**: Making high-performance AI inference accessible, affordable, and energy-efficient for any environment (edge to cloud). [axelera.ai](https://axelera.ai/our-story)
- **Commercial Expansion**: Scaling global commercial growth following the $250M+ Series C, with a focus on building out sales and field application engineering teams in EMEA and the Americas. [axelera.ai](https://axelera.ai/careers)
- **Ecosystem & Partnerships**: Recently announced six new partnerships to expand the edge AI ecosystem. [axelera.ai](https://axelera.ai/)
- **Product Roadmap**: Scaling the D-IMC platform from edge (Metis) to near-edge (Europa) to cloud (Titania chiplet), targeting a full range of inference use cases. [axelera.ai](https://axelera.ai/our-story)

## Why Work Here
- **High-Growth Environment**: A well-funded deep-tech startup (over $450M raised) with rapid commercial traction, ranked #3 on Fast Company’s 2026 Most Innovative Companies list. [axelera.ai](https://axelera.ai/careers)
- **Global & Remote-First Culture**: 248+ talented colleagues from 34 nationalities across 18 locations, with a strong remote/hybrid work policy. [axelera.ai](https://axelera.ai/careers)
- **Cutting-Edge Technology**: Work on proprietary D-IMC and RISC-V dataflow architecture, with a roadmap spanning edge to cloud. The team includes 39 PhDs. [axelera.ai](https://axelera.ai/careers)
- **Benefits**: Remote/flexible work, premium insurance, commute benefit, team-building activities, premium pension, work-life balance, cutting-edge equipment, fresh fruit at the office, and modern facilities. [axelera.ai](https://axelera.ai/careers)
- **Values-Driven Culture**: Values include "Think," "Focus on the Customer," "Move Fast," "Communicate Openly," and "Agree & Commit." Emphasis on freedom with responsibility. [axelera.ai](https://axelera.ai/careers)
- **Diverse & International**: 34 nationalities, average age 50+, with offices in Belgium, France, Switzerland, Italy, the UK, and headquarters in Eindhoven. [axelera.ai](https://axelera.ai/careers)

## Sources
1. [axelera.ai](https://axelera.ai/)
2. [axelera.ai](https://axelera.ai/our-story)
3. [axelera.ai](https://axelera.ai/careers)
4. [cbinsights.com](https://www.cbinsights.com/company/axelera-ai)
5. [jobs.ashbyhq.com](https://jobs.ashbyhq.com/axelera)

## Other roles at Axelera AI

- [(Senior) Field Application Engineer - India](https://feeny.ai/job/senior-field-application-engineer-india-axelera-ai-india-tjpzd0600zy2) — India
- [UK Electronics Skills Foundation (UKESF)](https://feeny.ai/job/uk-electronics-skills-foundation-ukesf-axelera-ai-united-kingdom-g906h2fnn597) — United Kingdom
- [Finance Manager](https://feeny.ai/job/finance-manager-axelera-ai-eindhoven-evpadxr3z9rc) — Eindhoven, Netherlands
- [VP - People](https://feeny.ai/job/vp-people-axelera-ai-eindhoven-kptp5mp33abx) — Eindhoven, Netherlands
- [System Architect – Datacenter Hardware](https://feeny.ai/job/system-architect-datacenter-hardware-axelera-ai-europe-pw22t9mp517c) — Europe
- [Ecosystem Integration Engineer](https://feeny.ai/job/ecosystem-integration-engineer-axelera-ai-taiwan-8ymx2171c956) — Taiwan
- [Director - Silicon Product & Test Engineering](https://feeny.ai/job/director-silicon-product-test-engineering-axelera-ai-bristol-2c7eqa5c91zp) — Bristol, United Kingdom
- [Director - Hardware Engineering, AI Infrastructure Systems](https://feeny.ai/job/director-hardware-engineering-ai-infrastructure-systems-axelera-ai-europe-e4ab9s5wg45n) — Europe
- [Director - Silicon Logical Design](https://feeny.ai/job/director-silicon-logical-design-axelera-ai-europe-dd7rtejdxg8q) — Europe