---
title: 'Wire Bond-Manufacturing Engineer at Lumilens'
canonical: 'https://feeny.ai/job/wire-bond-manufacturing-engineer-lumilens-singapore-nx50j99gfk7q'
type: 'job'
last_seen: '2026-09-07'
---

# Wire Bond-Manufacturing Engineer at Lumilens

- **Company:** Lumilens
- **Location:** Singapore
- **Employment:** full-time
- **Posted:** 2026-07-28
- **Last confirmed live:** 2026-09-07
- **Apply:** https://jobs.ashbyhq.com/lumilens/95340145-9ea4-4b4e-971f-0fcc9e5db23c

## Job description

## ABOUT LUMILENS

At Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.

## JOB DESCRIPTION

We are seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team within Semiconductor Assembly & Test. In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI).

## KEY RESPONSIBILITIES

Process Engineering

- Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems
- Establish and maintain process specifications, bond recipes, work instructions, and control plans
- Lead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects
- Support NPI by developing new wire bond process flows, including DOE-driven process windows
- Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)
- Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving

Equipment Engineering

- Own the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)
- Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour)
- Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders
- Collaborate with equipment vendors for technical escalations and upgrades
- Plan preventive maintenance and spare parts strategy

Quality & Reliability

- Partner with Quality and Reliability teams on failure analysis for field and customer returns
- Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions
- Ensure compliance with IPC/JEDEC standards and customer requirements

Cross-Functional Collaboration

- Work closely with Product/Design Engineering for bond pad layout and substrate design
- Partner with Process Integration, Test, and Quality to resolve yield and reliability issues
- Support cost reduction initiatives and train operators/technicians on process and equipment

Documentation & Compliance

- Maintain process control documents, FMEAs, control plans, and traceability as per Lumilens quality management systems (ISO 9001 / IATF 16949 / AS9100)
- Support internal and customer audits related to wire bond processes and equipment

## REQUIREMENTS

Required:

- Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering
- 3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)
- Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes
- Experience with DOE, SPC, and root cause/CAPA methods
- Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)
- Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)
- Strong analytical, troubleshooting, and cross-functional communication skills
- Willingness to support shift or production floor needs

Preferred:

- Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging
- Exposure to copper wire bonding and associated process/reliability considerations
- Experience with fine-pitch wire bonding (<50 µm) and multi-tier/stacked die bonding
- Six Sigma Green/Black Belt certification
- Familiarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems
- Cleanroom manufacturing experience

## WHAT WE OFFER

- Competitive salary and benefits package
- The opportunity to work on cutting-edge semiconductor packaging technology
- A collaborative, cross-functional engineering environment
- Career growth within the manufacturing/process engineering track

Lumilens is an equal opportunity employer committed to diversity and inclusion.

## About Lumilens

## Company Overview
- **One-liner**: Lumilens designs and manufactures next-generation photonic interconnects to massively scale AI compute infrastructure.
- **Entity Type**: Private (Series B – led by Accton Technology; prior Series A of $30M from Mayfield and Spark Capital)
- **Headquarters**: San Jose, California, USA
- **Founded**: 2024
- **Founders**: Ankur Singla (CEO), Samuel Liu (VP Products), Ritesh Kapahi (VP/GM India), Dave Friedman (VP Operations)

## Core Business
- **Primary industry**: Photonics / optical interconnects for AI data centers
- **Target customers**: Large-scale AI providers and hyperscale data center operators (B2B, Enterprise)
- **Mission**: “To rapidly innovate in photonics and connectivity architectures to enable the massive scaling of compute infrastructure required to deliver the full potential of AI.”

## Products & Services
- **Photonic Interconnects (Scale-Out & Scale-Up)**: High-density, low-latency optical links that enable cluster-to-cluster and direct GPU-to-GPU connectivity. Supports 100x higher quantity of GPU direct connections than legacy approaches.
  - *Type*: Hardware (silicon photonics modules) + integrated manufacturing
- **Automated Manufacturing Platform**: End-to-end custom robotics and AI-optimized production processes to maximize yield, quality, and supply-chain flexibility.
  - *Type*: Service / Manufacturing capability (in-house)

## Market Standing
- **Valuation/Market Cap**: Not publicly available
- **Key Metric**: Total funding – $30M Series A (June 2024); Series B led by Accton Technology (amount undisclosed)
- **Notable Investors/Partners**: Mayfield, Spark Capital, Accton Technology
- **Growth Signals**:
  - Headcount grew 287% YoY (54 employees as of mid-2025) [linkedin.com]
  - Operations in 8 countries: USA, India, Thailand, Poland, Singapore, Czechia, South Korea, Malaysia
  - 48 active job postings (+23.1% monthly growth) [linkedin.com]
  - Leadership team with deep photonics/networking experience from Cisco, Juniper, Meta, Lumentum, Coherent

## Competitive Advantages
- **In-house silicon photonics development** – full control over design and supply chain
- **Systems-level expertise** – can partner on both scale-out and scale-up architectures
- **Manufacturing automation** – robotics + AI processes enable faster innovation, higher quality, and predictable deployment
- **Standards-based interconnects** – easy deployment into existing infrastructure
- **Manufacturing anywhere** – supply-chain continuity and scalable manufacturing

## Strategic Focus
- Enable massive scaling of AI infrastructure by overcoming electrical/copper limitations with advanced photonics
- Disaggregate GPUs to mitigate power and density challenges in data centers
- Expand manufacturing capacity globally and continue to automate production
- Align product roadmap with industry standards to accelerate adoption

## Why Work Here
- **Culture**: Fast-paced startup environment with deep technical expertise; mission-driven focus on enabling the future of AI
- **Work policy**: In-office (HQ San Jose, CA with Bengaluru, India as major hub) [builtin.com]
- **Perks**: Opportunity to work on cutting-edge photonics, robotics, and AI manufacturing; direct impact on world’s largest AI infrastructure
- **Engineering culture**: Heavy emphasis on silicon photonics, hardware design, robotics automation, and system-level architecture. Teams are led by veterans from Cisco, Juniper, Meta, Lumentum, Coherent.

## Sources
1. [lumilens.com](https://lumilens.com/) – Company overview, mission, leadership, products
2. [lumilens.com/company](https://lumilens.com/company) – Vision, investors, leadership team
3. [builtin.com](https://builtin.com/company/lumilens) – Career page, employee count, year founded, office policy
4. [linkedin.com](https://www.linkedin.com/company/lumilens) – Headcount, funding details, geographic/department breakdown, job trends, talent sources
5. [jobs.ashbyhq.com](https://jobs.ashbyhq.com/lumilens) – Current job openings (48 listings)

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