---
title: 'Dielectric and Polymer Materials Engineer at Absolics Inc'
canonical: 'https://feeny.ai/job/dielectric-and-polymer-materials-engineer-absolics-inc-covington-8cvb0ervetam'
type: 'job'
last_seen: '2026-09-06'
---

# Dielectric and Polymer Materials Engineer at Absolics Inc

- **Company:** Absolics Inc
- **Location:** Covington, GA
- **Posted:** 2026-07-01
- **Last confirmed live:** 2026-09-06
- **Apply:** https://job-boards.greenhouse.io/absolicsinc/jobs/4303979009

## Job description

Job Title: R&D Engineer - Dielectric and Polymer Materials Expert for Advanced Packaging applications

Location: Covington, GA

Job Type: Full-Time

About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description:

You will lead efforts to evaluate, down select and integrate the various Advanced Packaging Organic and Polymeric materials critical to advanced packaging process flows, with responsibility spanning material selection, film deposition or lamination, patterning, and cure characterization. In addition, you will oversee evaluation of material performance with respect to reliability testing and collaborate with downstream assembly teams to understand incoming assembly. Requirements. This role requires both materials science depth and process integration awareness. You will evaluate both emerging and established dielectric systems and drive their optimization across electrical, mechanical, and reliability dimensions.

Key Responsibilities:

- Characterize dielectric film properties (electrical, thermal, mechanical) and correlate to process and reliability outcomes
- Select, qualify, and support process window definition of advanced packaging dielectrics (example ABF, PBO, PSPI, polyimide, inorganic films) for RDL build-up
- Support determination of optimal processing conditions for these materials across the various process teams critical to the overall fabrication process flow
- Evaluate emerging dielectric materials and technologies (e.g., low-Dk/Df, glass core compatible systems) for roadmap fit
- Develop and optimize cure, lamination, or photopatterning sequences for novel dielectric layers being tested
- Investigate and resolve adhesion, delamination, cracking, or CTE-mismatch failures through materials and process analysis
- Run reliability qualification testing (HAST, TCT) and interpret dielectric-driven failure mechanisms

Required Skills:

- Hands-on experience evaluating, processing and/or successful qualification of two or more advanced packaging dielectrics, example ABF, PBO, PSPI, PID, Solder resist or BCB
- Deep knowledge of dielectric patterning approaches: photoexposure, develop, and cure sequences for photosensitive materials; or lamination and laser drill for non-photosensitive films
- Extensive experience with film characterization: ellipsometry, FTIR, TGA/DSC, profilometry, nanoindentation
- Understanding of dielectric-to-metal adhesion, CTE mismatch, and stress management in multilayer stacks
- Experience with electrical characterization of dielectric films (Dk, Df, leakage, breakdown voltage)
- Ability to execute reliability testing per JEDEC standards (HAST, uHAST, TCT) and interpret failure mechanisms
- Fluent in English; proficiency in Korean is a plus.

## Preferred Skills

- Direct experience with glass core or glass interposer dielectric process integration
- Deep Familiarity with low-Dk/low-Df materials targeting high-frequency and AI/HPC applications
- Knowledge of plasma-enhanced CVD or PVD inorganic dielectrics for thin-film packaging
- Experience with CMP of dielectric films in damascene or hybrid bonding contexts
- Background in failure analysis of dielectric delamination, cracking, or via integrity (FIB-SEM, TEM, laminography)
- Familiarity with JEDEC and IPC qualification standards for substrate dielectrics
- Track record of material supplier engagement and collaborative efforts for material testing and qualification
- Publication record or patent activity in dielectric materials for packaging is a plus

Education

- Ph.D. in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or related field preferred
- M.S. with 3+ years of relevant industry or research experience considered

Benefits:

- 401K 6% matching (NO vesting period)
- Healthcare 100% support (Health, Dental, Vision)
- Life, STD, LTD 100 % support
- Cell phone allowance
- PTO and self-development

## SALARY:

- $90,000 – $150,000

## About Absolics Inc

## Company Overview
- **One-liner**: Absolics Inc. is the world's first glass substrate manufacturer, providing advanced packaging technologies and scalable solutions for high-performance computing (HPC) and AI semiconductor applications.
- **Entity Type**: Private (affiliate of SKC, part of SK Group)
- **Headquarters**: Covington, Georgia, United States
- **Founded**: 2021
- **Founders**: Not publicly available (company was established as an affiliate of SKC)

## Core Business
- **Primary industry**: Semiconductor Manufacturing / Advanced Packaging
- **Target customers**: B2B – HPC-related packaging companies, data centers, AI chip manufacturers, and high-tech industry leaders
- **Mission or purpose**: To create a new chapter in the history of the semiconductor industry by solving fundamental substrate limitations with glass-based solutions.

