---
title: 'Packaging Mechanical Engineer at DensityAI'
canonical: 'https://feeny.ai/job/packaging-mechanical-engineer-densityai-mountain-view-q29p3121g5c2'
type: 'job'
last_seen: '2026-09-12'
---

# Packaging Mechanical Engineer at DensityAI

- **Company:** DensityAI
- **Location:** Mountain View, CA
- **Compensation:** $190k–$245k
- **Posted:** 2026-08-06
- **Last confirmed live:** 2026-09-12
- **Apply:** https://job-boards.greenhouse.io/densityai/jobs/4354671009

## Job description

## About the role

Own the thermo-mechanical design of the advanced packages our AI accelerator silicon ships in. A multi-die 2.5D package is a stack of materials that all want to expand at different rates, under a lid, under load, cycling through hundreds of watts — and your job is to make it stay flat, stay bonded, and stay intact. You'll model warpage and stress through reflow and assembly, design the lid, stiffener, underfill and TIM stack that controls them, set the mechanical rules our OSATs build to, and own the socket and load mechanics where the package meets the cooling solution. You'll correlate every model against real measurement, and you'll be the person who knows whether a design will survive the assembly line before it gets there.

What will you do

- Own thermo-mechanical modeling and FEA for multi-die packages; warpage across reflow and assembly, die and interconnect stress, CTE mismatch, and structural response under thermal and mechanical load
- Own package mechanical design; lid and heat spreader, stiffener, underfill and mold compound selection, and TIM specification and bondline control at the package-to-cooling interface
- Drive assembly process mechanics and mechanical design rules with OSATs and substrate suppliers, and own socket and load-frame mechanics for high-force accelerator sockets
- Correlate models to measurement (shadow moire, strain gauge, DIC) and drive DOEs that close the gap between simulation and silicon
- Use and develop AI assisted tool flows to accelerate mechanical modeling and signoff timelines

## What we're looking for

- Exceptional abilities in thermo-mechanical analysis of semiconductor packages: warpage prediction and control, die and solder-joint stress, delamination and interfacial fracture risk, and material and structural tradeoffs
- 8+ years of packaging mechanical experience on high-performance designs, including 2.5D / 3D and multi-die packages (CoWoS, EMIB, InFO, fan-out, or equivalent) and HBM-bearing assemblies
- Hands-on with industry-standard FEA tools (Ansys Mechanical, Abaqus, or equivalent) and strong materials knowledge across underfills, mold compounds, substrates, TIMs, and lid materials
- Demonstrated ability to work closely with packaging, thermal, reliability, board, and OSAT partners to converge mechanical designs and sign them off against JEDEC and IPC standards

Full compensation packages are based on candidate experience and relevant certifications.

California pay range $190,000—$245,000 USD

## Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.

Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

## Equal Opportunity

DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.

## About DensityAI

## Company Overview
- **One-liner**: DensityAI is building a new generation of AI accelerators around a novel memory architecture, designed specifically for frontier-scale LLM inference, integrating silicon, packaging, kernels, and serving into a single optimized system.
- **Entity Type**: Private (Seed Stage)
- **Headquarters**: Mountain View, California, United States
- **Founded**: 2024
- **Founders**: Srikanth Arekapudi (Co-Founder), Bill Chang (Co-Founder, President, CTO)

## Core Business
- **Primary industry/industries**: AI Hardware (AI Accelerators / Semiconductors), Artificial Intelligence Inference Infrastructure
- **Target customers**: B2B / Enterprise — specifically companies deploying frontier-scale large language models (LLMs) that require high-bandwidth, high-capacity inference compute.
- **Mission or purpose statement**: Building the world’s fastest inference solution for frontier models, solving the memory wall problem through novel memory placement rather than traditional architecture workarounds.

## Products & Services
- **DensityAI Accelerator (Platform)**: A full-stack AI inference solution — from silicon die and packaging (tiled multi-die architecture) to system rack and software kernel stack. Designed to bridge the gap between HBM-based GPUs (high capacity, low bandwidth utilization) and SRAM-based meshes (high bandwidth, low capacity). The company claims target compute utilization of ≥90% for production LLM workloads.

## Market Standing
- **Valuation/Market Cap**: Not publicly available (stealth stage)
- **Key Metric**: Total Funding — At least one Seed Round completed (Sep 2025) and earlier Seed Round (Sep 2024). Specific amounts not disclosed; operates in stealth mode.
- **Notable Investors/Partners**: Dolby Family Ventures, Firestreak Ventures, imec.xpand, NextGen Venture Partners, South Park Commons (6 total investors per PitchBook)
- **Growth Signals**: Headcount grew +450% monthly (from small base to ~9 employees); team includes alumni from Tesla, Google, Toyota North America, and multiple stealth AI startups; 2 active job postings as of mid-2025; founding team has prior experience shipping supercomputing clusters and designing silicon for the world’s largest production inference engines.

## Competitive Advantages
- **Novel memory architecture**: Integrates memory directly into the compute stack, avoiding the “disaggregation penalty” of traditional GPU designs — no signals bouncing across substrates, eliminating unnecessary bottlenecks.
- **Full-stack co-design**: Silicon, packaging, kernels, and serving are all designed together as one system, enabling tight integration from compute organization to software architecture.
- **Performance target**: Aims to beat GPUs on both energy and speed for large-model, long-context workloads, and beat SRAM-based designs on model size and reliability — addressing a clear gap in the current market.

## Strategic Focus
- **Current priorities**: Scaling the engineering team (open roles: Compiler Engineer, Physical Design Engineer, Senior Design Verification Engineer, Site Reliability Engineer, Corporate Finance Manager, IT Support Engineer); transitioning from stealth to production-ready hardware; proving the full-stack architecture at rack scale.
- **Direction for growth**: Continue refining tile-based multi-die packaging, building out the software/kernel stack, and preparing for broader deployment and customer acquisition in the frontier AI inference market.

## Why Work Here
- **Culture highlights**: A deep-tech, hard-engineering culture focused on a fundamental challenge in AI hardware — the memory wall. The team is intentionally small and elite (~9 people), with a high bar for talent. The founders emphasize “building with us” and a collaborative approach across the full stack.
- **Remote/hybrid/office policy**: The company has offices in Mountain View, CA (HQ) and South Korea. Roles appear to require on-site or hybrid presence given the hardware-focused nature of the work.
- **Notable perks or engineering culture**: Opportunity to work on cutting-edge AI silicon from concept to rack; direct exposure to all layers of the stack; team composition includes veterans from Tesla, Google, and major production inference engine builds; fast-moving startup environment with significant autonomy and impact.

## Sources
1. [densityai.com](https://www.densityai.com/) — Company website
2. [linkedin.com/company/densityai](https://www.linkedin.com/company/densityai) — LinkedIn company page
3. [pitchbook.com/profiles/company/820064-17](https://pitchbook.com/profiles/company/820064-17) — PitchBook profile (funding, investors, overview)
4. [theorg.com/org/densityai](https://theorg.com/org/densityai) — The Org company profile
5. [densityai.com/join/](https://www.densityai.com/join/) — Careers page

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