---
title: 'Manager, Package Design Engineering at Astera Labs'
canonical: 'https://feeny.ai/job/manager-package-design-engineering-astera-labs-san-jose-california-24kz4b93pnpd'
type: 'job'
last_seen: '2026-09-11'
---

# Manager, Package Design Engineering at Astera Labs

- **Company:** Astera Labs
- **Location:** San Jose California, United States
- **Posted:** 2026-03-26
- **Last confirmed live:** 2026-09-11
- **Apply:** https://job-boards.greenhouse.io/asteralabs/jobs/4678037005

## Job description

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at [www.asteralabs.com](http://www.asteralabs.com/).

## Role Overview

Astera Labs is seeking a Manager, Package Design Engineering to lead and scale our Package Design team in San Jose. In this high-impact role, you'll own the end-to-end delivery of advanced IC packaging solutions—from early architecture definition through production ramp—enabling the next generation of AI infrastructure and connectivity products.

As the semiconductor industry races toward chiplet-based architectures, 2.5D/3D integration, and ever-increasing bandwidth demands, packaging has become a critical differentiator. You'll build and mentor a high-performing team while driving cross-functional execution with silicon architecture, SIPI, PCB, validation, manufacturing, and external partners including substrate vendors and OSATs. Your work will directly impact Astera Labs' ability to deliver industry-leading PCIe, CXL, and Ethernet connectivity solutions to the world's most demanding hyperscale and AI customers.

This role offers the opportunity to shape design methodology, establish scalable standards, and enable chip-package-board co-design frameworks across multiple product lines in a fast-moving, innovation-driven environment.

## Key Responsibilities

- Team Leadership & Execution
- Build, mentor, and scale a high-performing package design engineering team with clear ownership, accountability, and execution flows
- Establish design templates, standards, and best-known methods (BKMs) across multiple concurrent programs
- Lead design reviews, audits, and issue resolution through bring-up and production ramp
- Package Design Delivery
- Own end-to-end package design execution including FCBGA/FCCSP, monolithic, multi-die, and chiplet-based designs from concept feasibility through tape-out and production
- Define and review substrate stack-ups, pad stacks, routing strategies, and design constraints to meet electrical, thermal, mechanical, and manufacturability requirements
- Drive technical tradeoffs across performance, cost, yield, and schedule, ensuring high-quality design closure and on-time delivery
- Cross-Functional Collaboration
- Partner with SIPI, silicon architecture, system/board design, and product teams to drive chip-package-board co-design and resolve system-level challenges
- Collaborate with OSATs and substrate vendors to ensure design feasibility, manufacturability, and alignment with evolving design rules and technology roadmaps
- Support adoption of advanced packaging technologies such as 2.5D, chiplet, CPO/CPC, and heterogeneous integration platforms
- Methodology & Automation
- Develop and scale design methodologies and automation flows to improve efficiency, quality, and repeatability across the organization

## Basic Qualifications

- Bachelor's degree in Electrical Engineering, Materials Science, or related field
- 10+ years of progressive experience in IC package design using tools such as Cadence Allegro APD/SiP
- 5+ years of leadership experience managing teams or technical organizations in IC packaging environments
- Strong hands-on expertise in end-to-end package design with proven delivery of HVM-ready FCBGA/FCCSP packages using Cadence APD tool
- Experience with high-speed SerDes systems (PCIe Gen5/6/7, CXL, Ethernet 100G/200G/400G+) and advanced nodes (7nm, 5nm, 3nm)
- Deep understanding of substrate technologies, stack-ups, routing constraints, assembly processes, and SI/PI fundamentals
- Proven experience working with OSATs and substrate vendors through development and production ramp
- Experience working with OSATs and substrate vendors through development and production ramp
- Experience with advanced packaging architectures such as 2.5D/3D, chiplet, or heterogeneous integration

## Preferred Qualifications

- Master's degree in Electrical Engineering or related field
- Experience with advanced packaging architectures such as 2.5D/3D, chiplet, or heterogeneous integration
- Experience implementing automation, scripting (Python, SKILL, Tcl), or workflow optimization
- Background in early package feasibility, platform evaluation, and technology roadmap development
- Familiarity with chip floor planning, architecture, and system-level tradeoffs
- Exposure to SIPI modeling and analysis, thermal, and mechanical performance considerations

The base salary range is $230,000 USD – $265,000 USD. This position can be hired as a Manager Level or Director Level. Your base salary will be determined based on location, experience, and employees' pay in similar positions. We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

## About Astera Labs

## Company Overview
- **One-liner**: Astera Labs designs and delivers semiconductor-based connectivity solutions purpose-built to unleash the full potential of cloud and AI infrastructure.
- **Entity Type**: Public (Nasdaq: ALAB)
- **Headquarters**: Santa Clara, California, United States
- **Founded**: 2017
- **Founders**: Jitendra Mohan, Sanjay Gajendra, Casey Morrison

## Core Business
- **Primary industry**: Semiconductor manufacturing / AI infrastructure connectivity
- **Target customers**: B2B, primarily hyperscale cloud providers and system OEMs (e.g., NVIDIA, AMD, Intel)
- **Mission statement**: To innovate, design, and deliver semiconductor-based connectivity solutions that are purpose-built to unleash the full potential of cloud and AI infrastructure.

