--- title: 'Process Integration Engineer at Absolics Inc' canonical: 'https://feeny.ai/job/process-integration-engineer-absolics-inc-covington-g5d4df4fjwn8' type: 'job' last_seen: '2026-09-13' --- # Process Integration Engineer at Absolics Inc - **Company:** Absolics Inc - **Location:** Covington, GA - **Posted:** 2026-07-01 - **Last confirmed live:** 2026-09-13 - **Apply:** https://job-boards.greenhouse.io/absolicsinc/jobs/4303962009 ## Job description Job Title: R&D Engineer - Process Integration Location: Covington, GA Job Type: Full-Time About Us: Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions. Job Description: We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as: - dielectric materials selection and application - lithography - wet + dry clean/etch/develop processes - PVD and electroplating into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow. You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility. In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions. Key Responsibilities: - Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management. - Develop and implement process integration strategies to optimize production yield and efficiency. - Coordinate with cross-functional teams to ensure seamless integration of processes. - Monitor and analyze process performance, identifying areas for improvement. - Ensure compliance with industry standards and safety regulations. - Troubleshoot and resolve process-related issues in a timely manner. - Maintain detailed documentation of processes and procedures. - Generate innovative ideas for patent filings. Required Skills: - Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up - Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs - Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation - Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch) - Statistical process control and DOE methodology for multi-variable, multi-step process optimization - Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa - Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test) - Understanding of registration, overlay, and CD budget allocation across sequential build-up layers - Fluent in English; proficiency in Korean is a plus. ## Preferred Skills - Experience with glass core substrates - Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges - Experience with any next-gen architecture enablement: glass core/glass interposer integration, panel-level processing, co-packaged optics, hybrid bonding, or fan-out heterogeneous integration - Familiarity with bifurcated roadmap considerations (high-performance AI/HPC vs. cost-optimized mainstream paths) and how that shapes architecture and material tradeoffs - Experience building DFM (design-for-manufacturing) guidelines in collaboration with package design teams - Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices - Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel-level CMP, advanced laser/plasma drill, novel dielectric chemistries) - Experience presenting integration roadmaps or technical reviews to leadership or cross-functional stakeholders - Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration Education - Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred - M.S. with 5+ years of relevant process integration or process engineering experience considered (integration roles typically warrant a higher experience bar than single-unit-process roles) Benefits: - 401K 6% matching (NO vesting period) - Healthcare 100% support (Health, Dental, Vision) - Life, STD, LTD 100 % support - Cell phone allowance - PTO and self-development ## SALARY: - $100,000 – $150,000 ## About Absolics Inc ## Company Overview - **One-liner**: Absolics Inc. is the world's first glass substrate manufacturer, providing advanced packaging technologies and scalable solutions for high-performance computing (HPC) and AI semiconductor applications. - **Entity Type**: Private (affiliate of SKC, part of SK Group) - **Headquarters**: Covington, Georgia, United States - **Founded**: 2021 - **Founders**: Not publicly available (company was established as an affiliate of SKC) ## Core Business - **Primary industry**: Semiconductor Manufacturing / Advanced Packaging - **Target customers**: B2B – HPC-related packaging companies, data centers, AI chip manufacturers, and high-tech industry leaders - **Mission or purpose**: To create a new chapter in the history of the semiconductor industry by solving fundamental substrate limitations with glass-based solutions. ## Products & Services - **Glass Substrate Solutions**: A proprietary glass substrate technology that significantly improves signaling characteristics and reduces power consumption compared to traditional silicon-based substrates. It enables fine patterns, large areas, and lower power consumption for advanced packaging. Type: Hardware / Semiconductor Material - **Advanced Packaging Services**: Scalable packaging services for businesses involved in high-performance computing, leveraging glass substrate