--- title: 'Mechanical Engineer, Electronics Packaging & RF Components at Astranis' canonical: 'https://feeny.ai/job/mechanical-engineer-electronics-packaging-rf-components-astranis-san-francisco-f92cpj9f301s' type: 'job' last_seen: '2026-10-17' --- # Mechanical Engineer, Electronics Packaging & RF Components at Astranis - **Company:** Astranis - **Location:** San Francisco, CA - **Compensation:** $110k–$160k - **Posted:** 2023-10-31 - **Last confirmed live:** 2026-10-17 - **Apply:** https://job-boards.greenhouse.io/astranis/jobs/4299740006 ## Job description Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today Astranis satellites provide dedicated, secure networks to highly-sophisticated customers across the globe – large enterprises, sovereign governments, and the US military. With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts. Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization. Astranis has raised over $1.2 billion from some of the world’s best investors, including Andreessen Horowitz, Baillie Gifford, Blackrock, Fidelity, Franklin Templeton, and Snowpoint, and employs a team of 500 engineers and entrepreneurs. Astranis designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California, USA. Mechanical Engineer, Electronics Packaging & RF Components As an Astranis Mechanical Engineer focused on Electronics Packaging and RF Components, you will design, analyze, build, and test enclosures for critical spacecraft electronics and RF components. You will contribute across the complete hardware lifecycle from requirements definition and concept development through detailed design, supplier coordination, assembly, and environmental testing. Working at the intersection of mechanical, thermal, electrical, and RF engineering, you will solve challenging problems involving EMI/EMC isolation, high-power-density thermal management, and survivability in the launch environment. You will own the enclosure’s physical architecture, interfaces, manufacturability, and environmental robustness while partnering closely with RF and electrical engineers to verify electromagnetic and electrical performance. This role requires strong problem-solving skills, sound mechanical judgment, hands-on hardware experience, and enthusiasm for developing novel design solutions ## Role - Design, analyze, build, and test space-grade electronics enclosures, RF housings, and PCBA mounts. - Implement effective RF isolation and EMI shielding techniques, including gasketing, cavity design, and precision machining interface controls. - Collaborate closely with RF, Electrical, and Systems engineering teams to develop requirements for mechanical constraints, connector interfaces, signal integrity, and environmental loads. - Integrate electronics units into the spacecraft design, developing procedures to optimize assembly, wire routing, and thermal interface material application. ## Requirements - B.S. or M.S in mechanical, aerospace engineering or equivalent - 2+ years of experience in mechanical design with a focus on electronics packaging, RF packaging, or enclosure design. - Proficiency in mechanical 3D CAD (e.g., SolidWorks, NX, or Creo). - Strong fundamentals in mechanical design, structural design, and thermal management for printed circuit board assemblies (PCBAs) and their enclosures. - Practical knowledge of RF isolation techniques and EMI/EMC mitigation strategies in mechanical enclosures. - Experience with GD&T, tolerance analysis, engineering drawings, and design for manufacturability. - Hands-on experience with hardware prototyping, thermal interface materials, precision machining, and assembly processes. - Don't meet them all? Not a problem. Please apply even if you do not meet all these criteria. Bonus - Experience designing high-frequency (Ku-Band or higher) RF/microwave enclosures, waveguides, or filter housings. - Experience with mechanical and/or thermal FEA (e.g., ANSYS, Femap/NX Nastran, Thermal Desktop). - Experience designing electronics enclosures for radiation and vacuum environments. - Experience designing hardware to withstand severe launch vibration, shock, and thermal cycling environments. - Hands-on experience with environmental testing (TVAC, vibration/shaker tables, thermal chambers, and EMI/EMC chambers). - Experience designing chip and wire RF housings for integrated antenna feed systems. What we offer: All our positions offer a compensation package that includes equity and robust benefits. Base pay is just one component of Astranis’s total rewards package. Your compensation also includes a significant equity package via incentive stock options, high-quality company-subsidized healthcare, disability and life insurance, 401(k) retirement planning, flexible PTO, and free on-site catered meals. Astranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources. The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials & certifications, educational attainment, skill level requirements, and the level and scope of the position. Base Salary $110,000—$160,000 USD U.S. Citizenship, Lawful Permanent Residency, or Refugee/Asylee