---
title: 'Engineer, Firmware at Lumotive'
canonical: 'https://feeny.ai/job/engineer-firmware-lumotive-milpitas-j1sty04ay3nh'
type: 'job'
last_seen: '2026-09-07'
---

# Engineer, Firmware at Lumotive

- **Company:** Lumotive
- **Location:** Milpitas, CA
- **Compensation:** $90k–$115k
- **Employment:** full-time
- **Work type:** onsite
- **Posted:** 2026-05-22
- **Last confirmed live:** 2026-09-07
- **Apply:** https://jobs.lever.co/lumotive/869becb2-aeb0-47fd-8fcf-576003d9a012

## Job description

Lumotive is pioneering the era of programmable optics—where light is controlled as intelligently and flexibly as software.

At the heart of this transformation is a once-in-a-generation innovation: a flat CMOS-based “general purpose optic.” Lumotive’s Light Control Metasurface (LCM™) beam forming chips can be programmed to function as a beam steering mirror, a lens, mirror, a beam splitter—or any optical function—replacing bulky and mechanical optical components with a fully digital, reconfigurable semiconductor . This breakthrough lays the foundation for a massive shift in multiple technologies—from 3D sensing and imaging to optical networking, free space optical communication, and beyond. Like the shift from analog to digital in electronics, programmable optics will reshape industries from robotics, self-driving cars, AI, defense, and healthcare.

Lumotive’s first commercial application is in LiDAR, where its software-defined beam steering chips are already enabling compact, high-performance, solid-state sensors. These sensors are being deployed today in smart infrastructure, robotics, and mobility systems through leading module makers and solution integrators.

With more than 200 patents and growing commercial traction, Lumotive is delivering the world’s first digital platform for light—and redefining what’s possible in the optical age.

Job Description: Join our firmware team to develop and support embedded software for next-generation Mixed signal ASIC/SoC for Optical circuit switching platform. This role is ideal for recent graduates or engineers with up to one year of experience who want hands-on exposure to embedded systems, firmware development, RTOS environments, and hardware bring-up. You will work closely with experienced engineers across hardware, software, and system teams to develop production-quality firmware and gain practical experience with embedded platforms.

Responsibilities:

- Develop and maintain embedded firmware modules for processor-based systems and ASIC/SoC platforms.
- Assist in implementation, integration, and debugging of firmware features under guidance from senior engineers.
- Support development and validation of drivers and interfaces for embedded peripherals such as I²C, SPI, UART, GPIO, DMA, and related hardware modules.
- Participate in RTOS-based firmware development activities including task creation, scheduling, and debugging.
- Support board bring-up activities and system-level integration and validation.
- Collaborate with hardware and software teams to integrate firmware components into the overall system architecture.
- Assist in debugging firmware and hardware interaction issues.
- Write unit tests and participate in system-level testing and validation activities.
- Use debugging and lab tools such as JTAG, oscilloscopes, logic analyzers, and related tools for troubleshooting.
- Participate in code reviews and follow software development best practices.
- Document firmware designs, implementation details, and test results.
- Work closely with cross-functional teams including ASIC, hardware, software, and systems engineering teams.

Qualifications:

- Bachelor’s, Master’s, or PhD degree in Computer Science, Computer Engineering, Electrical Engineering, or related field.
- 0–1 year of experience in embedded systems or firmware development (internships, research work, and academic projects are acceptable).
- Basic understanding of C/C++ programming for embedded systems.
- Understanding of computer architecture concepts including memory systems, interrupts, and processor fundamentals.
- Basic understanding of embedded systems and microcontroller-based design.
- Familiarity with communication protocols such as I²C, SPI, UART, GPIO, Ethernet or similar interfaces.
- Familiarity with software development tools and version control systems such as Git.
- Strong problem-solving and analytical skills.
- Good written and verbal communication skills.
- Ability to learn quickly and work effectively in a collaborative team environment.
- Internship, academic research, or project experience in embedded systems or firmware development.
- Exposure in IC design, processor design or optical system design.
- Exposure to RTOS environments such as FreeRTOS, Zephyr, ThreadX, or similar systems.
- Basic scripting experience with Python or similar programming languages.
- Familiarity with Linux-based development environments.
- Exposure to debugging tools such as oscilloscopes, logic analyzers, or JTAG-based debugging.
- Understanding of software testing concepts including unit testing and debugging methodologies.
- Familiarity with embedded software development workflows and build systems.

Benefits include but not limited to:

Health, dental and vision

## FSA, HSA

PTO plus 14 paid company holidays 401K with 3% contribution Stock Options Life insurance and disability

## About Lumotive

## Company Overview
- **One-liner**: Lumotive develops programmable optical semiconductors using its patented Light Control Metasurface (LCM) technology to enable solid-state beam steering for lidar, optical switching, and communications.
- **Entity Type**: Private (Privately Held; $131M total funding, most recent Series B in 2025)
- **Headquarters**: Redmond, Washington, United States
- **Founded**: 2017
- **Founders**: Gleb Akselrod (CTO and Founder)

## Core Business
- **Primary industry**: Semiconductor Manufacturing / Programmable Optics
- **Target customers**: B2B – lidar module makers, robotics integrators, automotive ADAS suppliers, defense contractors, AI hyperscaler data centers, and optical network operators.
- **Mission or purpose**: “Delivering the world’s first digital platform for light — and redefining what’s possible in the optical age.”

