---
title: 'PCB Quality Engineer at DensityAI'
canonical: 'https://feeny.ai/job/pcb-quality-engineer-densityai-mountain-view-hse3e2rn3n8r'
type: 'job'
last_seen: '2026-10-17'
---

# PCB Quality Engineer at DensityAI

- **Company:** DensityAI
- **Location:** Mountain View, CA
- **Compensation:** $215k–$265k
- **Posted:** 2026-10-06
- **Last confirmed live:** 2026-10-17
- **Apply:** https://job-boards.greenhouse.io/densityai/jobs/4433321009

## Job description

## ABOUT THE ROLE

Own the technology roadmap, manufacturability, and quality of the advanced PCBs and package substrates that carry our AI accelerator silicon. You'll drive where our substrate and PCB technology is headed — embedded passives/actives, inorganic core substrates, and novel thermal solutions — while making sure complex, high-layer-count boards and flip-chip organic substrates are designed to build cleanly, at yield, and to spec. Partnering across packaging, thermal, and systems teams and directly with our substrate and PCB manufacturing partners, you'll develop and qualify the new materials, structures, and processes that enable next-generation product architectures — and protect product quality where the silicon meets the system.

## WHAT YOU'LL DO

- Drive the advanced substrate and PCB technology roadmap — including embedded passive/active integration and inorganic core substrates — aligned to our AI accelerator product needs
- Develop and qualify new materials, structures, and processes with substrate and PCB vendors, taking them from evaluation through production readiness
- Cowork with cross-functional teams (packaging, SI/PI, thermal, mechanical, systems) to improve and enable new product architectures — with focus on passive/active embedding, novel thermal solutions, and improved SI/PI and mechanical behavior for assembly and reliability
- Lead DFM/DFx reviews for high-layer-count PCBs and organic package substrates (flip-chip BGA / ABF) — catching manufacturability, yield, and reliability risks before tape-out to the fab
- Own substrate and PCB supplier quality: qualify suppliers, drive PPAP/first-article and process capability, and hold partners to spec through NPI and volume ramp
- Define quality standards and acceptance criteria (IPC and internal) that gate build, and drive defect and failure analysis (cross-section, metrology, electrical) to root cause with corrective actions at the supplier
- Support reliability qualification (thermal cycling, HAST, etc.) and use statistical methods (SPC/DOE) to monitor and improve process quality across suppliers
- Build the DFM guidelines, checklists, and quality processes that scale with the program from prototype through production

## WHAT WE'RE LOOKING FOR

- BS/MS in Electrical, Materials, Mechanical, or Manufacturing Engineering plus 5+ years in advanced PCB/substrate technology development, DFM, or manufacturing/supplier quality for complex electronics
- Hands-on experience developing and qualifying advanced substrate/PCB technologies — embedded passives/actives, inorganic and organic core substrates, ABF build-up, flip-chip BGA — including materials, structures, and process development with vendors
- Strong grasp of advanced PCB and substrate fabrication processes (lamination, drilling/laser via, plating, ABF build-up, flip-chip BGA) and where they fail
- Experience partnering cross-functionally (packaging, SI/PI, thermal, mechanical, systems) to enable new product architectures, including embedded components and novel thermal solutions
- Supplier quality depth — qualification, PPAP/first-article, process capability, and driving corrective action with fab/substrate partners
- Fluency in IPC standards (e.g., IPC-6012 / IPC-A-600 or substrate equivalents) and quality acceptance criteria
- Failure-analysis skills: cross-section, metrology, and electrical debug to root-cause defects

Full compensation packages are based on candidate experience and relevant certifications.

California pay range $215,000—$265,000 USD

## Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.

Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

## Equal Opportunity

DensityAI is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religious creed, national origin, ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, age (40+), sexual orientation, military or veteran status, pregnancy, or any other status protected by law. We comply with the California CROWN Act and provide reasonable accommodations on request.

## About DensityAI

## Company Overview
- **One-liner**: DensityAI is building a new generation of AI accelerators around a novel memory architecture, designed specifically for frontier-scale LLM inference, integrating silicon, packaging, kernels, and serving into a single optimized system.
- **Entity Type**: Private (Seed Stage)
- **Headquarters**: Mountain View, California, United States
- **Founded**: 2024
- **Founders**: Srikanth Arekapudi (Co-Founder), Bill Chang (Co-Founder, President, CTO)

## Core Business
- **Primary industry/industries**: AI Hardware (AI Accelerators / Semiconductors), Artificial Intelligence Inference Infrastructure
- **Target customers**: B2B / Enterprise — specifically companies deploying frontier-scale large language models (LLMs) that require high-bandwidth, high-capacity inference compute.
- **Mission or purpose statement**: Building the world’s fastest inference solution for frontier models, solving the memory wall problem through novel memory placement rather than traditional architecture workarounds.

