---
title: 'System & Advanced Packaging Design Lead at Phizenix'
canonical: 'https://feeny.ai/job/system-advanced-packaging-design-lead-phizenix-santa-clara-n8k5v8ngx7j7'
type: 'job'
last_seen: '2026-10-15'
---

# System & Advanced Packaging Design Lead at Phizenix

- **Company:** Phizenix
- **Location:** Santa Clara, CA
- **Compensation:** $180k–$200k
- **Work type:** hybrid
- **Posted:** 2026-10-12
- **Last confirmed live:** 2026-10-15
- **Apply:** https://job-boards.greenhouse.io/phizenix/jobs/5450006008

## Job description

## Role Overview

We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and drive the development of complete solutions for data-centers

## Key Responsibilities

Technical Leadership & Execution

- Own package, PCB, and system-level signal integrity architecture for 200G+/lane copper interconnects (C2M, C2C, and cable assemblies) — from channel budgeting and topology definition through post-layout signoff and correlation with silicon measurements.
- Drive 2.5D/3D and heterogeneous package development for co-packaged driver, TIA, and optical engines, including substrate architecture, interposer/bridge evaluation, and die–package co-design with the SerDes and analog design teams.
- Lead micro-LED and photonic packaging development: optical coupling and alignment strategy, hermeticity and reliability, and thermal co-design with the optical engine.
- Define and manage the OSAT and substrate supplier strategy — technology selection, DFM reviews, JEDEC qualification, yield ramp, and HVM readiness.
- Own package-level power integrity and thermal strategy: PDN targets, decoupling plans, lid/TIM selection, and clear signoff criteria across programs.
- Coordinate cross-functional execution across silicon design, product/test engineering, systems hardware, and manufacturing partners; run design reviews and manage schedule and risk.

Hands-On Design

- Personally drive substrate stackup definition, ballmap/pinmap optimization, and high-density breakout and escape routing studies for high-speed designs.
- Perform 3D EM extraction and channel simulation (HFSS/Q3D, ADS or equivalent), S-parameter quality checks, and COM/IL/RL budgeting against IEEE 802.3 and OIF-CEI specifications.
- Build and correlate PDN and thermal models spanning die, package, and board.
- Lead lab characterization: VNA/TDR measurements, BER and eye-margin testing, model-to-measurement correlation, and failure analysis support.
- Author package design guidelines, review checklists, and reference collateral used across product programs.

Required Qualifications

Education & Experience

- Ph.D. in Electrical Engineering (or related) with 5+ years, OR M.S. with 8+ years of Advanced package development in high volume.
- Proven experience leading teams to successful execution, with multiple products delivered in advanced CMOS nodes.

Core Technical Skills

- Deep SI/PI expertise for multi-GHz serial links: 112G/224G PAM4 channel design, COM analysis, crosstalk and mode-conversion control, and connector/cable interfaces.
- Advanced packaging depth: FCBGA, RDL/fan-out, 2.5D interposers and silicon bridges, substrate design rules, and materials selection.
- Fluency with industry tools: HFSS, Q3D, SIwave/PowerSI, ADS channel simulation, Cadence APD/Allegro (or equivalent), and thermal tools such as Icepak or FloTHERM.
- Reliability and qualification: JEDEC standards, moisture sensitivity, thermo-mechanical stress, and warpage/coplanarity management for large-body packages.
- Working knowledge of optics packaging: VCSEL/PD or silicon-photonics co-packaging, fiber and lens coupling, and active alignment concepts.

Leadership & Program Skills

- Track record leading small internal teams and external partners (OSATs, substrate vendors, contract labs) through complete product cycles into volume production.
- Strong program discipline: schedule and risk management, structured design reviews, and clear documentation in a fast-moving environment.
- Excellent cross-functional communication with silicon, systems, and executive stakeholders; comfortable presenting technical trade-offs to customers and partners.

