--- title: 'Principal ASIC Package Design Engineer at K2 Space' canonical: 'https://feeny.ai/job/principal-asic-package-design-engineer-k2-space-seattle-zy6mq67vnwa6' type: 'job' last_seen: '2026-09-20' --- # Principal ASIC Package Design Engineer at K2 Space - **Company:** K2 Space - **Location:** Seattle, WA - **Posted:** 2026-09-15 - **Last confirmed live:** 2026-09-20 - **Apply:** https://job-boards.greenhouse.io/k2spacecorporation/jobs/5425326008 ## Job description K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by over $1 billion in total funding from leading investors including Altimeter Capital, ICONIQ, Kleiner Perkins, Lightspeed Venture Partners, Redpoint Ventures, and T. Rowe Price — and with over $1 billion in signed contracts across commercial and US government customers, we're mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space. The rise of heavy-lift launch vehicles is shifting the industry from an era of mass constraint to one of mass abundance, and we believe this new era demands a fundamentally different class of spacecraft. Engineered to survive the harshest radiation environments and to fully capitalize on today's and tomorrow's massive rockets, K2 satellites deliver unmatched capability at constellation scale and across multiple orbits. With multiple launches in 2027 and plans to scale to 100 satellites a year, we're Building Bigger — helping develop the solar system and build toward a Kardashev Type II (K2) civilization. If you are a motivated individual who thrives in a fast-paced environment and you're excited about contributing to the success of a high-growth Series D-funded company, we'd love for you to apply. ## The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will operate as the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs. ## Responsibilities - Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints. - Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability. - Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration. - Establish organizational package design standards, methodologies, and best practices. - Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content. - Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning. - Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces. - Own package-level SI/PI strategy, including high-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design, and decoupling strategy - Lead thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling. - Manage relationships with external packaging vendors, substrate suppliers, and - OSATs, including vendor qualification, capability assessment, contract negotiation, and performance/quality score carding to ensure roadmap and volume commitments are met. - Drive material selection, substrate technology choices, and assembly process optimization. Required Qualifications - Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field. - 10+ years of experience in ASIC package design, with deep expertise in FC-BGA. - Proven experience delivering high-pin-count, high-performance ASIC packages into production. - Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs. - Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS. - Experience working directly with OSATs and substrate vendors. - Knowledge of packaging qualification and test methodologies. ## Preferred Qualifications - Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates). - Background in high-speed digital or mixed-signal SoCs. - Familiarity with aerospace, space, or high-reliability electronics. - Experience defining packaging strategy from early architecture through first silicon and volume ramp. - Demonstrated history of building or scaling package design methodology within an organization. Compensation and Benefits: - Base salary range for this role is $200,000 – $280,000 + equity in the company - Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level - Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks If you don’t meet 100% of the preferred skills and experience, we encourage you to still apply! Building a spacecraft unlike any other requires a team unlike any other and non-traditional career twists and turns are encouraged! If you need a reasonable accommodation as part of your application for employment or interviews with us, please let us know. Export Compliance As defined in the ITAR, “U.S. Persons” include U.S. citizens, lawful permanent residents (i.e., Green Card holders), and certain protected individuals (e.g., refugees/asylees, American Samoans). Please consult with a knowledgeable advisor if you are unsure whether you are a “U.S. Person.” The person hired for this role will have access to information and items controlled by U.S. export control regulations, including the export control regulations outlined in the International Traffic in Arms Regulation (ITAR). The person hired for this role must therefore either be a “U.S. person” as defined by [22 C.F.R. § 120.15](https://www.law.cornell.edu/cfr/text/22/120.15) or otherwise eligible for a federally issued export control license. ## Equal Opportunity K2 Space is an Equal Opportunity Employer; employment with K2 Space is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status. ## About K2 Space ## Company Overview - **One-liner**: K2 Space builds the largest, highest-power satellite platforms on orbit, enabling previously impossible missions across LEO, MEO, GEO, and cislunar space. - **Entity Type**: Private (Series C, $440.53M total raised) - **Headquarters**: Torrance, California, United States (Los Angeles area) - **Founded**: 2022 - **Founders**: Neel Kunjur (Co-Founder, CTO) and Karan Kunjur (Co-Founder, CEO) – both SpaceX veterans ## Core Business - **Primary industry**: Aerospace & Defense – satellite manufacturing and space platforms - **Target customers**: Government/military (DoD, Space Force), commercial satellite operators (e.g., SES), and