## Products & Services
- **DensityAI Accelerator (Platform)**: A full-stack AI inference solution — from silicon die and packaging (tiled multi-die architecture) to system rack and software kernel stack. Designed to bridge the gap between HBM-based GPUs (high capacity, low bandwidth utilization) and SRAM-based meshes (high bandwidth, low capacity). The company claims target compute utilization of ≥90% for production LLM workloads.

## Market Standing
- **Valuation/Market Cap**: Not publicly available (stealth stage)
- **Key Metric**: Total Funding — At least one Seed Round completed (Sep 2025) and earlier Seed Round (Sep 2024). Specific amounts not disclosed; operates in stealth mode.
- **Notable Investors/Partners**: Dolby Family Ventures, Firestreak Ventures, imec.xpand, NextGen Venture Partners, South Park Commons (6 total investors per PitchBook)
- **Growth Signals**: Headcount grew +450% monthly (from small base to ~9 employees); team includes alumni from Tesla, Google, Toyota North America, and multiple stealth AI startups; 2 active job postings as of mid-2025; founding team has prior experience shipping supercomputing clusters and designing silicon for the world’s largest production inference engines.

## Competitive Advantages
- **Novel memory architecture**: Integrates memory directly into the compute stack, avoiding the “disaggregation penalty” of traditional GPU designs — no signals bouncing across substrates, eliminating unnecessary bottlenecks.
- **Full-stack co-design**: Silicon, packaging, kernels, and serving are all designed together as one system, enabling tight integration from compute organization to software architecture.
- **Performance target**: Aims to beat GPUs on both energy and speed for large-model, long-context workloads, and beat SRAM-based designs on model size and reliability — addressing a clear gap in the current market.

## Strategic Focus
- **Current priorities**: Scaling the engineering team (open roles: Compiler Engineer, Physical Design Engineer, Senior Design Verification Engineer, Site Reliability Engineer, Corporate Finance Manager, IT Support Engineer); transitioning from stealth to production-ready hardware; proving the full-stack architecture at rack scale.
- **Direction for growth**: Continue refining tile-based multi-die packaging, building out the software/kernel stack, and preparing for broader deployment and customer acquisition in the frontier AI inference market.

## Why Work Here
- **Culture highlights**: A deep-tech, hard-engineering culture focused on a fundamental challenge in AI hardware — the memory wall. The team is intentionally small and elite (~9 people), with a high bar for talent. The founders emphasize “building with us” and a collaborative approach across the full stack.
- **Remote/hybrid/office policy**: The company has offices in Mountain View, CA (HQ) and South Korea. Roles appear to require on-site or hybrid presence given the hardware-focused nature of the work.
- **Notable perks or engineering culture**: Opportunity to work on cutting-edge AI silicon from concept to rack; direct exposure to all layers of the stack; team composition includes veterans from Tesla, Google, and major production inference engine builds; fast-moving startup environment with significant autonomy and impact.

## Sources
1. [densityai.com](https://www.densityai.com/) — Company website
2. [linkedin.com/company/densityai](https://www.linkedin.com/company/densityai) — LinkedIn company page
3. [pitchbook.com/profiles/company/820064-17](https://pitchbook.com/profiles/company/820064-17) — PitchBook profile (funding, investors, overview)
4. [theorg.com/org/densityai](https://theorg.com/org/densityai) — The Org company profile
5. [densityai.com/join/](https://www.densityai.com/join/) — Careers page

## Other roles at DensityAI

- [Commercial Contracts Manager](https://feeny.ai/job/commercial-contracts-manager-densityai-palo-alto-m3datk8bdn8z) — Palo Alto, CA
- [Accounting Manager](https://feeny.ai/job/accounting-manager-densityai-mountain-view-bjpzmb69431w) — Mountain View, CA
- [Mechanical Engineer, Systems](https://feeny.ai/job/mechanical-engineer-systems-densityai-mountain-view-d2y2wm1ks9gb) — Mountain View, CA
- [Global Supply Chain Manager- Strategic Components](https://feeny.ai/job/global-supply-chain-manager-strategic-components-densityai-mountain-view-1nhsqgx3fe2d) — Mountain View, CA
- [People Operations Specialist](https://feeny.ai/job/people-operations-specialist-densityai-mountain-view-kj9891vvpadp) — Mountain View, CA
- [Recruiting Coordinator](https://feeny.ai/job/recruiting-coordinator-densityai-mountain-view-6d230ekwm9j1) — Mountain View, CA
- [Thermal Engineer](https://feeny.ai/job/thermal-engineer-densityai-mountain-view-gby3yn41gyxz) — Mountain View, CA
- [PCB Layout Engineer](https://feeny.ai/job/pcb-layout-engineer-densityai-mountain-view-y8hzbqrkdhya) — Mountain View, CA
- [Package Layout Engineer](https://feeny.ai/job/package-layout-engineer-densityai-mountain-view-b32qj1gj1ddf) — Mountain View, CA
- [Packaging Mechanical Engineer](https://feeny.ai/job/packaging-mechanical-engineer-densityai-mountain-view-q29p3121g5c2) — Mountain View, CA