--- title: 'Head of Customer Programs at Baya Systems' canonical: 'https://feeny.ai/job/head-of-customer-programs-baya-systems-santa-clara-california-16janhm15ctt' type: 'job' last_seen: '2026-09-11' --- # Head of Customer Programs at Baya Systems - **Company:** Baya Systems - **Location:** Santa Clara California, United States - **Posted:** 2026-03-25 - **Last confirmed live:** 2026-09-11 - **Apply:** https://job-boards.greenhouse.io/bayasystems/jobs/5141474008 ## Job description Baya Systems is inspired by the [baya bird](https://bayasystems.com/about/), also known as the [weaver](https://bayasystems.com/about/). Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient. Baya is a fast-moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era.  We focus on software-driven, unified fabric solutions for single-die and multi-die systems. We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System-on-Chip (SoC) and multi-chiplet systems. This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, Automotive, and Edge IoT markets. We are looking for energetic and dedicated individuals share our passion for enabling innovation and excellence in the semiconductor industry that empowers game-changing products and services! Job Title: Head of Customer Programs Location: Santa Clara, CA (On-site/Hybrid) Reports To: CEO ## Role Summary The Head Customer Programs is the primary operational interface between the company and its key accounts. Reporting directly to the CEO, you will ensure the seamless execution of intellectual property (IP) programs from pre-sales engagement through silicon success. Your mission is to drive total customer satisfaction by holding cross-functional teams—Engineering, Sales, and Support—accountable for on-time delivery and technical excellence. ## Key Responsibilities Primary Customer Interface: Serve as the central point of contact for IP programs, managing complex schedules, milestones, and deliverables. Operational Accountability: Lead recurring tracking meetings and hold functional engineering leaders accountable for hitting project milestones and resolving technical blockers. Execution & Integration: Define and execute strategy for integrating Silicon IP into customer environments, overseeing the journey from proof-of-concept to production launch. Risk & Escalation Management: Proactively identify project risks, develop mitigation plans, and manage high-level customer escalations to maintain strong relationships. Performance Reporting: Deliver regular progress reports, dashboards, and KPI scorecards to the CEO and senior leadership regarding customer health and program status. Strategic Alignment: Partner with Sales to support contract closures (SoWs) and collaborate with Marketing to translate customer feedback into product roadmap improvements. ## Qualifications Experience: 7–10+ years in Technical Program Management within the semiconductor or IP licensing industry. Technical Expertise: Strong background in analog/digital SoC design flows, IP integration, and working with advanced process nodes (e.g., TSMC, Intel Foundry). Leadership: Proven ability to lead multidisciplinary teams through influence in a fast-paced, matrixed environment. Education: Bachelor’s degree in Electrical Engineering, Computer Science, or a related technical field; Master’s or MBA is a plus. Location: Based in the San Jose/Silicon Valley area to facilitate close collaboration with local HQ and key accounts. Direct Impact: High-visibility role with a direct reporting line to the CEO, influencing the company’s operational excellence and market reputation. Silicon Valley Ecosystem: Work at the forefront of AI, automotive, and high-performance computing IP innovation in San Jose. Baya Systems is a fast-growing Series B semiconductor IP and software company delivering next-generation Network-on-Chip (NoC) and unified fabric platforms for advanced SoCs, chiplets, and AI/ML systems. Our data-movement-centric, software-driven fabric solutions enable scalable, high-performance, and power-efficient designs across AI, HPC, automotive, networking, and advanced compute markets. Baya licenses disruptive IP and provides software development platforms that simplify complex SoC and multi-die system design, accelerating time-to-market for leading semiconductor and systems companies worldwide. With major design centers on three continents and expanding ecosystem partnerships, Baya is scaling rapidly to meet increasing demand for chiplet-based and AI-centric architectures. rich.goldstein@bayasystems.com Compensation: - Salary commensurate with experience - Performance incentives - Comprehensive medical, dental, and vision benefits - 401(k) retirement plan - Equity ## About Baya Systems ## Company Overview - **One-liner**: Baya Systems delivers chiplet-ready, software-defined unified fabric solutions that enable efficient data movement and scalable, high-performance AI compute systems. - **Entity Type**: Private (Series B funding) - **Headquarters**: Santa Clara, California, United States (offices also in Austin, Texas; Cambridge, UK; and Bengaluru, India) - **Founded**: 2023 - **Founders**: Dr. Sailesh Kumar (CEO) ## Core Business - **Primary industry**: Semiconductor IP / Chiplet Interconnect Technology - **Target customers**: B2B – semiconductor companies, AI chip designers, hyperscalers, automotive OEMs, data center and infrastructure providers - **Mission or purpose statement**: “Accelerating intelligent compute everywhere” by solving the data movement bottleneck through chiplet-based, modular system design. ## Products & Services - **WeaveIP**: A portfolio of chiplet-ready, unified fabric IP products built on a common transport layer. Supports multi-level cache coherence (CHI, CXL), AMBA 