## Products & Services
- **Aries PCIe®/CXL™ Smart DSP Retimers**: Silicon ICs, boards, and modules that digitally recover degraded high-speed signals to extend reach and enable higher PCIe/CXL data bandwidth between compute, storage, and network controllers.
- **Taurus Ethernet Smart Cable Modules™**: Hardware modules that increase network connectivity bandwidth between servers and switches over copper media, removing rack-level Ethernet bottlenecks.
- **Leo CXL Memory Connectivity Controllers**: ICs and boards that expand, share, and pool DRAM memory to overcome processor memory bandwidth bottlenecks for AI workloads.
- **Scorpio Smart Fabric Switches**: A family of PCIe 6 fabric switches ranging from 32 to 320 lanes, including the new 320-lane Scorpio X-Series Fabric Switch for AI scale-up fabrics.
- **COSMOS Software Suite**: A connectivity system management and optimization software that enables configuration, monitoring, troubleshooting, and predictive analytics for all Astera Labs products.

## Market Standing
- **Market Cap**: ~$11.6 billion (as of mid-2026)
- **Key Metric - Revenue**: $35 million (annual, reported)
- **Key Metric - Operating Income**: $173.4 million (2025)
- **Key Metric - Net Income**: $219.1 million (2025)
- **Total Funding**: ~$810.75 million (pre-IPO), with Series C ($50M, led by Fidelity) and Series D ($150M, led by Fidelity)
- **IPO Date**: March 20, 2024
- **Notable Investors/Partners**: Fidelity, NVIDIA, Advanced Micro Devices, Intel, major hyperscalers
- **Growth Signals**: 92% YoY headcount growth (675 employees); 144 active job postings (+260% YoY); expanded Taiwan operations with a new Cloud-Scale Interop Lab in 2026; shipping millions of devices across all major hyperscalers; 300+ design wins.

## Competitive Advantages
- **First-to-market innovation**: Pioneered first-to-market PCIe, Ethernet, and CXL connectivity products.
- **Patented software-defined platform approach**: Differentiates via a platform that combines silicon hardware with embedded COSMOS software, enabling flexibility, observability, and predictive analytics.
- **Deep hyperscaler relationships**: Trusted partner to the world’s largest cloud providers, with proven interoperability validated in their own Cloud-Scale Interop Lab.
- **Broad product portfolio**: Covers PCIe retimers, Ethernet cable modules, CXL memory controllers, and fabric switches—addressing the full spectrum of AI connectivity bottlenecks.
- **Strong IP and engineering talent**: 443 employees in technical roles; talent sourced from Intel (65), Marvell (37), Texas Instruments (40), AMD (22), and NVIDIA.

## Strategic Focus
- **Scaling AI infrastructure**: Expanding product portfolio and global footprint (12 countries) to meet surging demand for rack-scale AI.
- **Open standards leadership**: All products are grounded in open standards (PCIe, CXL, Ethernet), ensuring interoperability and broad adoption.
- **Taiwan expansion**: Growing engineering presence and Interop Lab in Taiwan to strengthen integration with leading AI platform providers and system manufacturers.
- **Continued innovation**: Shipping the new 320-lane Scorpio X-Series Fabric Switch and expanding the COSMOS software suite for fleet-level management and optimization.

## Why Work Here
- **Culture**: Described as collaborative, ownership-driven, and focused on solving complex problems together. The company emphasizes diversity and inclusion as drivers of creativity and innovation.
- **Growth**: Astera Labs supports non-linear career growth—employees can deepen expertise (“scale up”) or broaden into new areas (“scale out”). 92% YoY headcount growth signals rapid expansion and opportunity.
- **Remote/Hybrid**: Not explicitly stated, but global operations across 12 countries (including India, Canada, Israel, Taiwan, Vietnam) suggest a flexible, distributed work model.
- **Benefits**: Competitive medical, dental, and vision plans; flexible time off; family planning and parental leave; 401K and retirement plans.
- **Engineering culture**: Strong focus on cutting-edge semiconductor and AI infrastructure technology. High concentration of senior (24%) and specialist (19%) talent. Active internship and new graduate programs.
- **Employee ratings**: 4.5/5.0 on LinkedIn (124 reviews), with high marks for compensation (4.6), culture (4.4), and career development (4.4).

## Sources
1. [Astera Labs Careers Page](https://www.asteralabs.com/careers/)
2. [Astera Labs Official Website](https://www.asteralabs.com/)
3. [Astera Labs LinkedIn](https://www.linkedin.com/company/astera-labs)
4. [Astera Labs Products Page](https://www.asteralabs.com/products/)
5. [Astera Labs S-1 Filing (SEC)](https://ir.asteralabs.com/static-files/7103a4cb-aa6b-4f11-a4b0-f179cd4c5bee)

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