--- title: 'Principal IC Package Design Engineer at Ethernovia, Inc.' canonical: 'https://feeny.ai/job/principal-ic-package-design-engineer-ethernovia-inc-san-jose-1m1jzj8tpvnz' type: 'job' last_seen: '2026-11-08' --- # Principal IC Package Design Engineer at Ethernovia, Inc. - **Company:** Ethernovia, Inc. - **Location:** San Jose, CA - **Posted:** 2026-10-20 - **Last confirmed live:** 2026-11-08 - **Apply:** https://job-boards.greenhouse.io/ethernovia/jobs/5196271007 ## Job description About Ethernovia, Inc. Ethernovia is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics and other intelligent machines. Founded in 2018, the company’s breakthrough data transport and acceleration technology is ushering in a new era of connectivity and capabilities in the vehicle and at the edge, including highly reliable autonomy, over-the-air servicing and AI-backed applications. Ethernovia's co-founders are serial technology entrepreneurs with multiple prior successful ventures together. We are well-funded and backed by some of the worlds’ leading technology investors, having secured $154M ($90+M Series-B and $64M Series-A) in total funding to date: - [Ethernovia Raises Over $90 Million Series B to Scale Leading-Edge Autonomy and Physical AI Networking Chips](https://www.businesswire.com/news/home/20260120549197/en/Ethernovia-Raises-Over-%2490-Million-Series-B-to-Scale-Leading-Edge-Autonomy-and-Physical-AI-Networking-Chips) - [Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks | Business Wire](https://www.businesswire.com/news/home/20230515005222/en/Ethernovia-Raises-64-Million-to-Accelerate-the-Revolution-of-Vehicle-Networks/) - (financial backers include: Porsche SE, Qualcomm, AMD, Western Digital, Maverick Silicon, Socratic Partners, Conduit Capital, and CDIB-TEN Capital) Ethernovia has been recognized in EE Times' prestigious list of the Top 100 Startups for 2025. - March 2026: [Ethernovia Announces HSB-Enabled Networking Board for NVIDIA Holoscan Platforms](https://www.businesswire.com/news/home/20260316729719/en/Ethernovia-Announces-HSB-Enabled-Networking-Board-for-NVIDIA-Holoscan-Platforms) - January 2024: Our https://www.ethernovia.com/blog/ramin-named-motortrend-awards-winner/ - September 2023: [Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
 - Ethernovia](https://www.ethernovia.com/blog/continental-and-ethernovia-announce-partnership/) - [Connected Car News: Helios, Continental, Ethernovia, Avanci, BMW, Mapbox, Porsche, SEMA, Honda, UltraSense, Flex Logix, Diodes Inc., Garmin, Toyota & Caruso | auto connected car news](https://www.autoconnectedcar.com/2023/09/connected-car-news-helios-continental-ethernovia-avanci-bmw-mapbox-porsche-sema-honda-ultrasense-flex-logix-diodes-inc-garmin-toyota-caruso/#Continental_Ethernovia_for_SDVs) With talented employees on 4 continents, we have filed 50+ patents to date. Join Ethernovia’s team to make a lasting impact on the future of packet processor-centric networking solutions to support the real-time sensor, Physical AI, and control data demands of software-defined autonomy across vehicles, robots and intelligent machines. Come share in our success with pre-IPO shares, competitive compensation, and great benefits while growing your knowledge and career with world class talent. We are looking for talented engineers and leaders who have an entrepreneurial spirit and want to drive cutting edge designs from concept to silicon to the future of mobility. Principal IC Package Design Engineer Summary: We are seeking a visionary and deeply technical Principal IC Package Design Engineer to lead the architecture, design, and execution of advanced packaging solutions for our next-generation Ethernet switches and PHYs. You will be responsible for the entire package lifecycle—from early-stage feasibility and architectural definition to detailed layout, signal/power integrity (SI/PI) co-design, thermal management, and mass production release. This role requires a blend of deep technical expertise in advanced packaging technologies (e.g., Flip-Chip BGA, high-density substrates) and the leadership capability to collaborate across Silicon Design, Systems/PCB, Reliability, and external OSAT vendors. ## Key Responsibilities - Package Architecture & Feasibility: Lead the definition of package concepts, substrate stack-ups, bump/ball maps, and pinouts to optimize for system cost, electrical performance, and thermal constraints. - Detailed Package Design: Execute complex, high-speed, multi-layer package layouts (FCBGA, FCCSP, SiP) utilizing industry-standard EDA tools. - SI/PI & Thermal Co-Design: Partner closely with Signal/Power Integrity and Thermal engineers to ensure package designs meet stringent targets for