--- title: 'Principal Wafer Bonding Integration Engineer at nEye.ai' canonical: 'https://feeny.ai/job/principal-wafer-bonding-integration-engineer-neye-ai-santa-clara-7q9fv5rjjgcs' type: 'job' last_seen: '2026-09-08' --- # Principal Wafer Bonding Integration Engineer at nEye.ai - **Company:** nEye.ai - **Location:** Santa Clara, CA - **Compensation:** $160k–$220k - **Employment:** full-time - **Work type:** onsite - **Posted:** 2026-07-27 - **Last confirmed live:** 2026-09-08 - **Apply:** https://jobs.lever.co/neye-systems-inc./e685c59a-59bf-42be-b627-f1a6f71ed57d ## Job description ## About us nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's OCS is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability. ## Role Overview We are seeking a Wafer Bonding Integration Engineer to lead the development, integration, and manufacturing transfer of advanced wafer bonding processes that are foundational to nEye's next-generation optical switching products. This is a highly cross-functional role sitting at the intersection of product engineering, process integration, and manufacturing. You will partner closely with internal design teams and external foundry partners to develop robust wafer bonding solutions, drive new product introduction (NPI), and enable successful transition into volume manufacturing. The ideal candidate combines deep technical expertise in wafer bonding with strong product integration experience and enjoys working directly with foundries to solve complex manufacturing challenges. Candidates with foundry process integration, advanced packaging, MEMS, silicon photonics, or Technical Service Engineering experience are encouraged to apply. ## Key Responsibilities Product Development & Manufacturing Integration - Own wafer bonding integration strategy from early product development through high-volume manufacturing. - Partner with design engineering, process development teams, and external foundries to develop robust manufacturing flows. - Lead process transfer activities and ensure manufacturable, repeatable bonding solutions across multiple foundry partners. - Serve as the primary technical interface between nEye engineering teams and external fabrication partners throughout NPI. - Drive process readiness for new product introductions, ensuring schedule, yield, quality, and reliability objectives are achieved. Wafer Bonding Process Integration - Develop and optimize advanced wafer bonding processes including: - Fusion Bonding - Eutectic Bonding - Hybrid Bonding - Direct Wafer Bonding - (Anodic bonding experience is beneficial but not required) - Define bonding process windows, alignment strategies, thermal budgets, and material compatibility. - Optimize surface preparation, cleaning, activation, CMP requirements, and post-bond processing. - Develop integration strategies that balance bonding performance with downstream manufacturing requirements. - Collaborate with packaging and process integration teams on bonded wafer architectures. Foundry Collaboration - Lead technical engagement with external foundries throughout process development and manufacturing. - Support tape-outs, process qualifications, engineering builds, and production ramps. - Review process data, SPC metrics, excursion reports, and corrective actions with foundry partners. - Drive continuous improvements in yield, manufacturability, reliability, and cost. - Coordinate engineering experiments and process characterization across multiple manufacturing partners. Yield Improvement & Failure Analysis - Analyze wafer-level metrology and inspection data to identify process limitations and failure mechanisms. - Lead root cause investigations involving bonding defects such as: - voids - delamination - alignment errors - particle contamination - bond strength failures - Work closely with FA laboratories and foundries to implement corrective actions. - Drive continuous yield improvement initiatives using statistical methods and structured problem-solving tools. Required Experience - BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, MEMS, or a related technical discipline. - 10+ years of experience in new product introduction with ownership in wafer process integration, advanced packaging, CMOS manufacturing. - Hands-on and product development expertise with one or more advanced wafer bonding technologies, including: - Fusion Bonding - Eutectic Bonding - Hybrid Bonding - Direct Bonding - Experience with TSV integration, wafer thinning, cavity SOI, or 3D integration technologies. - Experience supporting products through NPI and manufacturing ramp. - Strong understanding of wafer-level process integration and manufacturing interactions. - Experience working directly with semiconductor foundries or external manufacturing partners. - Strong understanding of SPC, DOE, process characterization, yield improvement, and statistical analysis. ## Preferred Experience - Experience in MEMS, silicon photonics, advanced packaging, or heterogeneous integration. - TSE experience supporting semiconductor customers or foundries. - Familiarity with wafer-level metrology techniques including SEM, IR inspection, profilometry, C-SAM, AFM, or similar analytical tools. - Experience leading cross-functional engineering efforts between design, manufacturing, and suppliers. - Working knowledge of 8D, FMEA, Six Sigma, and structured root cause methodologies. - Comfortable operating in a fast-paced startup environment where engineers have broad technical ownership. nEye is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. ## About nEye.ai ## Company Overview - **One-liner**: nEye.ai develops