--- title: 'Senior Process Engineer at Mesh Optical Technologies' canonical: 'https://feeny.ai/job/senior-process-engineer-mesh-optical-technologies-gardena-jjw3wcmxmqnb' type: 'job' last_seen: '2026-09-09' --- # Senior Process Engineer at Mesh Optical Technologies - **Company:** Mesh Optical Technologies - **Location:** Gardena, CA - **Posted:** 2026-02-17 - **Last confirmed live:** 2026-09-09 - **Apply:** https://job-boards.greenhouse.io/meshopticaltechnologies/jobs/4134727009 ## Job description ## SENIOR PROCESS ENGINEER Mesh Optical Technologies was founded on the belief that optical photons will be at the center of advanced technologies in the coming century. Making advanced technology ubiquitous means building at scale, and that’s exactly what we’re doing at Mesh. Our products require semiconductor-grade packaging processes—bumping, dicing, precision bonding, optical alignment, and automated assembly—executed at yield levels and volumes that demand real process engineering discipline. We are seeking a Senior Process Engineer to own the development and qualification of these processes from R&D through production ramp, and to help build high-volume semiconductor packaging process engineering in the US. ## RESPONSIBILITIES - Own development of wafer prep and die-level packaging processes: bumping, dicing, sub-micron precision bonding, sub-micron optical alignment, flip-chip die bonding, wire-bonding, dispense, fully-automated final assembly and associated materials - Own tool selection, materials selection, recipe development, and statistical process control limits to transfer processes from R&D to volume production - Translate package and product designs into high volume production processes and collaborate with electrical, mechanical, and photonic circuit design teams to design-for-manufacturing - Design production processes from the lab bench through proof of concept and production ramp - Establish process limits and feedback process constraints as design rules to design teams - Characterize parts with x-ray, FIB cut/SEM, CSAM, and die shear testing, closing the loop with electrical, mechanical, and photonic circuit design teams - Act as the technical owner for failure-analysis findings, root cause analysis, and corrective actions - Push process yields above 99.9% and thermal-cycle reliability for years-long qualification - Provide technical mentorship as we work to build up high-volume semiconductor packaging process engineering in the US ## QUALIFICATIONS - MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similar - Extensive (MS + 2 years) hands-on semiconductor process-development experience - Strong troubleshooting skills and hands-on experience in semiconductor packaging, assembly, or advanced manufacturing environments - Demonstrated success qualifying processes such as flip-chip bonding, wafer processing, plasma cleaning, and wire bonding - Expertise in statistical quality control and process improvement methodologies, with experience leading internal audits and driving continuous improvement - Comfortable working in a cleanroom or controlled manufacturing environment with cross-functional engineering teams - Willingness to work extended hours and weekends as needed ## PREFERRED EXPERIENCE - 5+ years of fab or wafer level packaging experience (e.g. lithography, etch, CVD, CMP, solder bumping, wafer dicing) - Experience integrating photonic devices into complex opto-electronic packages, sub-µm die-bonding, wafer prep, and materials used in advanced packaging ## COMPENSATION AND BENEFITS: Pay range: Senior Process Engineer: $140,000.00 - $180,000.00/per year Title and base salary are determined on a case by case basis commensurate with experience and merit. In addition to base salary, compensation for this role includes: - Eligibility for long-term incentives including company stock options and discretionary bonuses awarded for exceptional achievements. - Comprehensive medical, vision, and dental insurance with significant cost covered by the company for yourself and dependents. - Paid parental leave and flexible PTO (3 weeks accrued vacation and 10 company holidays per year). - 401(k) retirement plan access. - Relocation assistance to sunny Los Angeles. ## About Mesh Optical Technologies ## Company Overview - **One-liner**: Mesh Optical Technologies designs and manufactures advanced optical systems at scale, targeting hyperscale computing and AI infrastructure. - **Entity Type**: Private (Series A - $50M led by Thrive Capital, as of February 2026) - **Headquarters**: Los Angeles, California, United States - **Founded**: Not publicly available - **Founders**: Travis Brashears (Co-Founder & CEO), Cameron Ramos (Co-Founder & President) ## Core Business - **Primary industry**: Computer Hardware Manufacturing / Advanced Optics / Photonics - **Target customers**: B2B – hyperscale data centers, AI compute clusters, and space-based optical communications - **Mission or purpose**: "Advance the state of the art in optical manufacturing, closing a critical supply chain gap in hyperscale computing, and building the next generation of optical hardware on Earth and in space." ## Products & Services - **Alpha C1 optical transceiver**: A 1.6 Terabits per second optical transceiver that linearly translates electrical signals to light. Designed for AI workloads and power-constrained data centers, it delivers better power efficiency, lower latency, and higher reliability. Its optical engine is manufactured entirely with flip chip die bonding – the same technology used to package chips in modern processors – enabling high-volume production. ## Market Standing - **Valuation/Market Cap**: Not disclosed - **Key Metric**: Total funding of $50M (Series A, February 2026) - **Notable Investors/Partners**: Thrive Capital (lead), plus two other major investors (names not specified) - **Growth Signals**: 11 employees with 29 open job postings; 20% monthly headcount growth; team includes alumni from SpaceX, Intel, Apple, Helion, and other advanced manufacturing environments ## Competitive Advantages - **Integrated design & manufacturing**: Unlike most photonics companies that treat manufacturing as a downstream exercise, Mesh designs and builds its own factories, closing the feedback loop between device physics, packaging, yield, and automation. - **Flip chip die bonding**: The Alpha C1 uses a proven, high-volume chip-packaging technique, allowing rapid scaling to millions of units per year – a major departure from the manual, low-volume assembly typical of US optical manufacturing. ## Strategic Focus - Scale production of the Alpha C1 transceiver to meet demand from AI clusters. - Develop new high-volume optical manufacturing techniques for terrestrial and in-space infrastructure (laser links, deep space probes). - Continue to hire across engineering, operations, and manufacturing to expand its Los Angeles-based factory and R&D capabilities. ## Why Work Here - **Engineering culture**: "Build your own factory" – the team believes in engineering to the limit of physics and writing software that maximizes hardware capability. - **Impact**: Opportunity to close a critical supply chain gap in US optical manufacturing and shape the next generation of computing infrastructure. - **Work environment**: On-site in Los Angeles (two offices in the area); highly technical team with deep expertise from SpaceX, Intel, Apple, and other hardware leaders. - **Growth**: Rapidly scaling startup with 29 open roles across electrical, mechanical, process, and manufacturing engineering, as well as operations and recruiting. ## Sources 1. [meshoptical.com](https://www.meshoptical.com/) 2. [meshoptical.com/blog](https://www.meshoptical.com/blog/introducing-mesh) 3. [linkedin.com](https://www.linkedin.com/company/meshoptical) 4. [meshoptical.com/process](https://www.meshoptical.com/process) 5. 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