--- title: 'Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer at Lumilens' canonical: 'https://feeny.ai/job/senior-staff-npi-wafer-bumping-fan-out-process-engineer-lumilens-singapore-ma0tx35az5eq' type: 'job' last_seen: '2026-09-07' --- # Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer at Lumilens - **Company:** Lumilens - **Location:** Singapore - **Employment:** full-time - **Posted:** 2026-09-07 - **Last confirmed live:** 2026-09-07 - **Apply:** https://jobs.ashbyhq.com/lumilens/887d46b7-3e3a-4b6f-865f-06b0cb390e9d ## Job description ## CORE RESPONSIBILITIES - Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers - Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin. - Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric photoresists, plating chemistries, underfills, and solder alloys. - Reliability & Stress Engineering: Design and execute DOE plans to characterize thermal and mechanical stress. Lead reliability validations including Temperature Cycling Test (TCT), Unbiased Highly Accelerated Stress Test (HAST) and High-Temperature Storage (HTS). - Failure Analysis & Debug: Own the root-cause diagnostics of structural failure modes unique to WLCSP (e.g., RDL cracking, bridging ball bridging, bump missing, delamination, or wafer warpage). Utilize specialized analytics instrumentation including SEM, CSAM, and physical cross-sectioning. Conduct root cause analysis and formulate improvement solutions. - Optimize key bumping process parameters including wafer cleaning, UBM sputtering, solder ball plating, reflow and bump inspection to improve bump uniformity and yield. - Manage incoming wafer quality control, establish SPC control plans and monitor process variation to ensure long-term process stability - Compile process SOP, WI, process failure reports and engineering change documents; support NPI new product introduction and process verification. ## REQUIRED QUALIFICATIONS - Education: Bachelor or Master degree in Materials Science, Chemical Engineering, Mechanical Engineering, Microelectronics, or an equivalent technical discipline. - Experience: 5+years of hands-on wafer bumping or Fan-out process integration or development experience, at OSAT or IDM internal advanced packaging line. Process exposure/experience on interposer, 2.5D/3D, chip on wafers on substrate, will be an added advantage. - Technical Knowledge: - Deep practical understanding of photolithography, wet etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD), moulding process adapted for backend bump fabrication. - Comprehensive command of finite element simulation principles regarding warpage, thermal dissipation, and structural mechanical integrity. - Solid working expertise with industry validation methodologies including FMEA, SPC controls, and structured 8D problem-solving tools. - Software Tools: High proficiency with robust analytical platforms like JMP, Minitab, or Python. ## About Lumilens ## Company Overview - **One-liner**: Lumilens designs and manufactures next-generation photonic interconnects to massively scale AI compute infrastructure. - **Entity Type**: Private (Series B – led by Accton Technology; prior Series A of $30M from Mayfield and Spark Capital) - **Headquarters**: San Jose, California, USA - **Founded**: 2024 - **Founders**: Ankur Singla (CEO), Samuel Liu (VP Products), Ritesh Kapahi (VP/GM India), Dave Friedman (VP Operations) ## Core Business - **Primary industry**: Photonics / optical interconnects for AI data centers - **Target customers**: Large-scale AI providers and hyperscale data center operators (B2B, Enterprise) - **Mission**: “To rapidly innovate in photonics and connectivity architectures to enable the massive scaling of compute infrastructure required to deliver the full potential of AI.” ## Products & Services - **Photonic Interconnects (Scale-Out & Scale-Up)**: High-density, low-latency optical links that enable cluster-to-cluster and direct GPU-to-GPU connectivity. Supports 100x higher quantity of GPU direct connections than legacy approaches. - *Type*: Hardware (silicon photonics modules) + integrated manufacturing - **Automated Manufacturing Platform**: End-to-end custom robotics and AI-optimized production processes to maximize yield, quality, and supply-chain flexibility. - *Type*: Service / Manufacturing capability (in-house) ## Market Standing - **Valuation/Market Cap**: Not publicly available - **Key Metric**: Total funding – $30M Series A (June 2024); Series B led by Accton Technology (amount undisclosed) - **Notable Investors/Partners**: Mayfield, Spark Capital, Accton Technology - **Growth Signals**: - Headcount grew 287% YoY (54 employees as of mid-2025) [linkedin.com] - Operations in 8 countries: USA, India, Thailand, Poland, Singapore, Czechia, South Korea, Malaysia - 48 active job postings (+23.1% monthly growth) [linkedin.com] - Leadership team with deep photonics/networking experience from Cisco, Juniper, Meta, Lumentum, Coherent ## Competitive Advantages - **In-house silicon photonics development** – full control over design and supply chain - **Systems-level expertise** – can partner on both scale-out and scale-up architectures - **Manufacturing automation** – robotics + AI processes enable faster innovation, higher quality, and predictable deployment - **Standards-based interconnects** – easy deployment into existing infrastructure - **Manufacturing anywhere** – supply-chain continuity and scalable manufacturing ## Strategic Focus - Enable massive scaling of AI infrastructure by overcoming electrical/copper limitations with advanced photonics - Disaggregate GPUs to mitigate power and density challenges in data centers - Expand manufacturing capacity globally and continue to automate production - Align product roadmap with industry standards to accelerate adoption ## Why Work Here - **Culture**: Fast-paced startup environment with deep technical expertise; mission-driven focus on enabling the future of AI - **Work policy**: In-office (HQ San Jose, CA with Bengaluru, India as major hub) [builtin.com] - **Perks**: Opportunity to work on cutting-edge photonics, robotics, and AI manufacturing; direct impact on world’s largest AI infrastructure - **Engineering culture**: Heavy emphasis on silicon photonics, hardware design, robotics automation, and system-level architecture. Teams are led by veterans from Cisco, Juniper, Meta, Lumentum, Coherent. ## Sources 1. [lumilens.com](https://lumilens.com/) – Company overview, mission, leadership, products 2. [lumilens.com/company](https://lumilens.com/company) – Vision, investors, leadership team 3. [builtin.com](https://builtin.com/company/lumilens) – Career page, employee count, year founded, office policy 4. [linkedin.com](https://www.linkedin.com/company/lumilens) – Headcount, funding details, geographic/department breakdown, job trends, talent sources 5. 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