---
title: 'Senior Packaging Integration Lead at Astera Labs'
canonical: 'https://feeny.ai/job/senior-packaging-integration-lead-astera-labs-san-jose-california-jhbc1ck6gxbs'
type: 'job'
last_seen: '2026-09-26'
---

# Senior Packaging Integration Lead at Astera Labs

- **Company:** Astera Labs
- **Location:** San Jose California, United States
- **Posted:** 2026-09-22
- **Last confirmed live:** 2026-09-26
- **Apply:** https://job-boards.greenhouse.io/asteralabs/jobs/4735854005

## Job description

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at [www.asteralabs.com](http://www.asteralabs.com/).

Job Description

We are seeking a Senior Packaging Integration Lead to serve as the single-threaded packaging owner for one or more of Astera Labs’ advanced connectivity products. This role owns the end-to-end packaging solution from customer requirements and package architecture definition through development, qualification, and production ramp & represents packaging across the customer, internal cross-functional teams, business units, and the OSAT, foundry, and substrate supply base.

This is a senior individual-contributor technical leadership role who can set packaging technical direction, make architecture and technology-selection decisions, and drive alignment across stakeholders without direct authority. You will partner with packaging leadership on strategy while owning the technical direction for your products — defining package architecture and test vehicles to de-risk technology, and guiding execution engineers and external partners to deliver robust, manufacturable packages on schedule.

## Key Responsibilities

- Own the packaging solution end-to-end for assigned products — serve as the single point of accountability from a packaging standpoint across definition, development, qualification, and production ramp
- Act as the primary packaging interface to the customer: capture and translate customer packaging, mechanical, thermal, SIPI, and reliability requirements into package architecture, specifications, and a clear execution roadmap
- Define package architecture, structure and technology selection (e.g., 2.5D/3D integration, chiplet/interposer, CoWoS-class, organic substrate) with feasibility, cost, performance, and manufacturability trade-off analysis
- Define and drive test vehicle (TV) strategy and requirements to de-risk new package technology, characterize interconnect/SIPI performance, and validate assembly and reliability ahead of product builds
- Represent packaging across internal cross-functional teams — silicon design, package design, SIPI, thermal, product engineering, test engineering, validation, quality, and operations — and align packaging requirements to product and business-unit roadmaps
- Partner with product planning, architecture, and program management on product roadmap, packaging feasibility, technology readiness, cost targets, and schedule commitments
- Set technical direction with OSAT, foundry & substrate partners — driving technology selection, design-rule alignment, and development roadmaps across the supply base
- Own package definition deliverables and sign-offs, including POR/TOR, design rules, stack-up, package BOM, DFM alignment, and pre-tape-out design-integration readiness
- Drive risk identification, technology-gap closure, and mitigation across the product’s packaging roadmap; escalate and resolve critical cross-functional and supplier issues with urgency.
- Communicate packaging status, risks, and key decisions to executive leadership, customers, and cross-functional stakeholders & external partners.

## Basic Qualifications

- B.S. or M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related discipline; advanced degree preferred.
- 5-7+ yrs of experience in advanced packaging technologies such as 2.5D/3D integration, TSV, chiplets, and interposers. Optical / co-packaged optics experience is a plus.
- Demonstrated end-to-end ownership of a product or platform packaging solution, from definition and architecture through qualification and production ramp
- Experience defining package architecture and driving technology selection, including trade-off analysis across performance, cost, reliability, and manufacturability
- Experience defining test vehicles and characterization/qualification strategies to de-risk new packaging technology.
- Direct customer-facing experience translating product and system requirements into package specifications and commitments.
- Strong architecture-level understanding of signal/power integrity (SIPI), thermal, and thermo-mechanical reliability considerations in advanced packages
- Proven ability to lead and influence across internal cross-functional teams, business units, and external OSAT/foundry/substrate partners without direct authority.
- Hands-on background working with foundries, OSATs, substrate suppliers, and material vendors.
- Excellent communication, organizational, and executive-level presentation skills, with the ability to drive alignment across globally distributed teams.

## Preferred Qualifications

- Experience with UCIe / die-to-die interconnect and high-bandwidth chiplet integration
- Experience with CoWoS-class, silicon-bridge, or advanced fan-out packaging platforms
- Experience with co-packaged optics / optical packaging for scale-up connectivity
- Track record engaging foundry and OSAT partners on advanced-packaging technology roadmaps

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

## About Astera Labs

## Company Overview
- **One-liner**: Astera Labs designs and delivers semiconductor-based connectivity solutions purpose-built to unleash the full potential of cloud and AI infrastructure.
- **Entity Type**: Public (Nasdaq: ALAB)
- **Headquarters**: Santa Clara, California, United States
- **Founded**: 2017
- **Founders**: Jitendra Mohan, Sanjay Gajendra, Casey Morrison

## Core Business
- **Primary industry**: Semiconductor manufacturing / AI infrastructure connectivity
- **Target customers**: B2B, primarily hyperscale cloud providers and system OEMs (e.g., NVIDIA, AMD, Intel)
- **Mission statement**: To innovate, design, and deliver semiconductor-based connectivity solutions that are purpose-built to unleash the full potential of cloud and AI infrastructure.

