---
title: 'Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis) at SpaceX'
canonical: 'https://feeny.ai/job/process-engineer-gold-to-gold-interconnect-flip-chip-assembly-starlink-akoustis-bhyx7g9gfh1f'
type: 'job'
last_seen: '2026-11-03'
---

# Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis) at SpaceX

- **Company:** SpaceX
- **Location:** Bastrop, TX
- **Posted:** 2026-11-02
- **Last confirmed live:** 2026-11-03
- **Apply:** https://boards.greenhouse.io/spacex/jobs/8925695002?gh_jid=8925695002

## Job description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

PROCESS ENGINEER, GOLD-TO-GOLD INTERCONNECT & FLIP-CHIP ASSEMBLY (STARLINK/AKOUSTIS)

Akoustis is now operating as a wholly owned subsidiary of SpaceX providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary, while also connecting the world through Starlink. Our work helps further the impact that Starlink is already making on millions of users around the world, while allowing us to broaden that reach dramatically and continue connecting the unconnected here on earth.

We are looking for a hands-on Process Engineer to develop, optimize, qualify, and implement advanced IC assembly processes, with a focus on Gold-to-Gold Interconnect (GGI) and thermosonic flip-chip bonding. You will take processes from early prototype through production ramp, working directly with equipment and with package engineering, design, manufacturing, reliability, materials, and supply-chain partners.

## RESPONSIBILITIES

- Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength
- Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability
- Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed
- Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection
- Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability
- Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers
- Run DOEs, capability studies, and SPC on critical parameters; write process specs, work instructions, control plans, FMEAs, and qualification reports
- Drive NPI from prototype through qualification and production release; perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM)
- Correlate process settings to electrical, mechanical, and reliability results; apply DFM and own schedules, risks, and production readiness for assigned technologies

## BASIC QUALIFICATIONS

- Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
- 2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience (Internship or extracurricular experience is applicable)

## PREFERRED SKILLS AND EXPERIENCE

- 3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work
- Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces
- Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills
- Understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination
- DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans
- Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect characterization (contact resistance, shear/pull, bond integrity)
- Package reliability testing and standards (JEDEC, IPC), plus experience supporting OSATs or contract manufacturers through development, qualification, and ramp
- CAD (AutoCAD) and familiarity with simulation tools (ANSYS, COMSOL, or similar) is a plus; data analysis with JMP, Minitab, MATLAB, or Python is a plus
- Experience qualifying new assembly equipment and tooling and troubleshooting issues directly on the manufacturing floor

## ADDITIONAL REQUIREMENTS

- Onsite in Bastrop, TX (not remote or hybrid)
- Up to 20% domestic and international travel for supplier and manufacturing support
- Willingness to work extended hours or weekends to support key milestones
- Ability to work in a semiconductor manufacturing environment, follow safety and cleanroom requirements, and perform light physical tasks (including lifting up to 25 lbs and handling wafers, substrates, packages, tooling, and assembly samples)
- Strong written and verbal communication skills with engineering, manufacturing, suppliers, and management

## ITAR REQUIREMENTS:

- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR [here](https://www.pmddtc.state.gov/?id=ddtc_kb_article_page&sys_id=24d528fddbfc930044f9ff621f961987).

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.

## About SpaceX

## Company Overview
- **One-liner**: SpaceX designs, manufactures, and launches advanced rockets and spacecraft while building a global satellite broadband network and AI infrastructure to enable interplanetary life.
- **Entity Type**: Public (Nasdaq: SPCX) – IPO priced at $135/share on June 12, 2026
- **Headquarters**: Starbase, Texas (primary); Hawthorne, California (historical headquarters)
- **Founded**: 2002
- **Founders**: Elon Musk

## Core Business
- **Industries**: Aerospace & Defense, Spaceflight, Satellite Telecommunications, Artificial Intelligence
- **Target Customers**: Government (NASA, U.S. Armed Forces, international agencies), Commercial satellite operators, Broadband consumers (Starlink), Defense/intelligence (Starshield)
- **Mission**: To make humanity multiplanetary by building the integrated hardware and software infrastructure of the future across space, connectivity, and AI.

