--- title: 'Physical Design and Verification Engineer at Neuralink' canonical: 'https://feeny.ai/job/physical-design-and-verification-engineer-neuralink-south-san-francisco-39svr63cw811' type: 'job' last_seen: '2026-11-06' --- # Physical Design and Verification Engineer at Neuralink - **Company:** Neuralink - **Location:** South San Francisco, CA - **Compensation:** $131k–$265k - **Posted:** 2026-11-05 - **Last confirmed live:** 2026-11-06 - **Apply:** https://boards.greenhouse.io/neuralink/jobs/8197036003?gh_jid=8197036003 ## Job description About Neuralink: We are creating devices that enable a bi-directional interface with the brain. These devices allow us to restore movement to the paralyzed, restore sight to the blind, and revolutionize how humans interact with their digital world. ## About the Role We are seeking a Senior Physical Design Engineer to own block-to-full-chip implementation and signoff on advanced-node, multi-die 3DIC products. You will drive hierarchical physical design from RTL handoff through tapeout, and lead the multi-physics verification (thermal, mechanical/warpage, and IR/EM) that is unique to stacked-die and chiplet-based systems. This role sits at the intersection of traditional block-level signoff and the emerging discipline of 3D system-level closure. ## Key Responsibilities Hierarchical Physical Design - Define and execute the hierarchical partitioning strategy: block boundaries, feedthroughs, pin placement, and budgeting across levels of hierarchy. - Develop and maintain floorplans, power grids, and timing/physical budgets for large multi-block SoCs. - Own the interface between block owners and top-level integration, including abstract (ILM/ETM) generation, boundary timing, and hierarchical ECO propagation. - Manage die-to-die partitioning for 3D stacks – assign logic to tiers, plan hybrid-bond / µbump / TSV interfaces, and align inter-die floorplans. Block-level Implementation & Signoff - Synthesis: Drive logic synthesis (constraints, DFT insertion, physical-aware synthesis), QoR analysis, and RTL-to-gate correlation. - Floorplanning: Macro placement, power planning, congestion and timing feasibility, and pin/port optimization. - Placement & Optimization: Standard-cell placement, timing-driven and congestion-driven optimization, useful-skew and multi-corner/multi-mode closure. - CTS: Clock tree synthesis and clock distribution (including inter-die clocking for 3D), skew/latency balancing, and OCV/AOCV/POCV-aware clock closure. - Routing: Detailed routing, DRC/LVS convergence, signal integrity (crosstalk) closure, and antenna/via optimization. - Signoff: Static timing analysis (STA) across all corners/modes, physical verification (DRC/LVS/DFM), EM/IR (static and dynamic), and formal netlist equivalence. 3DIC Multi-Physics Verification - Thermal: Build and run thermal models for stacked dies; analyze junction temperatures, hotspot coupling between tiers, and thermal-aware placement; feed thermal gradients back into timing and reliability signoff. - Mechanical: Perform warpage, stress, and CTE-mismatch analysis for stacked/bonded assemblies; validate bump/TSV/hybrid-bond mechanical integrity and assembly-induced reliability risks. - IR / Power Integrity: Static and dynamic IR-drop analysis across the 3D power delivery network, including inter-die PDN, TSV/bump resistance, decap strategy, and package-aware PI closure. - Correlate thermal, mechanical, and electrical effects such as thermal-induced timing derates and stress-induced device shifts into a coherent 3D signoff methodology. Methodology & Collaboration - Develop, document, and automate PnR and signoff flows (scripting, regression, QoR tracking). - Partner with packaging, design, DFT, DV, and CAD teams to align die/package/system co-design. - Debug convergence issues and drive root-cause analysis across timing, physical, and multi-physics domains. Required Qualifications - BS/MS in Electrical/Computer Engineering (or equivalent) with 5+ years of physical design experience; MS preferred. - Proven full-cycle RTL-to-GDSII experience on advanced nodes (7nm/5nm/4nm/3nm or comparable). - Hands-on hierarchical/top-level implementation on large (multi-million instance) designs. - Strong command of STA concepts (setup/hold, OCV/AOCV/POCV, MMMC) and physical verification signoff. - Proficiency with industry PnR and signoff tools (e.g., Cadence Innovus/Genus/Tempus/Voltus, Synopsys ICC2/Fusion Compiler/PrimeTime/StarRC, Siemens Calibre) and TCL scripting. ## Preferred / Differentiating Qualifications - Direct experience with 3DIC / 2.5D / chiplet implementation: TSVs, µbumps, hybrid bonding, interposers. - Multi-physics analysis experience with tools such as Ansys RedHawk-SC, Cadence Voltus/Celsius/Integrity 3D-IC, or Synopsys 3DIC Compiler. - Familiarity with thermal-aware and stress-aware design closure and die/package co-analysis. - Python/scripting for flow automation and data analysis; experience with regression/QoR frameworks. - Knowledge of reliability signoff (EM, aging/self-heat, ESD) in a 3D context. Expected Compensation: The anticipated base salary for this position is expected to be within the following range. Your actual base pay will be determined by your job-related skills, experience, and relevant education or training. We also believe in aligning our employees’ success with the company's long-term growth. As such, in addition to base salary, Neuralink offers equity compensation (in the form of Restricted Stock Units (RSU)) for all full-time employees. Base Salary Range: $131,000—$265,000 USD What We Offer: Full-time employees are eligible for the following benefits listed below. - An opportunity to change the world and work