high-speed SerDes (56G/112G+), power delivery networks (PDN), and thermal dissipation. - Substrate Design Integration: Define design rules and manage substrate layout, routing optimization, and manufacturing constraints (DFM/DFA). - OSAT & Vendor Management: Drive technical engagements with leading substrate suppliers and OSATs. Evaluate vendor capabilities, negotiate design rules, and resolve manufacturing/assembly issues during NPI (New Product Introduction) and production ramp. - Cross-Functional Collaboration: Act as the bridge between Silicon IC Design and System/PCB teams to ensure seamless chip-package-board co-design and optimization. - Technology Roadmap: Stay at the forefront of semiconductor packaging trends (e.g., advanced organic substrates, glass substrates, co-packaged optics) to influence Ethernovia’s long-term hardware roadmap. ## Qualifications & Skills Required Experience: - Education: B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. - 10+ years of direct experience in IC package design and architecture, ideally within high-speed networking, automotive electronics, or high-performance computing (HPC). Technical Expertise: - Advanced Packaging: Proven track record of delivering high-volume, complex Flip-Chip BGA (FCBGA), System-in-Package (SiP), and multi-chip module (MCM) designs. - EDA Tools: Expert proficiency in package design suites such as Cadence Allegro Package Designer (APD), SiP Layout, or Synopsys 3DIC Compiler. - Signal & Power Integrity Foundations: Strong understanding of electromagnetic theory, transmission lines, crosstalk, and PDN concepts. Familiarity with extraction tools (Ansys HFSS/Q3D, Cadence Clarity) is highly desirable. - Manufacturing Knowledge: Deep understanding of substrate fabrication processes, assembly line limits, and automotive-grade reliability standards (e.g., AEC-Q100 guidelines). Leadership & Soft Skills: - Strong problem-solving abilities with a data-driven approach to architectural trade-offs (e.g., performance vs. cost vs. yield). - Excellent communication skills, with the ability to articulate complex packaging constraints to cross-functional executives and external partners. What You Can Expect From Ethernovia: - Technology depth and breadth expansion that can’t be found in a large company - Opportunity to grow your career as the company grows - Pre IPO stock options - Cutting edge technology - World class team - Competitive base salary - Flexible hours - Medical, dental and vision insurance for employees Salary Range: - The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $200,000 - $265,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits. - Principals Only (No Agencies) #LI-Hybrid ## About Ethernovia, Inc. ## Company Overview - **One-liner**: Ethernovia develops high-performance Ethernet networking and packet-processing silicon to serve as the real-time data backbone for physical AI systems, including autonomous vehicles, robotics, and industrial automation. - **Entity Type**: Private (Series B) - **Headquarters**: San Jose, California, USA - **Founded**: 2018 - **Founders**: Ramin Shirani (CEO), Roy Myers (SVP Engineering), Hossein Sederat (CTO), Darren Engelkemier (VP Silicon Engineering) ## Core Business - **Primary industry/industries**: Semiconductor (networking chips), Autonomous Systems, Physical AI Infrastructure, Automotive - **Target customers**: OEMs and Tier-1 suppliers in automotive, robotics, industrial automation, and medical imaging; enterprises building autonomous and intelligent machines - **Mission or purpose statement**: To unify perception, decision, and action through Ethernet-based deterministic networks, acting as the "nervous system for intelligent machines" [ethernovia.com] ## Products & Services - **Ethernet PHYs and Switches**: Automotive-grade silicon supporting compute, ECU consolidation, and driver-assistance systems in vehicles [cbinsights.com] - **HSB-Enabled Networking Board for NVIDIA Holoscan**: A platform providing deterministically low-latency, high-bandwidth sensor data transport over Ethernet for edge AI systems, enabling real-time AI perception, control, and inference [ethernovia.com] - **Physical AI Infrastructure**: Software-defined Ethernet backbones for robotics, autonomous systems, and AI/SoC fabric interconnects with deterministic performance guarantees [ethernovia.com] ## Market Standing - **Valuation/Market Cap**: Not publicly disclosed - **Key Metric**: Total funding raised is $154M; latest round was a $90M+ Series B completed in early 2026 [cbinsights.com] - **Notable Investors/Partners**: Porsche Automobil Holding, Qualcomm Ventures, Maverick Capital, Fall Line Capital, Socratic Partners, and 10+ additional