mission integrators requiring high-power, large-format spacecraft - **Mission statement**: "Build bigger" – scale changes what’s possible; bigger satellites deliver more power, mass on orbit, and resilience at lower cost. ## Products & Services - **Mega Class Satellite Platform**: A high-power (20 kW), high-mass (3,000 kg payload) satellite bus designed for mass production and vertical integration. Suitable for LEO, MEO, GEO, and cislunar missions. Built in-house with radiation-tolerant architectures, redundant avionics, and high-Δv propulsion. - **Launch Stacking**: By stacking 10 Mega Class satellites per launch vehicle, K2 maximizes power to orbit (200 kW per launch), drastically reducing per-satellite launch costs. - **End-to-End Mission Services**: Design, build, integrate, and operate custom satellite missions for defense, communications, and sensing applications. ## Market Standing - **Valuation**: Not publicly disclosed - **Key Metric**: Total funding raised – $440.53M (Series C of $250M raised ~6 months ago, per CB Insights) - **Notable Investors**: Alpine Space Ventures, Altimeter Capital, Lightspeed, T. Rowe Price, Redpoint Ventures, and 20+ others - **Notable Partners/Contracts**: $30M military contract for a “Mega” satellite mission; partnership with SES to develop next-generation MEO network - **Growth Signals**: Headcount grew 106% YoY to 186 employees; active job postings up 391% YoY (172 open roles); plans for a three-orbit demonstration mission; Pentagon’s former space policy chief joined as Head of Strategy ## Competitive Advantages - **Size & Power Advantage**: Mega Class platform delivers 10x the power (20 kW vs. 2 kW) and significantly more mass than typical constellation satellites, enabling higher-performance payloads. - **Vertical Integration**: 80% of each satellite built in-house – drives reliability, accelerates production, and enables rapid iteration. - **Resilient Design**: Radiation-tolerant architectures, redundant avionics, and high-Δv propulsion allow operation in the harshest orbits (GEO, MEO, LEO, cislunar). - **Cost Efficiency**: Stacking 10 satellites per launch vehicle dramatically lowers per-unit launch cost, making large satellites economically viable. ## Strategic Focus - **Scale Production**: Series C funding directed toward scaling manufacturing capacity and building out the Torrance factory. - **Three-Orbit Demonstration**: Planning a mission to demonstrate capabilities across LEO, MEO, and GEO – a key milestone for customer validation. - **Defense & Commercial Expansion**: Pursuing military contracts (DoD, Space Force) and commercial partnerships (SES) to anchor long-term revenue. - **Talent Acquisition**: Aggressively hiring across avionics, mechanical, GNC, production, and program management roles to support rapid growth. ## Why Work Here - **Culture**: "First principles thinking" and a bias toward building big, ambitious hardware. The team includes many SpaceX, Anduril, and NASA JPL alumni. - **Work Environment**: Fast-paced startup with a focus on vertical integration and hands-on engineering. Office in Torrance, CA (Los Angeles area). Some roles (e.g., GNC) are remote-eligible. - **Growth Opportunity**: 106% headcount growth in the past year, 172+ open positions – strong career advancement potential. - **Perks & Mission**: Work on the largest satellites in the industry, directly impacting national security and next-generation space infrastructure. "Make previously impossible missions possible." - **Notable**: Active job postings include roles in avionics, mechanical engineering, production, RF payload, dynamics, and program management (TS/SCI clearance may be required for some roles). ## Sources 1. [K2 Space Official Website](https://www.k2space.com/) 2. [K2 Space Careers Page (Greenhouse)](https://job-boards.greenhouse.io/k2spacecorporation) 3. [LinkedIn – K2 Space Corporation](https://www.linkedin.com/company/k2-space) 4. [CB Insights – K2 Space Profile](https://www.cbinsights.com/company/k2-space) 5. [Bloomberg Technology – K2 Space Raises $110M Series B](https://www.bloomberg.com/news/articles/2025-07-07/k2-space-raises-110-million-to-scale-up-satellite-production) (referenced in search results) 6. [SES Partners with K2 Space – News Article](https://www.k2space.com/news) (referenced in search results) ## Other roles at K2 Space - [Principal Electrical Manufacturing Engineer](https://feeny.ai/job/principal-electrical-manufacturing-engineer-k2-space-los-angeles-34gwqat84bwb) — Los Angeles, CA - [Senior RF Hardware Engineer](https://feeny.ai/job/senior-rf-hardware-engineer-k2-space-los-angeles-m0y983gd2p7e) — Los Angeles, CA - [RF/mmWave Post-Silicon Validation Engineer](https://feeny.ai/job/rf-mmwave-post-silicon-validation-engineer-k2-space-seattle-p0g621sfnd4x) — Seattle, WA - [RF/mmWave Post-Silicon Validation Engineer](https://feeny.ai/job/rf-mmwave-post-silicon-validation-engineer-k2-space-los-angeles-9h97hah8p080) — Los Angeles, CA - [Serdes Characterization & Post-Silicon Validation Engineer](https://feeny.ai/job/serdes-characterization-post-silicon-validation-engineer-k2-space-seattle-gace2h81qqcz) — Seattle, WA - [Serdes Characterization & Post-Silicon Validation Engineer](https://feeny.ai/job/serdes-characterization-post-silicon-validation-engineer-k2-space-los-angeles-effzcqb4er0f) — Los Angeles, CA - [Senior MMIC Design Engineer](https://feeny.ai/job/senior-mmic-design-engineer-k2-space-seattle-xxgnx0ms3adw) — Seattle, WA - [Senior MMIC Design Engineer](https://feeny.ai/job/senior-mmic-design-engineer-k2-space-united-states-rgtc488g560k) — United States - [Senior Post-Silicon Validation Engineer](https://feeny.ai/job/senior-post-silicon-validation-engineer-k2-space-seattle-j5q9w621048g) — Seattle, WA - [Senior Post-Silicon Validation Engineer](https://feeny.ai/job/senior-post-silicon-validation-engineer-k2-space-los-angeles-p10c617dg818) — Los Angeles, CA