--- title: 'Principal Systems Packaging & Assembly Engineer at nEye.ai' canonical: 'https://feeny.ai/job/principal-systems-packaging-assembly-engineer-neye-ai-santa-clara-mbmxte9kq10c' type: 'job' last_seen: '2026-09-08' --- # Principal Systems Packaging & Assembly Engineer at nEye.ai - **Company:** nEye.ai - **Location:** Santa Clara, CA - **Compensation:** $180k–$240k - **Employment:** full-time - **Work type:** onsite - **Posted:** 2026-07-27 - **Last confirmed live:** 2026-09-08 - **Apply:** https://jobs.lever.co/neye-systems-inc./19ded46d-71d1-4494-a47b-8d691dea1689 ## Job description ## About us nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability. Job Overview We are seeking a Systems Packaging & Assembly Engineer to lead the development and integration of advanced packaging and assembly solutions for our MEMS-based silicon photonics switching platform. This role sits at the intersection of device engineering, packaging architecture, manufacturing engineering, and supply chain, driving packaging solutions from concept through high-volume production. The ideal candidate is a hands-on packaging expert with deep experience in optical modules, MEMS devices, semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional programs with OSATs, contract manufacturers, and internal engineering teams. This is a highly visible role responsible for bridging R&D and manufacturing, ensuring that our packaging architecture enables scalable production of high-performance optical switching systems. ## Key Responsibilities Package Design & System Integration - Define and codesign package substrates for MEMS-based silicon photonics optical switching systems. - Lead package and assembly integration of complex multi-component systems which include MEMs devices, photonic ICs, ASICs, substrates, and optical interfaces. - Drive mechanical, electrical, and optical integration strategies to ensure system performance, reliability, and manufacturability. - Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and system interfaces. Assembly Process Development - Optimize assembly processes including die attach, flip-chip, wire bonding, fiber attach/alignment, and hybrid integration. - Develop and implement fixtures, jigs, and tooling at our OSATs to support prototype builds and NPI. - Establish process flows, BOM structures, and manufacturing documentation for new products. - Identify opportunities for yield improvement, cost reduction, and cycle-time optimization. NPI & Manufacturing Ramp - Lead New Product Introduction (NPI) activities from prototype builds through production ramp. - Work closely with OSAT partners, contract manufacturers, and suppliers to meet our product requirements. - Drive process qualification, yield ramp, and reliability validation. - Implement root cause analysis (RCA), corrective actions, and failure analysis workflows. Supplier & Manufacturing Partner Management - Direct involvement with OSATs, substrate vendors, optics suppliers, and strategic partners. - Lead technology transfer from engineering to manufacturing partners. Program Management - Act as a technical program manager for packaging and assembly development across multiple engineering teams. - Coordinate activities between device engineering, system engineering, manufacturing, reliability, and supply chain. - Track program milestones and ensure packaging readiness aligns with product development timelines. Required Qualifications - Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. - 15+ years of experience in semiconductor or photonics packaging engineering. - Extensive experience in IC package design and back-end assembly process development in a manufacturing environment. - Strong background in advanced packaging technologies, such as: - Flip-chip and wirebond hybrid assemblies - ## BGA / FCBGA / CSP / WLCSP - Multi-die stacking (2.5D / 3D integration) - System-in-Package (SiP) - Proven experience driving NPI programs from concept to high-volume production. - Hands-on experience working with OSATs and contract manufacturers. - Strong knowledge of yield improvement, failure analysis, and process development. - Demonstrated ability to lead projects and guide engineers as a senior technical contributor. - Hands-on expertise with die bonders, dispensers, reflow/TCB tools, wirebonders, and interface metrology (CSAM, X-ray, AOI). - Strong background in materials characterization and statistical process control (DOE, FMEA, SPC) ## Preferred Experience - Experience with fiber attach and photonic IC packaging. - Background in optical transceivers, co-packaged optics, or photonics modules. - Experience with optical modules, photonics packaging, and/or MEMS devices. - Experience with optical alignment and hermetic packaging solutions. - Six Sigma certified - Familiarity with substrate layout tools and packaging design environments (Cadence SiP, AutoCAD, SolidWorks, etc.) nEye is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. ## About nEye.ai ## Company Overview - **One-liner**: nEye.ai develops ultra-low-power MEMS-based silicon photonic optical circuit switches (OCS) that eliminate connectivity bottlenecks in AI data centers, enabling direct optical links among thousands of GPUs. - **Entity Type**: Private (Series C funding stage) - **Headquarters**: Santa Clara, California, United