--- title: 'Hardware Test Engineer at DensityAI' canonical: 'https://feeny.ai/job/hardware-test-engineer-densityai-mountain-view-25we8scyn586' type: 'job' last_seen: '2026-11-07' --- # Hardware Test Engineer at DensityAI - **Company:** DensityAI - **Location:** Mountain View, CA - **Compensation:** $145k–$220k - **Posted:** 2026-06-18 - **Last confirmed live:** 2026-11-07 - **Apply:** https://job-boards.greenhouse.io/densityai/jobs/4289365009 ## Job description About the role: Own the test that proves our AI accelerator hardware works — from the packaged units, to the boards they sit on, to the systems they ship in. You'll develop the test setups, test hardware, and coverage/yield/throughput that let us catch problems early and ship at volume. You'll sit at the seam between silicon/packaging and the systems our accelerators run in, and own the test strategy that spans package level, board level, and — increasingly — full system level. ## What you'll do - Develop and run package-level test — socket-based bring-up and validation of packaged units: power-up, interface/interconnect continuity, and functional/parametric checks against spec (board↔package interface, not ATE silicon device test) - Develop and run board-level test — functional, structural (boundary scan/JTAG), in-circuit, and bring-up validation for accelerator boards and system hardware - Build out system-level test — bring up and validate assembled accelerator systems against spec, including functional, stress, and burn-in flows - Design and validate test hardware and fixtures — sockets, connectors, load boards, and board/system fixtures for high-speed and high-current test - Drive test coverage, yield analysis, and test-time/cost reduction across the product lifecycle - Lead new-product test bring-up; resolve test escapes, yield excursions, and hardware failures with data-driven root cause - Run characterization and correlation across levels — package ↔ board ↔ system, and bench ↔ production test - Define test specs, limits, and guardbands with design, product, packaging, and reliability engineering - Transfer and sustain test programs at OSAT/CM and manufacturing partners through ramp to high volume - Use and develop AI-assisted tool flows to accelerate test development, debug, and yield analysis ## What we're looking for - BS/MS in Electrical/Computer Engineering or equivalent plus 5+ years in package/board/system-level hardware test engineering - Hands-on test experience across at least two of package-level, board-level, and system-level test — with the ability to own the others - Package and board test hardware experience (sockets, connectors, load boards, fixtures) and the signal/power integrity that comes with high-speed, high-current test - Lab bring-up and debug skills: oscilloscopes, logic and protocol analyzers, power and thermal instrumentation - Data analysis and statistical skills for yield, characterization, and correlation work - (Optional) High-speed I/O / SerDes, DDR/HBM, RF, or high-current/power-device test; structural test (boundary scan); scripting/automation (Python, C++); system burn-in and reliability test; OSAT/CM partner management ## Compensation Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO. Visa Sponsorship DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status. Export Controls Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview. ## Equal Opportunity DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request. Full compensation packages are based on candidate experience and relevant certifications. California pay range $145,000—$220,000 USD ## Compensation Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO. Visa Sponsorship DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status. Export Controls Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview. ## Equal Opportunity DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request. ## About DensityAI ## Company Overview - **One-liner**: DensityAI is building a new generation of AI accelerators around a novel memory architecture, designed specifically for frontier-scale LLM inference, integrating silicon, packaging, kernels, and serving into a single optimized system. - **Entity Type**: Private (Seed Stage) - **Headquarters**: Mountain View, California, United States - **Founded**: 2024 - **Founders**: Srikanth Arekapudi (Co-Founder), Bill Chang (Co-Founder, President, CTO) ## Core Business - **Primary industry/industries**: AI Hardware (AI Accelerators / Semiconductors), Artificial Intelligence Inference Infrastructure - **Target customers**: B2B / Enterprise — specifically companies deploying frontier-scale large language models (LLMs) that require high-bandwidth, high-capacity inference compute. - **Mission or purpose statement**: Building the world’s fastest inference solution for frontier models, solving the memory wall problem through novel memory placement rather than traditional architecture workarounds. ## Products & Services - **DensityAI Accelerator (Platform)**: A full-stack AI inference solution — from silicon