---
title: 'Program Management - Principal / Sr. Principal Technical Program Manager – IP, ASIC & Chiplet Platforms at Eliyan'
canonical: 'https://feeny.ai/job/program-management-principal-sr-principal-technical-program-manager-ip-asic-29s06vbpaq89'
type: 'job'
last_seen: '2026-09-07'
---

# Program Management - Principal / Sr. Principal Technical Program Manager – IP, ASIC & Chiplet Platforms at Eliyan

- **Company:** Eliyan
- **Location:** Bay Area
- **Employment:** full-time
- **Work type:** onsite
- **Posted:** 2026-08-07
- **Last confirmed live:** 2026-09-07
- **Apply:** https://jobs.lever.co/eliyan/09099b9d-3f7b-434c-9b28-2dc5df4b6078

## Job description

## ON-SITE (BAY AREA)

Join the leading chiplet startup! As an Eliyan Principal Technical Program Manager, you will be working at a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet based systems with best-in-class power, area, manufacturability, and design flexibility. You will be responsible for leading, planning, and help execute ASIC development and platform program. You will work with a cross-functional team of experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits.

Key Responsibilities:

- Program Leadership: Own end-to-end execution of IP, ASIC, and platform programs, from architecture and IP definition through design, verification, validation, silicon bring-up, and production readiness.
- Plan of Record & Critical Path Management: Build and maintain an integrated program schedule spanning design, verification, DFT, physical design, packaging, and software; own the critical path and drive it to closure.
- Cross-Functional Coordination: Partner daily with digital design, design verification, DFT, physical design, analog/mixed-signal design, packaging and substrate design, PCB and platform design, silicon bring-up, firmware, and software teams to keep every workstream aligned.
- Technical Fluency: Get into the technical details of interconnect and chiplet architecture, packaging tradeoffs, and SoC-level integration — enough to ask sharp questions, unblock engineering decisions, and speak credibly with customers and partners.
- Vendor and IP Management: Manage external IP vendors and OSAT/packaging partners, holding them accountable to committed timelines, specifications, and quality.
- Customer Engagement: Serve as the primary program interface to customers, defining deliverables and ensuring seamless integration of Eliyan’s IP and silicon solutions into their products.
- Schedule and Risk Management: Define milestones, maintain a live risk register, and proactively identify and mitigate the risks most likely to move the critical path.
- Budget and Resource Allocation: Manage program budgets, allocate resources efficiently, and track spend against plan to optimize development efforts.
- Technical Reviews and Decision-Making: Run regular program and technical reviews, surface tradeoffs, and drive decisions that optimize performance, cost, and schedule.
- Executive Reporting and Metrics: Quantify program health with clear KPIs, and translate technical detail into concise, decision-ready updates for engineering leadership and executives.
- Process, Documentation, and Reporting: Define and continuously improve program management practices and tooling as Eliyan scales, maintain clear documentation, and keep stakeholders informed with regular updates.

Required Qualifications:

- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
- 15+ years of semiconductor program management experience, including pre-silicon and post-silicon execution across at least two full IP or ASIC programs, from concept through production.
- Proven ability to lead large-scale, complex, multi-disciplinary semiconductor programs from architecture through volume production.
- Demonstrated ability to juggle multiple concurrent programs at once, making portfolio-level trade-offs — prioritizing resources, schedules, and scope across programs to maximize overall business impact.
- Deep working knowledge of the full silicon development lifecycle — front-end and back-end design, DV, DFT, packaging, PCB/platform design, and silicon bring-up.
- Experience managing external IP vendors and direct customer engagements around technical deliverables and integration.
- Strong track record driving schedule, risk, and budget management across many concurrent, interdependent workstreams.
- Excellent verbal and written communication skills, with the ability to tailor style, tone, and level of detail to any audience — from a deep technical exchange with individual engineers to a concise, decision-ready narrative for the CEO.
- Ability to influence and drive alignment across engineering teams without direct authority, in a fast-moving startup environment.
- Experience with program management tools (e.g., Jira, MS Project, Smartsheet, Confluence) and methodologies (Agile, Waterfall, or hybrid).

Preferred Qualifications:

- Direct experience with chiplet interconnect, UCIe, or die-to-die PHY programs, or with advanced packaging (2.5D/3D, CoWoS, InFO, or similar).
- Background in networking ASICs, mixed-signal PHY SoCs, high-performance computing, or AI/ML accelerator silicon.
- Working knowledge of firmware and software bring-up as it relates to silicon validation.
- PMP, PgMP, or equivalent program management certification.