innovation. Type: Service / Manufacturing ## Market Standing - **Valuation/Market Cap**: Not disclosed (Private company) - **Key Metric**: Total Funding – **$175.0M** (from U.S. Department of Commerce grants, see below) - **Notable Investors/Partners**: - **U.S. Department of Commerce** (two grants: $75M in May 2024, $100M in January 2025) [absolicsinc.com](https://www.absolicsinc.com/) - Parent: **SKC** (affiliate of **SK Group**, which includes SK Hynix, SK Siltron, and SK Materials) - **Growth Signals**: - Headcount grew **48.8% YoY** (+40 people), now at **76 employees** [linkedin.com](https://www.linkedin.com/company/absolics-inc) - The advanced packaging market is expected to grow from $3.5B (2020) to $9.7B (2025); glass substrate segment forecast at $3.0B (2025) with 25% CAGR [absolicsinc.com](https://www.absolicsinc.com/) - Recent news: Absolics received $100M in U.S. R&D grants (2024-2025), building a computer chip factory in Georgia [eeNews Europe](https://www.eenewseurope.com/) - Active job postings: 9 positions (quarterly job posting growth: +800%) [linkedin.com](https://www.linkedin.com/company/absolics-inc) ## Competitive Advantages - **First-mover in glass substrates**: Absolics is the world's first dedicated glass substrate manufacturer, positioning it at the forefront of a key advanced packaging innovation. - **Deep SK Group ecosystem**: Backed by SKC and SK Group (SK Hynix, SK Siltron, SK Materials), providing strong supply chain integration, capital, and industry connections. - **Significant U.S. government backing**: $175M in federal grants directly from the CHIPS Act, signaling strategic national importance and long-term stability. - **Performance moat**: Glass substrates offer superior signaling, lower power consumption, and larger form factors – critical for AI and HPC chips where traditional silicon substrates are hitting physical limits. ## Strategic Focus - **Scaling manufacturing**: Building a U.S. factory in Georgia to mass-produce glass substrates for the domestic semiconductor ecosystem. - **R&D leadership**: Continued innovation in active/passive element integration on glass, targeting next-generation HPC and AI packaging needs. - **Market capture**: Targeting the rapidly growing advanced packaging market ($9.7B by 2025), with glass substrates as a key growth driver. ## Why Work Here - **Pioneering technology**: Join the first company in the world manufacturing glass substrates for semiconductors – a chance to work on cutting-edge tech that could reshape the industry. - **Rapid growth**: Headcount grew ~49% YoY, indicating a scaling phase with ample career advancement opportunities. - **Government-backed stability**: $175M in federal grants provides strong financial footing and long-term project security. - **Office policy**: On-site work at the Covington, Georgia headquarters [builtin.com](https://builtin.com/company/absolics-inc) – collaborative environment in a new, state-of-the-art facility. - **Engineering-heavy culture**: 25% of staff in technical roles, 13% in operations, and active hiring for engineers (NPI Process Engineer, Photoresist Engineering Manager, etc.) [linkedin.com](https://www.linkedin.com/company/absolics-inc) - **Global exposure**: While HQ is in Georgia, the company has presence in South Korea and Mexico, offering cross-cultural collaboration. ## Sources 1. [absolicsinc.com](https://www.absolicsinc.com/) 2. [absolicsinc.com/about](https://www.absolicsinc.com/about) 3. [absolicsinc.com/job](https://www.absolicsinc.com/job) 4. [linkedin.com/company/absolics-inc](https://www.linkedin.com/company/absolics-inc) 5. [builtin.com/company/absolics-inc](https://builtin.com/company/absolics-inc) ## Other roles at Absolics Inc - [Human Resources Specialist](https://feeny.ai/job/human-resources-specialist-absolics-inc-covington-bkgpe6537m2n) — Covington, GA - [NPI Process Engineer](https://feeny.ai/job/npi-process-engineer-absolics-inc-covington-jkq6p72aaydt) — Covington, GA - [Photo Process Engineer](https://feeny.ai/job/photo-process-engineer-absolics-inc-covington-srew40vkj6vn) — Covington, GA - [Plasma Dry Etch Engineer](https://feeny.ai/job/plasma-dry-etch-engineer-absolics-inc-covington-v9grp6t1h22j) — Covington, GA - [Dielectric and Polymer Materials Engineer](https://feeny.ai/job/dielectric-and-polymer-materials-engineer-absolics-inc-covington-8cvb0ervetam) — Covington, GA - [Dry / Lami Process Engineer](https://feeny.ai/job/dry-lami-process-engineer-absolics-inc-covington-523p18t5byp7) — Covington, GA - [Engineering Technician](https://feeny.ai/job/engineering-technician-absolics-inc-covington-wajqqpf8w37a) — Covington, GA - [IT & Security MIS Manager](https://feeny.ai/job/it-security-mis-manager-absolics-inc-covington-jh9hbsnx6mtk) — Covington, GA - [SPC Data Control Engineer](https://feeny.ai/job/spc-data-control-engineer-absolics-inc-covington-xav4c3swzry8) — Covington, GA - [Plating Process Engineer](https://feeny.ai/job/plating-process-engineer-absolics-inc-covington-kzknyzhn0anr) — Covington, GA