--- title: 'Systems Intern - Validation, Software, Design, Architecture & Packaging (Canada) at Tenstorrent University Jobs' canonical: 'https://feeny.ai/job/systems-intern-validation-software-design-architecture-packaging-canada-ysxg1y4k1pxg' type: 'job' last_seen: '2026-10-16' --- # Systems Intern - Validation, Software, Design, Architecture & Packaging (Canada) at Tenstorrent University Jobs - **Company:** Tenstorrent University Jobs - **Location:** Toronto, Canada / Vancouver, Canada - **Posted:** 2026-10-14 - **Last confirmed live:** 2026-10-16 - **Apply:** https://job-boards.greenhouse.io/tenstorrentuniversity/jobs/5264407007 ## Job description Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Overview: A chip isn't a product until it's a working system. These teams cover both ends of that: getting silicon to boot and validate correctly,building the board, power, mechanical, thermal, packaging and IO around it. You submit one application, you have one recruiter screen - then we match you to the specific team below and location that fits best. - Systems & Silicon Validation: Post-silicon testing of physical chips and integrated systems to ensure they meet all functional, electrical, and performance specs. - System Software: Development of foundational software, including firmware, drivers, and operating systems, that directly controls and interfaces with hardware. - System Design: The process of defining, integrating, and mapping out hardware components such as PCBs, software modules, and interfaces into a complete product blueprint. - System Architecture: Define the high-level structural framework, interfaces, and data-flow pathways between the CPU, memory, and peripherals. - Packaging: A package is what is placed between the silicon and the board; and its design requires detailed electrical, electromagnetic, and mechanical simulations and analysis. This role is on-site based out of Toronto, Ontario or Vancouver, British Columbia. ## Who You Are - Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering - Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering using low-level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog). - Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical. - Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs). ## What We Need - Systems & Silicon Validation: Assist in post-silicon testing of physical microchips under real-world workloads to ensure they meet all functional, electrical, and performance specifications. - System Software: Contribute to developing foundational software—including firmware, drivers, and operating systems—that directly controls and interfaces with the semiconductor hardware. - System Design & Architecture: Help map out, define, and evaluate high-level structural frameworks, optimizing the power delivery and high-speed performance benchmarks of both the silicon components and the underlying PCBs. - Semiconductor Packaging & Mechanical Design: Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis ## What You Will Learn - Hands-on silicon experience using industry-standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real-world chips. - Low-level software development by writing production-grade firmware, device drivers, and diagnostic tools that run directly on bare metal. - Mechanical & thermal engineering for electronics by learning how structural stress, heat dissipation, thermal expansion, and mechanical shock affect the structural integrity and performance of PCBs and packages. - Cross-functional collaboration working alongside world-class architects, mechanical designers, package engineers, and software teams to understand how complex, large-scale chip ecosystems are built from scratch. Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer. This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded. ## About Tenstorrent University Jobs ## Company Overview - **One-liner**: Tenstorrent designs high‑performance RISC‑V CPUs and tensor‑based AI processors, and develops open‑source software to unlock the next wave of AI innovation. - **Entity Type**: Private (funding stage not disclosed in provided sources) - **Headquarters**: Multiple locations, including Santa Clara, California, USA and Toronto, Ontario, Canada; additional offices in Austin, Boston, Fort Collins, Belgrade, Warsaw, Bengaluru, Beijing, Pangyo, and Tokyo. - **Founded**: Not specified in provided sources - **Founders**: Not specified in provided sources ## Core Business - **Primary industry/industries**: Semiconductor design / AI hardware accelerators / RISC‑V CPU architecture - **Target customers**: B2B – hyperscalers, AI research labs, enterprises deploying AI inference and training workloads, and OEMs looking for alternative AI compute platforms - **Mission/purpose statement**: “We build RISC‑V CPUs, Tensor AI processors, and open‑source software to unlock the next innovations in AI.” (from [tenstorrent.com](https://tenstorrent.com/en/university)) ## Products & Services - **RISC‑V CPUs**: High‑performance, custom CPU cores designed from scratch for modern AI and general‑purpose workloads. - **Tensor AI Processors**: Accelerators that combine tensor compute with a novel data‑flow architecture to deliver orders‑of‑magnitude performance and efficiency improvements for machine learning. - **Open‑Source Software Stack**: Includes the **TT‑Metal** runtime, an **AI compiler**, **scale‑out fabric** software, and integrations with leading ML frameworks (PyTorch, etc.). All software is developed openly to enable transparency, modifiability, and community contributions. ## Market Standing - **Valuation/Market Cap**: Not publicly available in provided sources - **Key Metric**: Not disclosed; however, the company is actively hiring interns and new grads across hardware, software, and operations teams in more than ten global offices, signaling strong growth. - **Notable Investors/Partners**: Not specified in provided sources - **Growth Signals**: Hosts a dedicated university recruiting portal with 36 open intern/new‑grad roles (as of inspection); compensates interns at $50–$70/hour; expanding office footprint to Europe and Asia. ## Competitive Advantages - **Custom RISC‑V CPU**: Developed a high‑performance RISC‑V core entirely in‑house, differentiating from Arm or x86‑dependent competitors. - **Hardware‑Software Co‑Design**: The team includes architecture, silicon, firmware, compiler, and runtime engineers working together, enabling tightly integrated AI solutions. - **Open‑Source Commitment**: All software is open and modifiable, reducing vendor lock‑in and attracting developer‑first organizations. - **First‑Principles Culture**: Hiring emphasis on “first principle thinkers” and “flexible thinkers” who challenge existing paradigms. ## Strategic Focus - Continue building an **open AI hardware platform** that is affordable, transparent, and modifiable. - Invest in **RISC‑V ecosystem** and **open‑source tooling** to lower barriers for AI adoption. - Expand global engineering presence (new offices in Europe and Asia) and grow the university pipeline to feed future talent. - Advance **chiplet‑based design** and **scale‑out architectures** to address both inference and training at large scale. ## Why Work Here - **Cutting‑Edge Technology**: Work on bleeding‑edge AI silicon, RISC‑V CPUs, and compiler infrastructure from the ground up. - **Mentorship & Rotation**: Interns receive dedicated mentors and can move across digital design, verification, firmware, software, and systems engineering teams. - **Compensation**: Interns are paid $50–$70/hour (including variable compensation), which is highly competitive for the industry. - **Locations**: Hybrid roles available in Austin, Boston, Santa Clara, Toronto, Belgrade, and Bengaluru, with many teams offering flexible work modes. - **Culture**: Emphasizes curiosity, collaboration, and a commitment to solving hard problems; described as “open” and “first‑principles.” - **Career Acceleration**: Opportunity to work on full‑stack projects from architecture to production deployment, with exposure to the entire AI compute pipeline. ## Sources 1. [tenstorrent.com (University page)](https://tenstorrent.com/en/university) 2. [tenstorrent.com (Careers / University)](https://tenstorrent.com/en/careers/university) 3. [Greenhouse – Tenstorrent University Jobs](http://job-boards.greenhouse.io/tenstorrentuniversity) 4. [Greenhouse – Software Intern AI Compilers](https://job-boards.greenhouse.io/tenstorrentuniversity/jobs/4968219007) 5. 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