## Products & Services
- **Glass Substrate Solutions**: A proprietary glass substrate technology that significantly improves signaling characteristics and reduces power consumption compared to traditional silicon-based substrates. It enables fine patterns, large areas, and lower power consumption for advanced packaging. Type: Hardware / Semiconductor Material
- **Advanced Packaging Services**: Scalable packaging services for businesses involved in high-performance computing, leveraging glass substrate innovation. Type: Service / Manufacturing

## Market Standing
- **Valuation/Market Cap**: Not disclosed (Private company)
- **Key Metric**: Total Funding – **$175.0M** (from U.S. Department of Commerce grants, see below)
- **Notable Investors/Partners**:
    - **U.S. Department of Commerce** (two grants: $75M in May 2024, $100M in January 2025) [absolicsinc.com](https://www.absolicsinc.com/)
    - Parent: **SKC** (affiliate of **SK Group**, which includes SK Hynix, SK Siltron, and SK Materials)
- **Growth Signals**:
    - Headcount grew **48.8% YoY** (+40 people), now at **76 employees** [linkedin.com](https://www.linkedin.com/company/absolics-inc)
    - The advanced packaging market is expected to grow from $3.5B (2020) to $9.7B (2025); glass substrate segment forecast at $3.0B (2025) with 25% CAGR [absolicsinc.com](https://www.absolicsinc.com/)
    - Recent news: Absolics received $100M in U.S. R&D grants (2024-2025), building a computer chip factory in Georgia [eeNews Europe](https://www.eenewseurope.com/)
    - Active job postings: 9 positions (quarterly job posting growth: +800%) [linkedin.com](https://www.linkedin.com/company/absolics-inc)

## Competitive Advantages
- **First-mover in glass substrates**: Absolics is the world's first dedicated glass substrate manufacturer, positioning it at the forefront of a key advanced packaging innovation.
- **Deep SK Group ecosystem**: Backed by SKC and SK Group (SK Hynix, SK Siltron, SK Materials), providing strong supply chain integration, capital, and industry connections.
- **Significant U.S. government backing**: $175M in federal grants directly from the CHIPS Act, signaling strategic national importance and long-term stability.
- **Performance moat**: Glass substrates offer superior signaling, lower power consumption, and larger form factors – critical for AI and HPC chips where traditional silicon substrates are hitting physical limits.

## Strategic Focus
- **Scaling manufacturing**: Building a U.S. factory in Georgia to mass-produce glass substrates for the domestic semiconductor ecosystem.
- **R&D leadership**: Continued innovation in active/passive element integration on glass, targeting next-generation HPC and AI packaging needs.
- **Market capture**: Targeting the rapidly growing advanced packaging market ($9.7B by 2025), with glass substrates as a key growth driver.

## Why Work Here
- **Pioneering technology**: Join the first company in the world manufacturing glass substrates for semiconductors – a chance to work on cutting-edge tech that could reshape the industry.
- **Rapid growth**: Headcount grew ~49% YoY, indicating a scaling phase with ample career advancement opportunities.
- **Government-backed stability**: $175M in federal grants provides strong financial footing and long-term project security.
- **Office policy**: On-site work at the Covington, Georgia headquarters [builtin.com](https://builtin.com/company/absolics-inc) – collaborative environment in a new, state-of-the-art facility.
- **Engineering-heavy culture**: 25% of staff in technical roles, 13% in operations, and active hiring for engineers (NPI Process Engineer, Photoresist Engineering Manager, etc.) [linkedin.com](https://www.linkedin.com/company/absolics-inc)
- **Global exposure**: While HQ is in Georgia, the company has presence in South Korea and Mexico, offering cross-cultural collaboration.

## Sources
1. [absolicsinc.com](https://www.absolicsinc.com/)
2. [absolicsinc.com/about](https://www.absolicsinc.com/about)
3. [absolicsinc.com/job](https://www.absolicsinc.com/job)
4. [linkedin.com/company/absolics-inc](https://www.linkedin.com/company/absolics-inc)
5. [builtin.com/company/absolics-inc](https://builtin.com/company/absolics-inc)

## Other roles at Absolics Inc

- [NPI Process Engineer](https://feeny.ai/job/npi-process-engineer-absolics-inc-covington-jkq6p72aaydt) — Covington, GA
- [Photo Process Engineer](https://feeny.ai/job/photo-process-engineer-absolics-inc-covington-srew40vkj6vn) — Covington, GA
- [Plasma Dry Etch Engineer](https://feeny.ai/job/plasma-dry-etch-engineer-absolics-inc-covington-v9grp6t1h22j) — Covington, GA
- [Process Integration Engineer](https://feeny.ai/job/process-integration-engineer-absolics-inc-covington-g5d4df4fjwn8) — Covington, GA
- [Dry / Lami Process Engineer](https://feeny.ai/job/dry-lami-process-engineer-absolics-inc-covington-523p18t5byp7) — Covington, GA
- [Engineering Technician](https://feeny.ai/job/engineering-technician-absolics-inc-covington-wajqqpf8w37a) — Covington, GA
- [IT & Security MIS Manager](https://feeny.ai/job/it-security-mis-manager-absolics-inc-covington-jh9hbsnx6mtk) — Covington, GA
- [SPC Data Control Engineer](https://feeny.ai/job/spc-data-control-engineer-absolics-inc-covington-xav4c3swzry8) — Covington, GA
- [Plating Process Engineer](https://feeny.ai/job/plating-process-engineer-absolics-inc-covington-kzknyzhn0anr) — Covington, GA
- [Laser / Inspection Process Engineer](https://feeny.ai/job/laser-inspection-process-engineer-absolics-inc-covington-r0w8nxjkgzr0) — Covington, GA