die and packaging (tiled multi-die architecture) to system rack and software kernel stack. Designed to bridge the gap between HBM-based GPUs (high capacity, low bandwidth utilization) and SRAM-based meshes (high bandwidth, low capacity). The company claims target compute utilization of ≥90% for production LLM workloads. ## Market Standing - **Valuation/Market Cap**: Not publicly available (stealth stage) - **Key Metric**: Total Funding — At least one Seed Round completed (Sep 2025) and earlier Seed Round (Sep 2024). Specific amounts not disclosed; operates in stealth mode. - **Notable Investors/Partners**: Dolby Family Ventures, Firestreak Ventures, imec.xpand, NextGen Venture Partners, South Park Commons (6 total investors per PitchBook) - **Growth Signals**: Headcount grew +450% monthly (from small base to ~9 employees); team includes alumni from Tesla, Google, Toyota North America, and multiple stealth AI startups; 2 active job postings as of mid-2025; founding team has prior experience shipping supercomputing clusters and designing silicon for the world’s largest production inference engines. ## Competitive Advantages - **Novel memory architecture**: Integrates memory directly into the compute stack, avoiding the “disaggregation penalty” of traditional GPU designs — no signals bouncing across substrates, eliminating unnecessary bottlenecks. - **Full-stack co-design**: Silicon, packaging, kernels, and serving are all designed together as one system, enabling tight integration from compute organization to software architecture. - **Performance target**: Aims to beat GPUs on both energy and speed for large-model, long-context workloads, and beat SRAM-based designs on model size and reliability — addressing a clear gap in the current market. ## Strategic Focus - **Current priorities**: Scaling the engineering team (open roles: Compiler Engineer, Physical Design Engineer, Senior Design Verification Engineer, Site Reliability Engineer, Corporate Finance Manager, IT Support Engineer); transitioning from stealth to production-ready hardware; proving the full-stack architecture at rack scale. - **Direction for growth**: Continue refining tile-based multi-die packaging, building out the software/kernel stack, and preparing for broader deployment and customer acquisition in the frontier AI inference market. ## Why Work Here - **Culture highlights**: A deep-tech, hard-engineering culture focused on a fundamental challenge in AI hardware — the memory wall. The team is intentionally small and elite (~9 people), with a high bar for talent. The founders emphasize “building with us” and a collaborative approach across the full stack. - **Remote/hybrid/office policy**: The company has offices in Mountain View, CA (HQ) and South Korea. Roles appear to require on-site or hybrid presence given the hardware-focused nature of the work. - **Notable perks or engineering culture**: Opportunity to work on cutting-edge AI silicon from concept to rack; direct exposure to all layers of the stack; team composition includes veterans from Tesla, Google, and major production inference engine builds; fast-moving startup environment with significant autonomy and impact. ## Sources 1. [densityai.com](https://www.densityai.com/) — Company website 2. [linkedin.com/company/densityai](https://www.linkedin.com/company/densityai) — LinkedIn company page 3. [pitchbook.com/profiles/company/820064-17](https://pitchbook.com/profiles/company/820064-17) — PitchBook profile (funding, investors, overview) 4. [theorg.com/org/densityai](https://theorg.com/org/densityai) — The Org company profile 5. [densityai.com/join/](https://www.densityai.com/join/) — Careers page ## Other roles at DensityAI - [Associate General Counsel, Corporate](https://feeny.ai/job/associate-general-counsel-corporate-densityai-mountain-view-19355ppzfx03) — Mountain View, CA - [Associate General Counsel, Commercial](https://feeny.ai/job/associate-general-counsel-commercial-densityai-mountain-view-a01847rm4mw5) — Mountain View, CA - [Silicon Validation Engineer](https://feeny.ai/job/silicon-validation-engineer-densityai-mountain-view-j0mk82zn76jp) — Mountain View, CA - [Systems Integration & Validation Engineer](https://feeny.ai/job/systems-integration-validation-engineer-densityai-mountain-view-e6hnsjzjehrg) — Mountain View, CA - [Commercial Contracts Manager](https://feeny.ai/job/commercial-contracts-manager-densityai-palo-alto-m3datk8bdn8z) — Palo Alto, CA - [PCB Quality Engineer](https://feeny.ai/job/pcb-quality-engineer-densityai-mountain-view-hse3e2rn3n8r) — Mountain View, CA - [Accounting Manager](https://feeny.ai/job/accounting-manager-densityai-mountain-view-bjpzmb69431w) — Mountain View, CA - [Mechanical Engineer, Systems](https://feeny.ai/job/mechanical-engineer-systems-densityai-mountain-view-d2y2wm1ks9gb) — Mountain View, CA - [Thermal Engineer](https://feeny.ai/job/thermal-engineer-densityai-mountain-view-gby3yn41gyxz) — Mountain View, CA - [PCB Layout Engineer](https://feeny.ai/job/pcb-layout-engineer-densityai-mountain-view-y8hzbqrkdhya) — Mountain View, CA