Status Required (To comply with U.S. Government space technology export regulations, applicant must be a U.S. citizen, lawful permanent resident of the United States, or other protected individual as defined by 8 U.S.C. 1324b(a)(3)) Our mission and products are built for everyone, regardless of gender, race, creed, or background. We believe in a diverse and inclusive workplace, and we invite all people to join our team and bring their unique perspectives to make us stronger. Astranis SMS Terms of Service - Recruiting Updates: By opting in, you agree to receive SMS updates, interview coordination, and recruiting communications from Astranis Space Technologies Corp. - Opt-Out: You can cancel this service at any time by replying STOP. We will send one final text confirming your unsubscription. - Opt-In Again: To resume receiving messages, reply START or YES. - Support & Rates: For assistance, reply HELP or contact us at coordinators@astranis.com. Message and data rates may apply. Message frequency varies; carriers are not liable for delayed or undelivered messages. - Privacy: For details on how we protect your data, view our [Privacy Policy](https://www.google.com/url?q=https%3A%2F%2Fwww.astranis.com%2Flegal%2Fprivacy). ## About Astranis ## Company Overview - **One-liner**: Astranis designs, builds, and operates small, radiation-hardened geostationary (GEO) satellites for dedicated broadband and government missions. - **Entity Type**: Private (Series E, total funding >$1.2B) - **Headquarters**: San Francisco, California, United States - **Founded**: 2015 - **Founders**: John Gedmark (CEO), Ryan McLinko (CTO) ## Core Business - **Primary industry**: Space Research and Technology – geostationary communications satellites. - **Target customers**: Telecommunications operators (B2B), U.S. Government (Space Force, NASA), allied nations. - **Mission statement**: “Connect the world” and “extend humanity’s reach beyond Low Earth Orbit.” ## Products & Services - **[MicroGEO]**: A small, radiation-hardened GEO satellite that delivers dedicated broadband (up to 8.5 Gbit/s per satellite). Used for commercial connectivity and government missions (communications, PNT, science). - **[Government Programs]**: Prime contractor for Space Force’s Resilient GPS program; contracts with NASA and other defense partners for high-orbit spacecraft. - **[Satellite Services]**: End‑to‑end design, manufacture, test, and operation of GEO satellites. Over $1 billion in satellite services sold across 10+ satellites on contract. ## Market Standing - **Valuation**: Not publicly disclosed. - **Key Metric**: Total funding raised >$1.2 billion (latest Series E of $450M added in 2025). - **Notable Investors/Partners**: BlackRock, Venrock, Andreessen Horowitz, Y Combinator (Winter 2016 cohort). Customers include Pacific Dataport (Alaska), Orbits Corp (Philippines), Thaicom (Thailand), Orbith (Argentina), Apco Networks (Mexico), and U.S. Space Force. - **Growth Signals**: - Headcount: 439 employees (+21.4% YoY) as of mid‑2025. - 5 satellites currently on orbit; 10+ under contract. - Goal to launch 100 satellites by 2030. - Selected to design next‑gen Resilient GPS satellites for Space Force. - Expanded into government science, PNT, and national security missions. ## Competitive Advantages - **Only company building small, radiation‑hardened satellites for GEO** – traditional GEO satellites are behemoths costing hundreds of millions; Astranis’s compact design slashes cost and lead time. - **In‑house manufacturing and testing** at Historic Pier 70 (San Francisco) – full vertical integration from machining to final test. - **Radiation‑tolerant electronics** that survive the harsh GEO environment without expensive custom radiation‑hardened components. - **Dedicated satellite networks** – each MicroGEO provides a private, resilient link, unlike shared LEO constellations. ## Strategic Focus - Scale production to 100+ satellites by 2030, targeting both commercial broadband and major U.S. Government programs of record. - Expand beyond communications into position, navigation, and timing (PNT), science, and national security missions. - Strengthen “New Prime” role for defense space contracts. ## Why Work Here - **Culture**: “Calling, not a career” – mission‑driven team working on the world’s most advanced high‑orbit satellites. - **Work model**: Fully in‑person, 5 days per week at a historic factory/shipyard turned spaceship factory. - **Compensation**: Competitive pay, broad equity ownership, and comprehensive health/wealth/well‑being benefits. - **Impact**: Directly connect millions of people to affordable internet and support U.S. national security from space. - **Growth**: 131 active job openings across hardware, software, manufacturing, operations, and government programs (as of mid‑2025). ## Sources 1. [astranis.com](https://www.astranis.com/) 2. [astranis.com/careers](https://www.astranis.com/careers) 3. [LinkedIn – Astranis](https://www.linkedin.com/company/astranis) 4. [Wikipedia – Astranis](https://en.wikipedia.org/wiki/Astranis) 5. 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