5, and custom protocols. Offers up to 4 TB/s throughput in a single cluster and multi-PB/s for multi-chiplet AI applications. [bayasystems.com](https://bayasystems.com/) - **WeaverPro**: Software platform for architectural exploration, analysis, and design optimization. Provides accurate, high-speed simulation, data-driven D2D analysis, and algorithmic optimization to configure and optimize WeaveIP-based systems. [bayasystems.com](https://bayasystems.com/) - **Chiplet-Ready Design Software**: Includes tiling, physically aware implementation planning, and correct-by-construction RTL generation to de-risk system development. [bayasystems.com](https://bayasystems.com/) ## Market Standing - **Valuation/Market Cap**: Not disclosed. - **Key Metric**: Total funding of **$36M** (Series B closed January 23, 2025) – [linkedin.com](https://www.linkedin.com/company/bayasystems) - **Notable Investors/Partners**: Maverick Silicon (lead), Matrix Partners, Intel Capital – [linkedin.com](https://www.linkedin.com/company/bayasystems) - **Growth Signals**: - Headcount grew **138% YoY** (86 employees as of mid-2025) – [linkedin.com](https://www.linkedin.com/company/bayasystems) - Received **Frost & Sullivan 2025 Innovation Award for Interconnect IP** – [bayasystems.com](https://bayasystems.com/about/) - Named **Andes Technology’s 2025 Partner of the Year** – [bayasystems.com](https://bayasystems.com/about/) - Listed in **EE Times Silicon 100: Startups to Watch in 2025** – [bayasystems.com](https://bayasystems.com/about/) - ISO 9001:2015 certified (TÜV Rheinland) – [bayasystems.com](https://bayasystems.com/about/) ## Competitive Advantages - **Software-defined fabric**: Unique data-driven, correct-by-construction methodology reduces risk and design cycle time. - **Chiplet-first architecture**: Built from the ground up for multi-cluster and multi-chiplet designs, supporting UMA/NUMA and sub-NUMA. - **Extreme scalability**: Delivers 4 TB/s per cluster and multi-PB/s for AI, with support for advanced HBM and multicast capabilities. - **Protocol flexibility**: Unified fabric that supports coherent, non-coherent, and custom protocols, minimizing wires and power. - **Proven ecosystem**: Backed by top-tier investors (Intel Capital, Matrix) and partnerships with key industry players like Andes Technology. ## Strategic Focus - **Chiplet adoption for AI/HPC**: Drive mainstream adoption of chiplet-based systems by providing production-ready, de-risked interconnect IP. - **Expanding into new verticals**: Target automotive, data center, AI acceleration, IoT, and infrastructure segments. - **Global hiring and R&D**: Scale engineering teams in Santa Clara, Austin, Bengaluru, Cambridge (UK), and remote Europe. ## Why Work Here - **Cutting-edge technology**: Work on foundational semiconductor IP for AI and high-performance computing, solving real data movement challenges. - **Global & flexible environment**: Offices in four locations with remote options; dynamic and flexible work policy. - **Competitive compensation**: Generous equity, cash incentives, 401(k), paid parental leave, flexible time off. - **Perks**: On-site fitness center, social events, free refreshments in offices. - **Culture**: Emphasizes collaboration, innovation, and growth; team includes experienced architects and engineers from successful startups and semiconductor companies. - **Active hiring**: Over 23 job openings as of mid-2025 spanning hardware, software, and commercial roles (Solutions Architects, FAEs, Verification, RTL, Physical Design, etc.) – [greenhouse.io](https://job-boards.greenhouse.io/bayasystems) ## Sources 1. [bayasystems.com](https://bayasystems.com/) 2. [bayasystems.com/careers](https://bayasystems.com/careers/) 3. [greenhouse.io](https://job-boards.greenhouse.io/bayasystems) 4. [linkedin.com](https://www.linkedin.com/company/bayasystems) ## Other roles at Baya Systems - [Performance Architecture](https://feeny.ai/job/performance-architecture-baya-systems-austin-texas-7rqg17zjhmev) — Austin Texas, United States / Bengaluru, India / Cambridge England, United Kingdom / Santa Clara California, United States - [Manager of Field Applications Engineering, USA](https://feeny.ai/job/manager-of-field-applications-engineering-usa-baya-systems-austin-texas-k2c3zr1h5x2x) — Austin Texas, United States / Santa Clara California, United States - [Manager/Director of Hardware Engineering](https://feeny.ai/job/manager-director-of-hardware-engineering-baya-systems-santa-clara-california-xhbgvhmvsr80) — Santa Clara California, United States - [Director of Field Applications Engineering- Europe and APAC](https://feeny.ai/job/director-of-field-applications-engineering-europe-and-apac-baya-systems-bbssy01qr30t) — Cambridge, United Kingdom / Europe - [Marketing Communications Manager](https://feeny.ai/job/marketing-communications-manager-baya-systems-austin-texas-f17xtnafk2es) — Austin Texas, United States / Cambridge England, United Kingdom / Santa Clara California, United States - [Hardware Verification Engineer](https://feeny.ai/job/hardware-verification-engineer-baya-systems-austin-texas-5dfkf341419q) — Austin Texas, United States - [SOC-IP Architect](https://feeny.ai/job/soc-ip-architect-baya-systems-cambridge-bx704sv7ehky) — Cambridge, United Kingdom / Europe - [Microarchitect and RTL Design Engineer](https://feeny.ai/job/microarchitect-and-rtl-design-engineer-baya-systems-cambridge-england-4t78qs5ptqas) — Cambridge England, United Kingdom - [Hardware Verification Engineer](https://feeny.ai/job/hardware-verification-engineer-baya-systems-cambridge-england-jvr2qd1m0x8s) — Cambridge England, United Kingdom - [Solutions Architect](https://feeny.ai/job/solutions-architect-baya-systems-bengaluru-fkgwhmxm9grt) — Bengaluru, India