## Products & Services
- **Light Control Metasurface (LCM) Beamforming Chip**: A software‑defined, flat CMOS‑based “general purpose optic” that can be programmed to steer, split, or focus light without moving parts. Used in solid‑state lidar for 3D sensing, optical circuit switching for AI data centers, and free‑space optical communications.
- **LCM‑Enabled 3D Sensing Solutions**: High‑performance, compact solid‑state lidar sensors deployed in smart infrastructure, robotics, and mobility systems through module makers and integrators.

## Market Standing
- **Valuation/Market Cap**: Not publicly disclosed
- **Key Metric**: Total funding of $131M; annual revenue estimated at $2.5M (based on headcount‑to‑revenue proxy)
- **Notable Investors/Partners**: Series B (Feb 2025) included 11 investors; earlier rounds involved corporate and venture investors (names not publicly listed). Partners include leading module makers and solution integrators in lidar and optical networking.
- **Growth Signals**: 66 employees (+28.6% YoY); 12 active job postings (+20% monthly, +300% quarterly); recent $45M Series B (Feb 2025) and $14M follow‑on (July 2025); expanding into AI data center optical switching; offices in Redmond (HQ), Vancouver, Palo Alto, Bellevue, and employees across 5 countries.

## Competitive Advantages
- **Proprietary LCM technology** with 160+ patents, enabling digital, reconfigurable optics without mechanical parts.
- **Once‑in‑a‑generation innovation**: a flat CMOS‑based “general purpose optic” that replaces bulky mechanical optical components, analogous to the shift from analog to digital in electronics.
- **Broad application range** (lidar, optical switching, communications) reduces single‑market risk and opens multiple high‑growth verticals.

## Strategic Focus
- Scaling production and operations to meet demand from AI data centers (optical circuit switching), autonomous robotics, and automotive ADAS.
- Hiring a Vice President of Operations to drive excellence across fabrication, assembly, test, quality, supply chain, and logistics.
- Continuing to advance LCM chip performance and integration for next‑gen 3D sensing and high‑speed communications.

## Why Work Here
- **Culture**: “Intense intellectual environment” with high ownership, visibility, and responsibility; described as “no place to hide” but rewarding for top performers. Values: Always Innovate, Seek Excellence, Focus on Customers.
- **Work model**: Hybrid/office presence expected (offices in Redmond, Vancouver, Palo Alto, Bellevue); remote flexibility not explicitly stated.
- **Team**: 57% technical staff; collaboration with “ridiculously smart people” from Amazon, Microsoft, Apple, Meta, and other top tech firms.
- **Growth**: Rapidly scaling company with recent funding and expanding headcount; opportunity to shape a breakthrough technology category.

## Sources
1. [lumotive.com](https://lumotive.com/)
2. [lumotive.com/about](https://lumotive.com/about/)
3. [lumotive.com/culture](https://lumotive.com/culture/)
4. [linkedin.com/company/lumotive](https://www.linkedin.com/company/lumotive)
5. [jobs.lever.co/lumotive](https://jobs.lever.co/lumotive)

## Other roles at Lumotive

- [Senior Engineer, Optical Systems Engineer](https://feeny.ai/job/senior-engineer-optical-systems-engineer-lumotive-redmond-ryjh5ns3w1qz) — Redmond, WA
- [Member of Technical Staff, Reliability Engineer](https://feeny.ai/job/member-of-technical-staff-reliability-engineer-lumotive-redmond-zyxs2ybygpkv) — Redmond, WA
- [Talent Acquisition/Human Resources Specialist](https://feeny.ai/job/talent-acquisition-human-resources-specialist-lumotive-milpitas-jar8fnp25k9c) — Milpitas, CA
- [Vice President, Operations](https://feeny.ai/job/vice-president-operations-lumotive-milpitas-4swccvk3gem5) — Milpitas, CA
- [Member of Technical Staff, Hardware Reliability Engineer](https://feeny.ai/job/member-of-technical-staff-hardware-reliability-engineer-lumotive-redmond-f6aqwn4qxk9k) — Redmond, WA
- [Principal Member of Technical Staff, LCM Advanced Packaging & Manufacturing Engineer](https://feeny.ai/job/principal-member-of-technical-staff-lcm-advanced-packaging-manufacturing-bd2h04sse05g) — Taipei, Taiwan
- [Senior Member of Technical Staff,  Firmware Engineer (SoC/RTOS)](https://feeny.ai/job/senior-member-of-technical-staff-firmware-engineer-soc-rtos-lumotive-milpitas-84f1pak5cw9w) — Milpitas, CA