## Preferred Qualifications

- Experience with co-packaged optics, linear-drive optics, or active copper/electrical cable (ACC/AEC) products.
- Micro-LED, VCSEL, or photonic device packaging experience.
- Familiarity with UCIe and chiplet/die-to-die interconnect packaging.
- Hands-on HVM ramp experience at leading OSATs (ASE, Amkor, JCET, or similar).
- Prior startup experience or comfort operating with broad scope under resource constraints.

California Pay Range $180,000—$200,000 USD

## About Phizenix

## Company Overview
- **One-liner**: Phizenix provides workforce solutions for the AI era, including top tech talent placement, AI strategy & development, and AI workforce training.
- **Entity Type**: Private (Pre-Seed / Bootstrapped – no public funding rounds disclosed)
- **Headquarters**: Livermore, California, United States
- **Founded**: 2025
- **Founders**: Khursheed Irani

## Core Business
- **Primary industry**: IT Services and IT Consulting, AI Consulting, Workforce Staffing
- **Target customers**: B2B – businesses seeking AI transformation, technical talent, and AI upskilling (mid-market to enterprise)
- **Mission or purpose statement**: “We’re a team of tech founders, operators, and builders on a mission to help businesses thrive in an AI-native world. We believe AI should empower people, not replace them.”

## Products & Services
- **[Talent Staffing]**: Executive recruiting, permanent hire, contract staffing and management for technical roles (e.g., AI/ML engineers, DevOps, firmware engineers).
- **[AI Strategy & Development]**: Consulting to discover automation opportunities, design AI solutions, and build production AI systems.
- **[AI Workforce Training]**: Live workshops and online certification programs to increase teams’ AI skills.

## Market Standing
- **Valuation/Market Cap**: Not publicly available (private company, no funding rounds disclosed)
- **Key Metric**: Not disclosed (revenue not public). Employees: 12 as of early 2026.
- **Notable Investors/Partners**: No named investors; leadership includes Khursheed Irani (CEO), Raashid Mehasanewala (Head of Solutions), Jumana Ghadiali (VP Operations), Sanjay Dayal (Senior Technology Advisor), Aziz Ghadiali (Head of AI and Marketing).
- **Growth Signals**: Headcount growth of +7.7% monthly (LinkedIn estimate); active job postings on Greenhouse (3 open roles as of 2026); LinkedIn follower count 3,587 with +3.9% monthly growth.

## Competitive Advantages
- **AI-native focus**: Entire business model centered on AI transformation, not a general staffing firm.
- **Silicon Valley presence**: HQ in Livermore, CA, with additional presence in India and Canada, allowing access to diverse talent pools.
- **Experienced leadership team**: Founders and VPs bring 20+ years of combined experience in tech, operations, and AI.

## Strategic Focus
- **Current priorities**: Expand AI consulting engagements, scale talent staffing pipeline, and grow the training certification arm. Emphasis on “AI-native future of work” – helping companies integrate AI alongside human teams rather than replacing them.

## Why Work Here
- **Culture**: Small, mission-driven team focused on AI empowerment. Emphasis on “AI should empower people, not replace them.”
- **Remote/Hybrid/Office**: Many roles are remote; some are hybrid in San Francisco/Bay Area (e.g., Director of Engineering – Shopify & ERP). Offices in Livermore, CA and Bengaluru, India.
- **Notable perks/engineering culture**: Opportunity to work at the intersection of AI and business transformation; hands-on involvement in building AI solutions for clients; growth potential in a young, rapidly expanding company.

## Sources
1. [phizenix.com](https://www.phizenix.com/)
2. [phizenix.com/careers](https://www.phizenix.com/careers)
3. [phizenix.com/about](https://www.phizenix.com/about)
4. [LinkedIn/Phizenix](https://www.linkedin.com/company/phizenix)
5. [Greenhouse/Phizenix](https://job-boards.greenhouse.io/phizenix/jobs/5197144008)

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