--- title: 'DV - Principal Digital Verification Engineer at Eliyan' canonical: 'https://feeny.ai/job/dv-principal-digital-verification-engineer-eliyan-vancouver-bc-or-bay-area-jttvf7k0jdc6' type: 'job' last_seen: '2026-09-07' --- # DV - Principal Digital Verification Engineer at Eliyan - **Company:** Eliyan - **Location:** Vancouver Bc OR Bay Area, CA - **Employment:** full-time - **Work type:** onsite - **Posted:** 2026-04-27 - **Last confirmed live:** 2026-09-07 - **Apply:** https://jobs.lever.co/eliyan/5d02e30e-884f-4367-8805-1d7537bcdbdb ## Job description Join the leading chiplet startup!  As an Eliyan Principal Digital Verification Engineer, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet based systems with best-in-class power, area, manufacturability, and design flexibility.  You will be a key technical leader in developing state-of-the-art testbenches and unit/chip level test cases for best-in-class PHYs and Controllers. You will lead verification methodologies for Eliyan products.  You will work with a cross-functional team of experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products.  We offer a fun work environment with excellent benefits. Key Responsibilities: - Provide technical verification leadership to Eliyan products and provide guidance to junior engineers. - Develop and execute verification plans for connectivity IPs and Chiplets . - Create and maintain SystemVerilog/UVM-based verification environments . - Write and debug SystemVerilog/UVM compliant test cases for block and chip level. - Maintain a regression environment for enabling design CI/CD pipelines. - Collaborate with design engineers to ensure design quality with continuous micro-architecture, test-plan, and coverage reviews. - Develop, maintain, and track various test plan items and progress towards RTL freeze. - Stay up to date with industry trends, emerging technologies and progress in standards’ bodies. - Ensure IP compliance with industry standard protocols. - Integration of 3rd party VIPs and coordinate feature/bug tracking requests. - Perform in the capacity of a technical leader for junior verification engineers. - Create, improve, maintain DPI based FW simulation environments. - Create, improve, maintain gate level simulation environments for functional and power simulations. - Drive state of art verification methodologies for silicon verification including constrained based random verification, coverage driven verification. - Create microcontroller sub system testbenches and verification plan. - Own end-to-end verification for the company products. - Automation of verification flows including automated regression flow Qualifications: - BS in Electrical Engineering and related fields with 15+ years of experience - Strong expertise in UVM, test environment and assertion coding with SystemVerilog - Strong expertise on coverage driven verification - Proficiency in 3rd party tools for regression management and coverage analysis - Experience working on connectivity interfaces and protocols. - Knowledge of IO interface is a plus - Strong bias for innovations across all aspects of digital verification including automation of mundane activities and methods for quality improvement - Experience in verifying 3rd party mixed signal IPs as well as integration of VIPs - Proven track record of being part of a start-up like environment - Strong debugging skills - Strong understanding of microcontroller architecture and related peripheral talking to microcontrollers - Hands on experience with one of the scripting languages ## About Eliyan ## Company Overview - **One-liner**: Eliyan develops high-bandwidth, low-power chiplet interconnect technology (NuLink) that solves data bottlenecks in AI and data center chips. - **Entity Type**: Private (Series C-II) - **Headquarters**: Santa Clara, California, United States - **Founded**: 2021 - **Founders**: Ramin Farjadrad (CEO), Syrus Ziai (VP Engineering), Patrick Soheili (Chief Strategy & Business Officer) ## Core Business - Primary industry: Semiconductor Manufacturing (chiplet interconnect IP and PHY silicon) - Target customers: B2B – companies building custom AI chips (hyperscalers, chip designers, networking firms) - Mission: “Revolutionize chiplet connectivity technologies by challenging the status quo to unleash the ultimate performance of smart systems of the future.” ## Products & Services - **[NuLink™ D2D PHY](https://eliyan.com/about/)**: Die-to-die interconnect PHY supporting industry standards (BoW and UCIe) and proprietary simultaneous-bidirectional (SBD) technology. Delivers 4× the bandwidth and 2× the power efficiency of alternatives in advanced or standard packaging, with bump pitches from 40–130 microns. - **[NuLink™-XD](https://linkedin.com/company/eliyan-corporation)**: A new class of power-reach configurable 224G PAM4 SerDes for chip-to-chip and chip-to-module applications, targeting the lowest-power electro-optical modules for AI scale-up networks. Up to 40% lower power than competing solutions. ## Market Standing - **Valuation**: $1 billion (as of July 2026 Series C) - **Annual Revenue**: $3.5 million (2025); forecasts hundreds of millions by end of 2027 [reuters.com](https://www.cbinsights.com/company/eliyan) - **Total Funding**: $295 million (conflicting reports: other sources state $150M total); includes $145M Series C led by Seligman Ventures (July 2026), $60M Series B led by Samsung Catalyst Fund and Tiger Global (March 2024), $40M Series A led by Tracker Capital (Nov 2022). - **Notable Investors/Partners**: Seligman Ventures (board seat for Umesh Padval), Cisco Systems, Lumentum, Samsung Catalyst Fund, Tiger Global Management, Tracker Capital, VentureTech Alliance. - **Growth Signals**: Headcount of 73 employees with +6.7% monthly growth; 21 active job postings (quarterly trend +2,000%); expects to start chiplet shipments in 2026; expanding across 6 countries (US, Germany, Netherlands, Canada, India, Israel). ## Competitive Advantages - Breakthrough die-to-die interconnect architecture (invented by founder Ramin Farjadrad in 2016) that achieves 4× bandwidth and 2× power efficiency versus competing IP. - Works with standard packaging (wide range of bump pitches), reducing cost and complexity for chip designers. - Independent alternative to Broadcom/Marvell in the chiplet interconnect space, giving custom AI chip makers a neutral, high-performance option. ## Strategic Focus - Solving the growing data-movement bottleneck in AI compute (GPUs often idle 30–40% waiting for data). - Scaling NuLink and NuLink-XD platforms to support both chip-to-chip and chip-to-module applications for next-generation AI infrastructure. - Ramping chiplet production and licensing revenue, targeting hundreds of millions in sales by 2027. ## Why Work Here - On-site culture with offices in Santa Clara (HQ), Vancouver (BC), and other global locations; no remote/hybrid mentioned. - Engineering-heavy team (54% technical roles) with a fast-paced startup environment and deep expertise from companies like Marvell, Intel, AMD, and Synopsys. - Opportunity to work on cutting-edge semiconductor interconnect technology that directly impacts AI performance. - Active hiring across digital design, verification, DFT, physical design, optical engineering, and program management. ## Sources 1. [eliyan.com/about](https://eliyan.com/about/) 2. [jobs.lever.co/eliyan](https://jobs.lever.co/eliyan) 3. [linkedin.com/company/eliyan-corporation](https://linkedin.com/company/eliyan-corporation) 4. [cbinsights.com/company/eliyan](https://www.cbinsights.com/company/eliyan) 5. [reuters.com (via CNA)](https://www.cbinsights.com/company/eliyan) (Note: embedded Reuters article on CB Insights page) 6. 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