--- title: 'Staff Engineer - Advanced Packaging Multiphysics Physics Modeling at Absolics Inc' canonical: 'https://feeny.ai/job/staff-engineer-advanced-packaging-multiphysics-physics-modeling-absolics-inc-7szzkmq16z23' type: 'job' last_seen: '2026-11-08' --- # Staff Engineer - Advanced Packaging Multiphysics Physics Modeling at Absolics Inc - **Company:** Absolics Inc - **Location:** Covington, GA - **Posted:** 2026-09-22 - **Last confirmed live:** 2026-11-08 - **Apply:** https://job-boards.greenhouse.io/absolicsinc/jobs/4414745009 ## Job description Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation) Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling Location: Covington, GA Job Type: Full-Time Job Description: This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data. Required Skills: - FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks - Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws) - Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticity - Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states - Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section) - Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modeling - Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress - Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting) - Ability to translate simulation results into actionable design rules for process/product engineering teams ## Preferred Skills - Experience with panel level packaging reliability prediction - Exposure to system-level (board + package + die) co-simulation - DOE/Statistical methods for correlating simulation with experimental reliability data - Familiarity with glass core interposer or 2.5D/3D heterogenous integration mechanics - Experience with machine learning assisted surrogate modeling for faster design space exploration Education: - PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physics Benefits: - 401K 6% matching (NO vesting period) - Healthcare 100% support (Health, Dental, Vision) - Life, STD, LTD 100 % support - Cell phone allowance - PTO and self-development ## SALARY: - $90,000 – $150,000 ## About Absolics Inc ## Company Overview - **One-liner**: Absolics Inc. is the world's first glass substrate manufacturer, providing advanced packaging technologies and scalable solutions for high-performance computing (HPC) and AI semiconductor applications. - **Entity Type**: Private (affiliate of SKC, part of SK Group) - **Headquarters**: Covington, Georgia, United States - **Founded**: 2021 - **Founders**: Not publicly available (company was established as an affiliate of SKC) ## Core Business - **Primary industry**: Semiconductor Manufacturing / Advanced Packaging - **Target customers**: B2B – HPC-related packaging companies, data centers, AI chip manufacturers, and high-tech industry leaders - **Mission or purpose**: To create a new chapter in the history of the semiconductor industry by solving fundamental substrate limitations with glass-based solutions. ## Products & Services - **Glass Substrate Solutions**: A proprietary glass substrate technology that significantly improves signaling characteristics and reduces power consumption compared to traditional silicon-based substrates. It enables fine patterns, large areas, and lower power consumption for advanced packaging. Type: Hardware / Semiconductor Material - **Advanced Packaging Services**: Scalable packaging services for businesses involved in high-performance computing, leveraging glass substrate innovation. Type: Service / Manufacturing ## Market Standing - **Valuation/Market Cap**: Not disclosed (Private company) - **Key Metric**: Total Funding – **$175.0M** (from U.S. Department of Commerce grants, see below) - **Notable Investors/Partners**: - **U.S. Department of Commerce** (two grants: $75M in May 2024, $100M in January 2025) [absolicsinc.com](https://www.absolicsinc.com/) - Parent: **SKC** (affiliate of **SK Group**, which includes SK Hynix, SK Siltron, and SK Materials) - **Growth Signals**: - Headcount grew **48.8% YoY** (+40 people), now at **76 employees** [linkedin.com](https://www.linkedin.com/company/absolics-inc) - The advanced packaging market is expected to grow from $3.5B (2020) to $9.7B (2025); glass substrate segment forecast at $3.0B (2025) with 25% CAGR [absolicsinc.com](https://www.absolicsinc.com/) - Recent news: Absolics received $100M in U.S. R&D grants (2024-2025), building a computer chip factory in Georgia [eeNews Europe](https://www.eenewseurope.com/) - Active job postings: 9 positions (quarterly job posting growth: +800%) [linkedin.com](https://www.linkedin.com/company/absolics-inc) ## Competitive Advantages - **First-mover in glass substrates**: Absolics is the world's first dedicated glass substrate manufacturer, positioning it at the forefront of a key advanced packaging innovation. - **Deep SK Group ecosystem**: Backed by SKC and SK Group (SK Hynix, SK Siltron, SK Materials), providing strong supply chain integration, capital, and industry connections. - **Significant U.S. government backing**: $175M in federal grants directly from the CHIPS Act, signaling strategic national importance and long-term stability. - **Performance moat**: Glass substrates offer superior signaling, lower power consumption, and larger form factors – critical for AI and HPC chips where traditional silicon substrates are hitting physical limits. ## Strategic Focus - **Scaling manufacturing**: Building a U.S. factory in Georgia to mass-produce glass substrates for the domestic semiconductor ecosystem. - **R&D leadership**: Continued innovation in active/passive element integration on glass, targeting next-generation HPC and AI packaging needs. - **Market capture**: Targeting the rapidly growing advanced packaging market ($9.7B by 2025), with glass substrates as a key growth driver. ## Why Work Here - **Pioneering technology**: Join the first company in the world manufacturing glass substrates for semiconductors – a chance to work on cutting-edge tech that could reshape the industry. - **Rapid growth**: Headcount grew ~49% YoY, indicating a scaling phase with ample career advancement opportunities. - **Government-backed stability**: $175M in federal grants provides strong financial footing and long-term project security. - **Office policy**: On-site work at the Covington, Georgia headquarters [builtin.com](https://builtin.com/company/absolics-inc) – collaborative environment in a new, state-of-the-art facility. - **Engineering-heavy culture**: 25% of staff in technical roles, 13% in operations, and active hiring for engineers (NPI Process Engineer, Photoresist Engineering Manager, etc.) [linkedin.com](https://www.linkedin.com/company/absolics-inc) - **Global exposure**: While HQ is in Georgia, the company has presence in South Korea and Mexico, offering cross-cultural collaboration. ## Sources 1. [absolicsinc.com](https://www.absolicsinc.com/) 2. [absolicsinc.com/about](https://www.absolicsinc.com/about) 3. [absolicsinc.com/job](https://www.absolicsinc.com/job) 4. [linkedin.com/company/absolics-inc](https://www.linkedin.com/company/absolics-inc) 5. [builtin.com/company/absolics-inc](https://builtin.com/company/absolics-inc) ## Other roles at Absolics Inc - [Procurement Specialist](https://feeny.ai/job/procurement-specialist-absolics-inc-covington-s6pbedtb9n7m) — Covington, GA - [General Counsel and Head of Legal](https://feeny.ai/job/general-counsel-and-head-of-legal-absolics-inc-covington-hn5gqd21s950) — Covington, GA - [Failure Analysis Engineer](https://feeny.ai/job/failure-analysis-engineer-absolics-inc-covington-qxca28f961yb) — Covington, GA - [Human Resources Specialist](https://feeny.ai/job/human-resources-specialist-absolics-inc-covington-bkgpe6537m2n) — Covington, GA - [NPI Process Engineer](https://feeny.ai/job/npi-process-engineer-absolics-inc-covington-jkq6p72aaydt) — Covington, GA - [Dielectric and Polymer Materials Engineer](https://feeny.ai/job/dielectric-and-polymer-materials-engineer-absolics-inc-covington-8cvb0ervetam) — Covington, GA - [Engineering Technician](https://feeny.ai/job/engineering-technician-absolics-inc-covington-wajqqpf8w37a) — Covington, GA - [SPC Data Control Engineer](https://feeny.ai/job/spc-data-control-engineer-absolics-inc-covington-xav4c3swzry8) — Covington, GA - [Plating Process Engineer](https://feeny.ai/job/plating-process-engineer-absolics-inc-covington-kzknyzhn0anr) — Covington, GA - [Laser / Inspection Process Engineer](https://feeny.ai/job/laser-inspection-process-engineer-absolics-inc-covington-r0w8nxjkgzr0) — Covington, GA