## Products & Services
- **Aries PCIe®/CXL™ Smart DSP Retimers**: Silicon ICs, boards, and modules that digitally recover degraded high-speed signals to extend reach and enable higher PCIe/CXL data bandwidth between compute, storage, and network controllers.
- **Taurus Ethernet Smart Cable Modules™**: Hardware modules that increase network connectivity bandwidth between servers and switches over copper media, removing rack-level Ethernet bottlenecks.
- **Leo CXL Memory Connectivity Controllers**: ICs and boards that expand, share, and pool DRAM memory to overcome processor memory bandwidth bottlenecks for AI workloads.
- **Scorpio Smart Fabric Switches**: A family of PCIe 6 fabric switches ranging from 32 to 320 lanes, including the new 320-lane Scorpio X-Series Fabric Switch for AI scale-up fabrics.
- **COSMOS Software Suite**: A connectivity system management and optimization software that enables configuration, monitoring, troubleshooting, and predictive analytics for all Astera Labs products.

## Market Standing
- **Market Cap**: ~$11.6 billion (as of mid-2026)
- **Key Metric - Revenue**: $35 million (annual, reported)
- **Key Metric - Operating Income**: $173.4 million (2025)
- **Key Metric - Net Income**: $219.1 million (2025)
- **Total Funding**: ~$810.75 million (pre-IPO), with Series C ($50M, led by Fidelity) and Series D ($150M, led by Fidelity)
- **IPO Date**: March 20, 2024
- **Notable Investors/Partners**: Fidelity, NVIDIA, Advanced Micro Devices, Intel, major hyperscalers
- **Growth Signals**: 92% YoY headcount growth (675 employees); 144 active job postings (+260% YoY); expanded Taiwan operations with a new Cloud-Scale Interop Lab in 2026; shipping millions of devices across all major hyperscalers; 300+ design wins.

## Competitive Advantages
- **First-to-market innovation**: Pioneered first-to-market PCIe, Ethernet, and CXL connectivity products.
- **Patented software-defined platform approach**: Differentiates via a platform that combines silicon hardware with embedded COSMOS software, enabling flexibility, observability, and predictive analytics.
- **Deep hyperscaler relationships**: Trusted partner to the world’s largest cloud providers, with proven interoperability validated in their own Cloud-Scale Interop Lab.
- **Broad product portfolio**: Covers PCIe retimers, Ethernet cable modules, CXL memory controllers, and fabric switches—addressing the full spectrum of AI connectivity bottlenecks.
- **Strong IP and engineering talent**: 443 employees in technical roles; talent sourced from Intel (65), Marvell (37), Texas Instruments (40), AMD (22), and NVIDIA.

## Strategic Focus
- **Scaling AI infrastructure**: Expanding product portfolio and global footprint (12 countries) to meet surging demand for rack-scale AI.
- **Open standards leadership**: All products are grounded in open standards (PCIe, CXL, Ethernet), ensuring interoperability and broad adoption.
- **Taiwan expansion**: Growing engineering presence and Interop Lab in Taiwan to strengthen integration with leading AI platform providers and system manufacturers.
- **Continued innovation**: Shipping the new 320-lane Scorpio X-Series Fabric Switch and expanding the COSMOS software suite for fleet-level management and optimization.

## Why Work Here
- **Culture**: Described as collaborative, ownership-driven, and focused on solving complex problems together. The company emphasizes diversity and inclusion as drivers of creativity and innovation.
- **Growth**: Astera Labs supports non-linear career growth—employees can deepen expertise (“scale up”) or broaden into new areas (“scale out”). 92% YoY headcount growth signals rapid expansion and opportunity.
- **Remote/Hybrid**: Not explicitly stated, but global operations across 12 countries (including India, Canada, Israel, Taiwan, Vietnam) suggest a flexible, distributed work model.
- **Benefits**: Competitive medical, dental, and vision plans; flexible time off; family planning and parental leave; 401K and retirement plans.
- **Engineering culture**: Strong focus on cutting-edge semiconductor and AI infrastructure technology. High concentration of senior (24%) and specialist (19%) talent. Active internship and new graduate programs.
- **Employee ratings**: 4.5/5.0 on LinkedIn (124 reviews), with high marks for compensation (4.6), culture (4.4), and career development (4.4).

## Sources
1. [Astera Labs Careers Page](https://www.asteralabs.com/careers/)
2. [Astera Labs Official Website](https://www.asteralabs.com/)
3. [Astera Labs LinkedIn](https://www.linkedin.com/company/astera-labs)
4. [Astera Labs Products Page](https://www.asteralabs.com/products/)
5. [Astera Labs S-1 Filing (SEC)](https://ir.asteralabs.com/static-files/7103a4cb-aa6b-4f11-a4b0-f179cd4c5bee)

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