investors [cbinsights.com]. Technology partnership with NVIDIA for Holoscan platforms [ethernovia.com] - **Growth Signals**: Named as a "Challenger" alongside Qualcomm, NXP, and STMicroelectronics in vehicle networking equipment [cbinsights.com]; active hiring for 31 open positions across engineering, business development, and leadership roles [greenhouse.io]; 46 patents filed on network protocols, ethernet, and serial buses [cbinsights.com] ## Competitive Advantages - **First-mover in Physical AI networking**: Focused on deterministic Ethernet for real-world AI systems, a growing need distinct from cloud AI - **Deep automotive and semiconductor expertise**: Leadership team combines networking and silicon experience - **Strategic partnerships**: Certified integration with NVIDIA Holoscan platforms creates a strong ecosystem moat - **IP portfolio**: 46 patents covering core technology ## Strategic Focus - Scaling production of their networking chips for autonomy and Physical AI applications - Deepening integration with NVIDIA's ecosystem (Holoscan, Omniverse) - Expanding into robotics, autonomous systems, and industrial automation beyond automotive - Building out the software-defined networking layer to support sensor fusion and real-time AI inference at the edge ## Why Work Here - **Growth stage**: Actively scaling from R&D into production, offering significant career growth potential for engineers and leaders - **Technical challenges**: Working on the cutting edge of deterministic networking for AI systems—hardware, firmware, and software that must operate in real-world safety-critical environments - **Global presence**: Engineering offices in San Jose (HQ), Pune (India), Utrecht (Netherlands), Toronto (Canada), and China—offering diverse location options [greenhouse.io] - **Hybrid/remote flexibility**: Senior ASIC and software roles in the US and Canada are listed as "Remote" or "Hybrid" [greenhouse.io] - **Key open roles**: Directors and VPs (Strategy, Finance, Operations) in San Jose; Principal and Senior Engineers in multiple disciplines (ASIC, Embedded, Firmware, Python, AUTOSAR) across all locations; leadership roles in quality assurance and program management [greenhouse.io] - **Mission-driven**: Work on technology that powers autonomous vehicles, robots, and intelligent machines—tangible impact on physical world AI ## Sources 1. [ethernovia.com](https://www.ethernovia.com/) — Company description, products, and latest news 2. [Ethernovia Series B Announcement](https://www.ethernovia.com/news/ethernovia-raises-over-90-million-series-b-to-scale-leading-edge-autonomy-and-physical-ai-networking-chips/) — Funding details and market positioning 3. [Ethernovia HSB Platform for NVIDIA Holoscan](https://www.ethernovia.com/news/ethernovia-announces-hsb-enabled-networking-board-for-nvidia-holoscan-platforms/) — Product and partnership specifics 4. [Ethernovia Team Page](https://www.ethernovia.com/team/) — Founders and leadership 5. [Careers at Ethernovia](https://job-boards.greenhouse.io/ethernovia) — Open positions and locations 6. [CB Insights Profile](https://www.cbinsights.com/company/ethernovia) — Funding history, patents, competitors, and competitor analysis ## Other roles at Ethernovia, Inc. - [Senior Accountant (Semiconductor Industry)](https://feeny.ai/job/senior-accountant-semiconductor-industry-ethernovia-inc-san-jose-hey0a8frxjq3) — San Jose, CA - [Senior Principal Embedded Software Engineer](https://feeny.ai/job/senior-principal-embedded-software-engineer-ethernovia-inc-pune-qn82013m5vyv) — Pune, India - [Senior Developer-Python (Test Automation)](https://feeny.ai/job/senior-developer-python-test-automation-ethernovia-inc-pune-7v5q4a9jcqee) — Pune, India - [Head of Test Development Engineering](https://feeny.ai/job/head-of-test-development-engineering-ethernovia-inc-san-jose-h029fh16mhf7) — San Jose, CA - [Head of Product Development Engineering](https://feeny.ai/job/head-of-product-development-engineering-ethernovia-inc-san-jose-vz0gr5skkwp2) — San Jose, CA - [Protocol Validation Engineer (Exp 10+ Years)](https://feeny.ai/job/protocol-validation-engineer-exp-10-years-ethernovia-inc-pune-cxhqpjz79zzt) — Pune, India - [Lead Systems/DSP Engineer](https://feeny.ai/job/lead-systems-dsp-engineer-ethernovia-inc-san-jose-vgqecfqzjydb) — San Jose, CA - [Sr. Engineer -Tools and Automation](https://feeny.ai/job/sr-engineer-tools-and-automation-ethernovia-inc-pune-byzk7dad4d8m) — Pune, India - [AE-Protocol Developer](https://feeny.ai/job/ae-protocol-developer-ethernovia-inc-china-52949b12ft1r) — China - [Software Validation Engineer (Python)](https://feeny.ai/job/software-validation-engineer-python-ethernovia-inc-pune-ghyeajz10xks) — Pune, India