States - **Founded**: 2020 - **Founders**: Ashish Vengsarkar (CEO), Ming Wu (Chief Scientist & Co-Founder), Tae Joon Seok (CTO & Co-Founder) ## Core Business - **Primary industry**: Semiconductor manufacturing (silicon photonics) / AI data center infrastructure - **Target customers**: Hyperscale data centers, cloud providers, AI/ML infrastructure operators (B2B, Enterprise) - **Mission**: To transform data center networks through innovative optical circuit switching technology, solving the most challenging problems in AI infrastructure. ## Products & Services - **[SuperSwitch](https://www.neye.ai)**: A chip-scale, high-radix optical circuit switch leveraging MEMS-based silicon photonics. It enables direct optical connections among GPUs and memory units, dramatically reducing power consumption and latency compared to electrical switches. Type: Hardware (silicon photonic switch). ## Market Standing - **Valuation/Market Cap**: Not publicly disclosed - **Key Metric**: Total funding of **$152.5M** across four rounds (Series A, B, C, and a corporate round) as of April 2026 - **Notable Investors/Partners**: Sutter Hill Ventures (led Series C, $80M, April 2026), CapitalG (led Series B, $58M, May 2025), TEDA (led Series A, $14.5M, September 2023) - **Growth Signals**: Headcount grew **+164.7% YoY** to 36 employees; 12 active job postings (up 300% YoY); filed 12 patents in photonics, fiber optics, and optical devices; key hires from Google, AWS, Ayar Labs, and Intel. ## Competitive Advantages - **MEMS + Silicon Photonics Integration**: Combines micro-electromechanical systems (MEMS) with silicon photonics on a single chip, enabling ultra-low power, high-radix switching in a compact form factor. - **Founding Team Depth**: Led by industry veterans with decades of experience at Bell Labs, UC Berkeley, Google, and successful optical startups (Photuris, Nistica). Chief Scientist Ming C. Wu is a renowned professor at UC Berkeley. - **Patented Technology**: 12 granted/pending patents covering lidar, photonic switch arrays, and optical devices. - **Hyperscaler Relevance**: Directly addresses the critical bottleneck in AI cluster networking, a problem actively being tackled by major cloud providers. ## Strategic Focus - **Scaling Engineering & Operations**: Heavily hiring across MEMS design, photonics, silicon photonics layout, test systems, and lab operations to accelerate product development and deployment. - **Hyperscale Deployment**: Targeting volume production and integration into the world’s largest AI data centers, leveraging team members’ prior experience at Google and AWS. - **Product Maturation**: Moving from prototype to commercial-grade SuperSwitch, with emphasis on reliability, yield, and cost efficiency. ## Why Work Here - **Mission-Driven**: Tackle one of the hardest problems in AI infrastructure – optical connectivity at scale. - **On-Site Culture**: Roles are based in Santa Clara, CA (with an additional Berkeley office), fostering close collaboration among a tight-knit, highly technical team. - **Impact & Ownership**: Small team (~36 people) means engineers have broad responsibility and direct influence on product direction. - **Veteran Leadership**: Work alongside former Google, Bell Labs, and successful startup leaders who have raised over $100M and achieved multiple exits. - **Growth Trajectory**: Rapid headcount growth and significant venture backing signal a company in an aggressive scaling phase, offering career advancement opportunities. ## Sources 1. [LinkedIn – nEye Systems Company Page](https://linkedin.com/company/neye-systems) 2. [CB Insights – nEye Systems Profile](https://www.cbinsights.com/company/neye-systems) 3. [nEye.ai About Us](https://www.neye.ai/about-us) 4. [nEye.ai Join Us / Careers](https://www.neye.ai/join-us) 5. [Lever Jobs – nEye Systems Openings](https://jobs.lever.co/neye-systems-inc) ## Other roles at nEye.ai - [Senior Silicon Photonics Designer](https://feeny.ai/job/senior-silicon-photonics-designer-neye-ai-santa-clara-eqqy2cje2bz7) — Santa Clara, CA - [Photonics Test Technician](https://feeny.ai/job/photonics-test-technician-neye-ai-santa-clara-5w5004d6mgd3) — Santa Clara, CA - [Senior Mechanical Engineer](https://feeny.ai/job/senior-mechanical-engineer-neye-ai-santa-clara-xk1zjs81pyr2) — Santa Clara, CA - [Principal Packaging Engineer, Optical Interfaces](https://feeny.ai/job/principal-packaging-engineer-optical-interfaces-neye-ai-santa-clara-r6c27ht76z0w) — Santa Clara, CA - [Principal Wafer Bonding Integration Engineer](https://feeny.ai/job/principal-wafer-bonding-integration-engineer-neye-ai-santa-clara-7q9fv5rjjgcs) — Santa Clara, CA - [Senior Foundry Integration Engineer](https://feeny.ai/job/senior-foundry-integration-engineer-neye-ai-santa-clara-6s3mws7xah38) — Santa Clara, CA - [Purchasing Specialist](https://feeny.ai/job/purchasing-specialist-neye-ai-santa-clara-d7cs13xv9w7a) — Santa Clara, CA - [Lab Operations, Facilities and Equipment Manager](https://feeny.ai/job/lab-operations-facilities-and-equipment-manager-neye-ai-santa-clara-and-1qv3ypwcxjcm) — Santa Clara and Emeryville, CA - [Director of Finance](https://feeny.ai/job/director-of-finance-neye-ai-santa-clara-xpx7epw3tzrn) — Santa Clara, CA - [Photonics Lab Operator](https://feeny.ai/job/photonics-lab-operator-neye-ai-santa-clara-naj10gc81s1g) — Santa Clara, CA