with some of the smartest and most talented experts from different fields - Growth potential; we rapidly advance team members who have an outsized impact - Excellent medical, dental, and vision insurance through a PPO plan - Paid holidays - Commuter benefits - Meals provided - Equity (RSUs) *Temporary Employees & Interns excluded - 401(k) plan *Interns initially excluded until they work 1,000 hours - Parental leave *Temporary Employees & Interns excluded - Flexible time off *Temporary Employees & Interns excluded ## About Neuralink ## Company Overview - **One-liner**: Neuralink develops implantable brain-computer interfaces (BCIs) that decode neural signals to restore autonomy for people with paralysis and other neurological conditions. - **Entity Type**: Private (Series D; total funding $1.35B as of Aug 2025) - **Headquarters**: Fremont, California, United States - **Founded**: 2016 - **Founders**: Elon Musk, Max Hodak, Benjamin Rapoport, Dongjin Seo, Paul Merolla, Philip Sabes, Timothy J. Gardner, Tim Hanson, Vanessa Tolosa ## Core Business - Primary industry: Neurotechnology / Biotechnology (implantable medical devices) - Target customers: B2C (patients with quadriplegia, ALS, spinal cord injury), B2B (hospitals, research institutions, clinical partners) - Mission: "Building brain interfaces to restore autonomy" – initially helping people with unmet medical needs control computers and robotic arms with their thoughts, and ultimately unlocking human potential. ## Products & Services - **N1 Implant (“the Link”)**: Coin-sized, surgically implanted BCI that records and stimulates brain activity via flexible neural threads. Enables users to control digital devices (mouse, keyboard, apps) using thought alone. Available only in clinical trials (PRIME Study). - **Telepathy**: Product name for the N1 Implant’s capability to allow users to control computers and mobile devices (announced by Musk). - **Blindsight**: Experimental implant designed to restore visual perception by directly stimulating the visual cortex. Received FDA Breakthrough Device Designation in September 2024. - **Speech BCI**: Device under development to restore communication for individuals with severe speech impairment (ALS, stroke, etc.). Received FDA Breakthrough Device Designation in May 2025. - **Neurosurgical Robot**: Custom robot for autonomous, precise insertion of neural threads during surgery. ## Market Standing - **Valuation**: ~$9 billion (per Tracxn, as of 2026) - **Key Metric**: Total funding ~$1.35 billion (13 rounds); annual revenue ~$20 million (pre-commercial, primarily from research partnerships) - **Notable Investors/Partners**: Founders Fund (led Series D), CoreNest Capital (led 2025 venture round), Elon Musk (owns >50%). Partners include University Health Network (Toronto), FDA (regulatory collaboration). - **Growth Signals**: - 21 human patients implanted as of January 2026 - Headcount grew 31.3% year-over-year to ~400 employees (with 127 active job postings) - Received FDA Breakthrough Device Designations for Blindsight and speech BCI - Expanded clinical trials to Canada (first procedures outside the U.S. in Aug/Sep 2025) - Patients reached typing speeds of up to 40 words per minute and achieved information transfer rates comparable to able-bodied mouse users ## Competitive Advantages - **First-mover with human implants**: Only BCI company with FDA-approved human trials and over 20 implanted patients. - **Robotic precision**: Proprietary surgical robot capable of inserting ultra-thin threads (4–6 µm) that are too fine for human hands. - **Regulatory momentum**: Multiple FDA Breakthrough Device Designations accelerating development for vision, speech, and motor restoration. - **Interdisciplinary talent pool**: Recruits from Tesla, SpaceX, OpenAI, Stanford, UCSF; team spans neuroscience, electrical engineering, robotics, and microfab. - **High-profile leadership**: Elon Musk’s visibility draws talent, funding, and media attention. ## Strategic Focus - **Clinical expansion**: Scale the PRIME Study to more patients and new sites (Canada, additional countries). - **Product pipeline**: Commercialize Blindsight (vision) and speech prosthetics; develop motor/sensory restoration capabilities. - **Regulatory pathway**: Transition from trial-only to eventual commercial approval by the FDA. - **R&D**: Advance silent speech interfaces, cognitive enhancement, and broader neurological applications (epilepsy, depression, etc.). ## Why Work Here - **Mission-driven impact**: Work directly on technology that restores function and independence to people with paralysis, ALS, and blindness. - **Rapid growth**: 31% annual headcount increase; employees often advance quickly due to cross-functional, ambitious projects. - **Culture**: Open communication and collaboration champion “the best ideas, regardless of where they come from” ([neuralink.com/careers](https://neuralink.com/careers/)). - **Disciplines welcome**: Engineering (embedded, software, optical, analog IC), surgery/robotics, neuroscience, manufacturing, and operations. - **Perks & environment**: Fremont HQ with plans for a larger facility near Austin. Hands-on, lab-heavy work likely requires on-site presence. - **Career development**: Internal growth opportunities, exposure to cutting-edge science, and cross-team collaboration. ## Sources 1. [neuralink.com](https://neuralink.com/) 2. [neuralink.com/careers](https://neuralink.com/careers/) 3. [linkedin.com/company/neuralink](https://www.linkedin.com/company/neuralink) 4. [tracxn.com/d/companies/neuralink](https://tracxn.com/d/companies/neuralink/__oUVI98zbdmLZga1LgBRb3oGJJBxjbzTc7bMWUfAOLws) 5. 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