ultra-low-power MEMS-based silicon photonic optical circuit switches (OCS) that eliminate connectivity bottlenecks in AI data centers, enabling direct optical links among thousands of GPUs. - **Entity Type**: Private (Series C funding stage) - **Headquarters**: Santa Clara, California, United States - **Founded**: 2020 - **Founders**: Ashish Vengsarkar (CEO), Ming Wu (Chief Scientist & Co-Founder), Tae Joon Seok (CTO & Co-Founder) ## Core Business - **Primary industry**: Semiconductor manufacturing (silicon photonics) / AI data center infrastructure - **Target customers**: Hyperscale data centers, cloud providers, AI/ML infrastructure operators (B2B, Enterprise) - **Mission**: To transform data center networks through innovative optical circuit switching technology, solving the most challenging problems in AI infrastructure. ## Products & Services - **[SuperSwitch](https://www.neye.ai)**: A chip-scale, high-radix optical circuit switch leveraging MEMS-based silicon photonics. It enables direct optical connections among GPUs and memory units, dramatically reducing power consumption and latency compared to electrical switches. Type: Hardware (silicon photonic switch). ## Market Standing - **Valuation/Market Cap**: Not publicly disclosed - **Key Metric**: Total funding of **$152.5M** across four rounds (Series A, B, C, and a corporate round) as of April 2026 - **Notable Investors/Partners**: Sutter Hill Ventures (led Series C, $80M, April 2026), CapitalG (led Series B, $58M, May 2025), TEDA (led Series A, $14.5M, September 2023) - **Growth Signals**: Headcount grew **+164.7% YoY** to 36 employees; 12 active job postings (up 300% YoY); filed 12 patents in photonics, fiber optics, and optical devices; key hires from Google, AWS, Ayar Labs, and Intel. ## Competitive Advantages - **MEMS + Silicon Photonics Integration**: Combines micro-electromechanical systems (MEMS) with silicon photonics on a single chip, enabling ultra-low power, high-radix switching in a compact form factor. - **Founding Team Depth**: Led by industry veterans with decades of experience at Bell Labs, UC Berkeley, Google, and successful optical startups (Photuris, Nistica). Chief Scientist Ming C. Wu is a renowned professor at UC Berkeley. - **Patented Technology**: 12 granted/pending patents covering lidar, photonic switch arrays, and optical devices. - **Hyperscaler Relevance**: Directly addresses the critical bottleneck in AI cluster networking, a problem actively being tackled by major cloud providers. ## Strategic Focus - **Scaling Engineering & Operations**: Heavily hiring across MEMS design, photonics, silicon photonics layout, test systems, and lab operations to accelerate product development and deployment. - **Hyperscale Deployment**: Targeting volume production and integration into the world’s largest AI data centers, leveraging team members’ prior experience at Google and AWS. - **Product Maturation**: Moving from prototype to commercial-grade SuperSwitch, with emphasis on reliability, yield, and cost efficiency. ## Why Work Here - **Mission-Driven**: Tackle one of the hardest problems in AI infrastructure – optical connectivity at scale. - **On-Site Culture**: Roles are based in Santa Clara, CA (with an additional Berkeley office), fostering close collaboration among a tight-knit, highly technical team. - **Impact & Ownership**: Small team (~36 people) means engineers have broad responsibility and direct influence on product direction. - **Veteran Leadership**: Work alongside former Google, Bell Labs, and successful startup leaders who have raised over $100M and achieved multiple exits. - **Growth Trajectory**: Rapid headcount growth and significant venture backing signal a company in an aggressive scaling phase, offering career advancement opportunities. ## Sources 1. [LinkedIn – nEye Systems Company Page](https://linkedin.com/company/neye-systems) 2. [CB Insights – nEye Systems Profile](https://www.cbinsights.com/company/neye-systems) 3. [nEye.ai About Us](https://www.neye.ai/about-us) 4. [nEye.ai Join Us / Careers](https://www.neye.ai/join-us) 5. [Lever Jobs – nEye Systems Openings](https://jobs.lever.co/neye-systems-inc) ## Other roles at nEye.ai - [Senior Silicon Photonics Designer](https://feeny.ai/job/senior-silicon-photonics-designer-neye-ai-santa-clara-eqqy2cje2bz7) — Santa Clara, CA - [Photonics Test Technician](https://feeny.ai/job/photonics-test-technician-neye-ai-santa-clara-5w5004d6mgd3) — Santa Clara, CA - [Senior Mechanical Engineer](https://feeny.ai/job/senior-mechanical-engineer-neye-ai-santa-clara-xk1zjs81pyr2) — Santa Clara, CA - [Principal Systems Packaging & Assembly Engineer](https://feeny.ai/job/principal-systems-packaging-assembly-engineer-neye-ai-santa-clara-mbmxte9kq10c) — Santa Clara, CA - [Principal Packaging Engineer, Optical Interfaces](https://feeny.ai/job/principal-packaging-engineer-optical-interfaces-neye-ai-santa-clara-r6c27ht76z0w) — Santa Clara, CA - [Senior Foundry Integration Engineer](https://feeny.ai/job/senior-foundry-integration-engineer-neye-ai-santa-clara-6s3mws7xah38) — Santa Clara, CA - [Purchasing Specialist](https://feeny.ai/job/purchasing-specialist-neye-ai-santa-clara-d7cs13xv9w7a) — Santa Clara, CA - [Lab Operations, Facilities and Equipment Manager](https://feeny.ai/job/lab-operations-facilities-and-equipment-manager-neye-ai-santa-clara-and-1qv3ypwcxjcm) — Santa Clara and Emeryville, CA - [Director of Finance](https://feeny.ai/job/director-of-finance-neye-ai-santa-clara-xpx7epw3tzrn) — Santa Clara, CA - [Photonics Lab Operator](https://feeny.ai/job/photonics-lab-operator-neye-ai-santa-clara-naj10gc81s1g) — Santa Clara, CA