## Products & Services
- **Falcon 9**: Reusable two-stage rocket – the world’s most launched orbital rocket, with over 630 successful first-stage reflights.
- **Falcon Heavy**: Heavy-lift launch vehicle composed of three Falcon 9 cores; capable of lifting nearly 64 metric tons to orbit.
- **Starship**: Fully reusable super-heavy launch vehicle and spacecraft (largest ever built) designed for missions to the Moon, Mars, and beyond.
- **Dragon 2**: Crew and cargo spacecraft used for NASA Commercial Crew and private missions to the ISS and beyond.
- **Starlink**: Low-Earth-orbit satellite constellation providing high-speed, low-latency broadband internet to over 10.3 million people globally.
- **Starshield**: Military-grade satellite services for national security and defense customers.
- **SpaceXAI**: Division focused on AI compute infrastructure, frontier models, and real-time data processing (including AI compute satellites).

## Market Standing
- **Valuation**: Conflicting reports – Internal share offer in 2025 valued SpaceX at **$800 billion**; IPO pricing (June 2026) implied a market capitalization of approximately **$75 billion** for the shares offered.
- **Key Metric**: Annual revenue of **$15.0 billion** (2025); total funding raised **$15.2 billion** across 56 rounds.
- **Notable Investors/Partners**: Google (led $1B Series G), Intesa Sanpaolo, NASA, U.S. Space Force, and numerous institutional investors.
- **Growth Signals**: Employee headcount of **11,387** (monthly growth +2.5%); **1,671 active job postings**; Falcon 9 launch cadence of 1–3 per week; Starlink subscriber base covering ~10.3 million people; recent acquisition of xAI (February 2026).

## Competitive Advantages
- **Full reusability**: Only company with a fleet of reusable orbital rockets (Falcon 9, Falcon Heavy), dramatically lowering per-launch cost.
- **Vertical integration**: Designs, manufactures, and operates its own rockets, spacecraft, satellite constellation, and AI platform – enabling rapid iteration and cost control.
- **Scale and reliability**: More orbital launches per year than any other provider (public or private); proven track record with NASA and DoD.
- **First-mover in commercial spaceflight**: Established crew transport, satellite internet, and now AI compute in orbit.

## Strategic Focus
- **Starship development**: Complete testing and operational deployment of the fully reusable Starship system for lunar (Artemis) and Mars missions.
- **Starlink expansion**: Grow subscriber base, launch V3 satellites, and extend mobile and direct-to-cell services.
- **AI integration**: Leverage SpaceXAI for on-orbit compute and real-time data analytics; build AI compute satellites.
- **Interplanetary infrastructure**: Develop technologies for sustained human presence on the Moon and Mars.

## Why Work Here
- **Mission-driven culture**: Employees directly contribute to making life multiplanetary – “hard work and innovative solutions result in big gains.”
- **Impactful projects**: Work on reusable rockets, crewed spacecraft, global broadband, and AI systems that are actively changing the space industry.
- **Compensation**: Competitive salaries, comprehensive health benefits, and equity packages.
- **Work locations**: Primary campuses in Hawthorne, CA and Starbase, TX (with additional sites in Cape Canaveral, FL and Vandenberg, CA). Roles span engineering, software, manufacturing, and support.
- **Engineering culture**: Merit-based, fast-paced, with high ownership; top talent sourced from Tesla, Boeing, NASA JPL, and other aerospace leaders.
- **Open roles**: Over 1,600 active positions across software, AI, avionics, propulsion, supply chain, and more – including internships.

## Sources
1. [SpaceX Careers Page](https://www.spacex.com/careers)
2. [LinkedIn – SpaceX Company Profile](https://www.linkedin.com/company/spacex)
3. [SpaceX IPO Factsheet (PDF)](https://content.spacex.com/cms-assets/FINAL_Documents%20and%20Updates/SpaceX%20IPO_Factsheet.pdf)
4. [SpaceX IPO Pricing Press Release](https://ir.spacex.com/updates/releases-details/2026/Space-Exploration-Technologies-Corp--Announces-Pricing-of-Initial-Public-Offering/default.aspx)
5. [SpaceX Jobs Board (Greenhouse)](https://job-boards.greenhouse.io/spacex)

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