Advanced Packaging & Integration Lead at Equal1 (Dublin, Ireland)Advanced Packaging & Integration Lead

We are seeking an experienced Advanced Packaging & Integration Lead to join our team and develop packaging solutions for multi-chip silicon spin-qubit devices within a scalable quantum system. In this role, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution.

Main Duties and Responsibilities

• Drive the high-level strategy and architectural design of 3D integrated circuits and multi-chip quantum modules.
• Develop advanced packaging solutions using TSVs, fine-pitch micro-bumps, and flip-chip bonding.
• Ensure packaging architectures and interconnects can withstand thermal cycling down to the millikelvin regime without delamination or loss of reliability.
• Contribute to early-stage architecture and co-design activities, ensuring the advanced packaging subsystem scales with the requirements of the overall quantum system.
• Develop simulation approaches to evaluate packaging and process options at DC and RF frequencies, including signal integrity, power integrity, thermal performance, and mechanical stress.
• Balance R&D execution with a strong focus on yield improvement, failure analysis, manufacturability, and long-term hardware reliability.
• Own relevant technical activities with external suppliers, OSATs, and research partners.
• Support the transfer of novel packaging designs into external manufacturing and advanced packaging lines.