What We Offer:

- The chance to shape the program management function at a company defining a new segment of the semiconductor industry.
- Direct, high-visibility partnership with Eliyan’s founding and technical leadership team.
- Competitive salary, meaningful equity, and comprehensive health benefits.
- A collaborative, first-principles engineering culture built around solving hard problems together.

## About Eliyan

## Company Overview
- **One-liner**: Eliyan develops high-bandwidth, low-power chiplet interconnect technology (NuLink) that solves data bottlenecks in AI and data center chips.
- **Entity Type**: Private (Series C-II)
- **Headquarters**: Santa Clara, California, United States
- **Founded**: 2021
- **Founders**: Ramin Farjadrad (CEO), Syrus Ziai (VP Engineering), Patrick Soheili (Chief Strategy & Business Officer)

## Core Business
- Primary industry: Semiconductor Manufacturing (chiplet interconnect IP and PHY silicon)
- Target customers: B2B – companies building custom AI chips (hyperscalers, chip designers, networking firms)
- Mission: “Revolutionize chiplet connectivity technologies by challenging the status quo to unleash the ultimate performance of smart systems of the future.”

## Products & Services
- **[NuLink™ D2D PHY](https://eliyan.com/about/)**: Die-to-die interconnect PHY supporting industry standards (BoW and UCIe) and proprietary simultaneous-bidirectional (SBD) technology. Delivers 4× the bandwidth and 2× the power efficiency of alternatives in advanced or standard packaging, with bump pitches from 40–130 microns.
- **[NuLink™-XD](https://linkedin.com/company/eliyan-corporation)**: A new class of power-reach configurable 224G PAM4 SerDes for chip-to-chip and chip-to-module applications, targeting the lowest-power electro-optical modules for AI scale-up networks. Up to 40% lower power than competing solutions.

## Market Standing
- **Valuation**: $1 billion (as of July 2026 Series C)
- **Annual Revenue**: $3.5 million (2025); forecasts hundreds of millions by end of 2027 [reuters.com](https://www.cbinsights.com/company/eliyan)
- **Total Funding**: $295 million (conflicting reports: other sources state $150M total); includes $145M Series C led by Seligman Ventures (July 2026), $60M Series B led by Samsung Catalyst Fund and Tiger Global (March 2024), $40M Series A led by Tracker Capital (Nov 2022).
- **Notable Investors/Partners**: Seligman Ventures (board seat for Umesh Padval), Cisco Systems, Lumentum, Samsung Catalyst Fund, Tiger Global Management, Tracker Capital, VentureTech Alliance.
- **Growth Signals**: Headcount of 73 employees with +6.7% monthly growth; 21 active job postings (quarterly trend +2,000%); expects to start chiplet shipments in 2026; expanding across 6 countries (US, Germany, Netherlands, Canada, India, Israel).

## Competitive Advantages
- Breakthrough die-to-die interconnect architecture (invented by founder Ramin Farjadrad in 2016) that achieves 4× bandwidth and 2× power efficiency versus competing IP.
- Works with standard packaging (wide range of bump pitches), reducing cost and complexity for chip designers.
- Independent alternative to Broadcom/Marvell in the chiplet interconnect space, giving custom AI chip makers a neutral, high-performance option.

## Strategic Focus
- Solving the growing data-movement bottleneck in AI compute (GPUs often idle 30–40% waiting for data).
- Scaling NuLink and NuLink-XD platforms to support both chip-to-chip and chip-to-module applications for next-generation AI infrastructure.
- Ramping chiplet production and licensing revenue, targeting hundreds of millions in sales by 2027.

## Why Work Here
- On-site culture with offices in Santa Clara (HQ), Vancouver (BC), and other global locations; no remote/hybrid mentioned.
- Engineering-heavy team (54% technical roles) with a fast-paced startup environment and deep expertise from companies like Marvell, Intel, AMD, and Synopsys.
- Opportunity to work on cutting-edge semiconductor interconnect technology that directly impacts AI performance.
- Active hiring across digital design, verification, DFT, physical design, optical engineering, and program management.

## Sources
1. [eliyan.com/about](https://eliyan.com/about/)
2. [jobs.lever.co/eliyan](https://jobs.lever.co/eliyan)
3. [linkedin.com/company/eliyan-corporation](https://linkedin.com/company/eliyan-corporation)
4. [cbinsights.com/company/eliyan](https://www.cbinsights.com/company/eliyan)
5. [reuters.com (via CNA)](https://www.cbinsights.com/company/eliyan) (Note: embedded Reuters article on CB Insights page)
6. [eliyan.com/careers](https://eliyan.com/careers/)

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